CompaqメーカーNX8220の使用説明書/サービス説明書
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Main tenan ce and Ser vice Gu id e HP Co mpaq nx8 2 20 and nc8 2 30 Notebook P Cs HP Compaq n w8 2 4 0 Mobile W orks tati on Doc ument P art Number : 3 7 2 65 8-001 Mar c h 2005 This guide is a troubleshooting reference used for maintaining and servicing the notebook.
© Copyright 2005 He wlett-Packard De velopment Company , L.P . Microsoft and W indo ws are U.S. re gistered trademarks of Microsoft Corporation. Intel and Pentium are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries.
Maintenance and Serv ice Guide iii Cont en ts 1 Product Description 1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–2 1.2 Resetting the Notebook . . . . . . . . . . . . . . . . . . . . . . . 1–5 1.3 Power Management .
iv Maintenance and Servi c e Guide Cont ent s 5 Removal and Replacement Procedures 5.1 Serial Number . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–2 5.2 Disassembly Sequence Chart . . . . . . . . . . . . . . . . . . 5–3 5.3 Preparing the Notebook for Di sassembly .
Maintenance and Serv ice Guide 1–1 1 Product D esc ription The HP Compaq nx8220 and nc8230 Notebook PCs and HP Compaq nw8240 Mobile W orkstation offer adv anced modularity , Intel® Pentium® M processors, and extensi ve multimedia support.
1–2 Maintenance and Service Guide Produc t Desc ripti on 1.1 F e a t u r e s ■ Intel Pentium M 2.13-, 2.00-, 1.86-, 1.73-, or 1.60-GHz processors, v arying by notebook model ■ The follo wing displays are av ailable, varying b y notebook model: ❏ 15.
Pr oduct Des cr iption Maintenance and Serv ice Guide 1–3 ■ External 90-watt A C adapter with 3-wire power cord ■ 8-cell Li-Ion battery pack ■ Stereo speakers ■ V olume up, volume mute, and .
1–4 Maintenance and Service Guide Produc t Desc ripti on ■ Support for the follo wing optical dri ves: ❏ D VD-RO M dri ve ❏ D VD+R W/R and CD-R W Combo Drive ❏ D VD/CD-R W Combo Driv e ■ Connectors: ❏ Infrared (full-featured models only) ❏ Audio-out (headphone) ❏ Audio-in (microphone) ❏ Uni versal Serial Bus (USB) v .
Pr oduct Des cr iption Maintenance and Serv ice Guide 1–5 1 .2 Reset tin g t he Notebook If the notebook you are servicing has an unkno wn password, follo w these steps to clear the password. These steps also clear CMOS: 1. Prepare the notebook for disassembly (refer to Section 5.
1–6 Maintenance and Service Guide Produc t Desc ripti on 1 .4 External C ompon ents The external components on the front of the notebook are sho wn belo w and described in T able 1-1.
Pr oduct Des cr iption Maintenance and Serv ice Guide 1–7 3B a t t e r y l i g h t ■ Amber : A battery pack is charging. ■ Green: A batter y pack is close to full charge capacity . ■ Blinking amber : A battery pack that is the only av ailable power source has reached a low-battery condition.
1–8 Maintenance and Service Guide Produc t Desc ripti on The external components on the right side of the notebook are sho wn belo w and described in T able 1-2.
Pr oduct Des cr iption Maintenance and Serv ice Guide 1–9 The external components on the left side of the notebook are sho wn belo w and described in T able 1-3. Lef t -Sid e Comp on en ts Ta b l e 1 - 3 Left-Side Components Item Component Function 1 Security cable slot Attaches an op tional security cable to the notebook.
1–10 Maintenance and Serv ice Guide Produc t Desc ripti on 5 V ent Enables airflo w to cool internal components. Ä T o pre vent ov erheating, do not obstruct vents. Do not allow a hard surf ace, such as a printer , or a soft surf ace, such as pillo ws or thick rugs or clothing, to bloc k airflow .
Pr oduct Des cr iption Maintenance and Serv ice Guide 1–11 The external components on the rear panel of the notebook are sho wn belo w and described in T able 1-4. Rea r P an e l Co mp o n en t s T able 1-4 Rear P anel Components Item Component Function 1 Primar y batter y bay Holds the primar y batter y pack.
1–12 Maintenance and Serv ice Guide Produc t Desc ripti on The standard ke yboard components of the notebook are sho wn belo w and described in T able 1-5.
Pr oduct Des cr iption Maintenance and Serv ice Guide 1–13 T able 1-5 Standard K eyboard Components Item Component Function 1 Function ke ys ( f3 , f4 , f8–f11 ) Ex ecute frequently used system functions when pressed in combination with the fn key .
1–14 Maintenance and Serv ice Guide Produc t Desc ripti on The notebook top components are sho wn belo w and described in T able 1-6. T op Compone nts, P art 1 T able 1-6 T op Components, P art 1 Item Component Function 1 Displa y lid s witch Initiates st andby if the displa y is closed while the notebook is turned on.
Pr oduct Des cr iption Maintenance and Serv ice Guide 1–15 3 Inf o Center button Enables y ou to vie w a list of commonly used software solutions . 4 Wireless button Wireless light Enables and disab l es wireless LAN or Bluetooth® de vices (select models only).
1–16 Maintenance and Serv ice Guide Produc t Desc ripti on The notebook top components are continued belo w and described in T able 1-7. T op Compone nts, P art 2.
Pr oduct Des cr iption Maintenance and Serv ice Guide 1–17 T able 1-7 T op Components, P art 2 Item Component Function 1 P ointing stick (select models only) Mov e s the pointer and selects or activates items on the screen. 2 Speakers Produce stereo sound.
1–18 Maintenance and Serv ice Guide Produc t Desc ripti on The external components on the bottom of the notebook are sho wn belo w and described in T able 1-8. Bottom Components Ta b l e 1 - 8 Bottom Components Item Component Function 1 Primar y batter y ba y Holds the primar y batter y pack.
Pr oduct Des cr iption Maintenance and Serv ice Guide 1–19 3 T ra ve l batter y connector Connects an optional trav el batter y . 4 Memory module compar tment Contains one memor y module slot. 5 Hard drive ba y Holds the primar y hard drive. 6 V ents (5) Enable airflo w to cool internal components.
1–20 Maintenance and Serv ice Guide Produc t Desc ripti on 1. 5 D e s i g n O v e r v i e w This section presents a design ov ervie w of ke y parts and features of the notebook. Refer to Chapter 3, “Illustrated Parts Catalog, ” to identify replacement parts, and Chapter 5, “Remov al and Replacement Procedures, ” for disassembly steps.
Maintenance and Serv ice Guide 2–1 2 T roubleshooting Å W ARN ING: Only author i z ed technic ians trained b y HP should repair this equipment . All trou bleshooting and r epair procedur es ar e detailed to allo w only su bass embly-/module-lev el r epair .
2–2 Maintenance and Service Guide T roubleshooting Acce ssing Co mputer Setup The information and settings in Computer Setup are accessed from the File , Security , To o l s , and Advanced menus. 1. Open Computer Setup by turning on or restarting the tablet PC.
T roubleshooting Maintenance and Serv ice Guide 2–3 4. T o confirm the restoration, press f10 . 5. Select File > Save changes and exit , and then follo w the instructions on the screen. When the computer restarts, the factory settings are restored, and any identif ication information you have entered is sa ved.
2–4 Maintenance and Service Guide T roubleshooting Selectin g from the Securit y Menu Ta b l e 2 - 2 Security Menu Select T o Do This Administrator pass word Enter , change , or delete an HP Administrator pass word. P ower-on pass word Enter, change , or delete a pow er-on pass word.
T roubleshooting Maintenance and Serv ice Guide 2–5 Selectin g from the T ools Menu Ta b l e 2 - 3 To o l s M e n u Select T o Do This HDD Self T est options Run a quick or comprehensiv e self-test on any hard drive in the system. Battery Information View inf or matio n about any battery packs in the notebook.
2–6 Maintenance and Service Guide T roubleshooting Selec ting from the Adv anced Menu Ta b l e 2 - 4 Adv anced Menu Select T o Do This Language (or press f2 ) Change the Computer Setup language. Boot options ■ Enab le/Disable MultiBoot, which sets a startup sequence that can include most bootable de vices and media in the system.
T roubleshooting Maintenance and Serv ice Guide 2–7 2.2 T roubl eshooting Flo wc h ar ts Ta b l e 2 - 5 T roub leshooting Flowc harts Overview Flowchart Description 2.1 “Flowchart 2.1—Initial T roubleshooting” 2.2 “Flowchart 2.2—No Po wer , P ar t 1” 2.
2–8 Maintenance and Service Guide T roubleshooting Flowchart Description 2.14 “Flowchart 2.14—No OS Loading, Optical Dr ive” 2.15 “Flowchart 2.15—No Audio , Part 1” 2.16 “Flowchart 2.16—No Audio , Part 2” 2.17 “Flowchart 2.17—Nonfunctioning Device” 2.
T roubleshooting Maintenance and Serv ice Guide 2–9 Flo wc h art 2. 1—Initi al T roubl eshooting Connecting to network or modem? Begin troubleshooting. Is there power? Is the OS loading? Is there video? (no boot) Is there sound? Beeps, LEDs, or error messages? Keyboard/ pointing device working? Go to “Flowchart 2.
2–10 Maintenance and Serv ice Guide T roubleshooting Flo wc h art 2.2—N o P o w er , P ar t 1 1. Reseat the power cables in the docking device and at the AC outlet. 2. Ensure the AC power source is active. 3. Ensure that the power strip is working.
T roubleshooting Maintenance and Serv ice Guide 2–11 Flo wc h art 2.3—No P o w e r , P ar t 2 Continued from “Flowchart 2.2—No P ower , Pa r t 1 . ” Visually check for debris in batter y socket and clean if necessary . Done N Y Po we r o n? Check battery by recharging it, moving it to another notebook, or replacing it.
2–12 Maintenance and Serv ice Guide T roubleshooting Flo wc h art 2.4—N o P o w er , P ar t 3 Continued from “Flowchart 2.3—No P ower , Pa r t 2 . ” Reseat AC adapter in notebook and at pow er sou rce . Internal or external AC adapter? Done Done Done Done Po we r o n? Pow e r o n? Po we r o n? Plug directly into AC outlet.
T roubleshooting Maintenance and Serv ice Guide 2–13 Flowc ha r t 2.5— No P ow e r , P ar t 4 Y N Continued from “Flowchart 2.4—No P ower , Pa r t 3 . ” Reseat loose components and boards and replace damaged items. Open notebook. Loose or damaged parts? Y Close notebook and retest.
2–14 Maintenance and Serv ice Guide T roubleshooting Flo wc h art 2.6—N o Video, P ar t 1 A N Stand-alone or docking device? No video. Replace the following one at a time . T est after each replacement. 1. Cable between notebook and not ebook display (if applicable) 2.
T roubleshooting Maintenance and Serv ice Guide 2–15 Flo wc h art 2.7—N o Video, P ar t 2 Y N Continued from “Flowchart 2.6—No Video , Pa r t 1 .
2–16 Maintenance and Serv ice Guide T roubleshooting F l o w cha rt 2 .8— Non fu n cti on i ng Do ck i ng De vi c e (if applic able) Y N Reseat power cord in docking device and power outlet. N Check voltage setting on docking device. Reset monitor cable connector at docking device.
T roubleshooting Maintenance and Serv ice Guide 2–17 Flo wc h art 2.9—N o Opera ting Sy stem (OS) Loading No OS loading from hard drive, go to “Flowchart 2.10—No OS Loading, Hard Drive, P ar t 1. ” Reseat power cord in docking device and power outlet.
2–18 Maintenance and Serv ice Guide T roubleshooting Flo wc h art 2. 1 0—N o OS Loadin g , Hard Driv e, Pa r t 1 Go to “Flowchart 2.17—No nfunctioning Device . ” Y Done N OS not loading from hard drive. Nonsystem disk message? Go to “Flowchart 2.
T roubleshooting Maintenance and Serv ice Guide 2–19 Flowc h ar t 2. 1 1—No OS L oa di n g , H ard Drive, Pa r t 2 Load OS using Operating System disc (if applicable). Continued from “Flowchart 2.10—No OS Loading, Hard Drive, P ar t 1. ” Reseat hard drive.
2–20 Maintenance and Serv ice Guide T roubleshooting Flo wc h art 2. 1 2—N o OS Loading , H ard Driv e, Pa r t 3 Y System files on hard drive? Continued from “Flowchart 2.11—No OS Loading, Hard Drive, P ar t 2. ” Clean virus. Done N Install OS and reboot.
T roubleshooting Maintenance and Serv ice Guide 2–21 Flo wc h art 2. 1 3—N o OS Loadin g, Disk ette Drive Replace the following components individually , retesting after each replacement: ■ Diskette drive ■ System board Done Y N Reseat diskette drive.
2–2 2 Maintenance and Servi c e Guide T roubleshooting Flo wc h art 2. 1 4 —No OS Loadin g , Opti cal Driv e Y Done N Bootable disc in drive? Disc in drive? No OS loading from CD-ROM or DVD-ROM drive. Install bootable disc and reboot notebook. Go to “Flowchart 2.
T roubleshooting Maintenance and Serv ice Guide 2–2 3 Flo wc h ar t 2. 1 5—No Au dio, P ar t 1 No audio. N Notebook in docking device (if applicable)? Internal audio? Audio? Done Undock Audio? Done T urn up audio internally or externally . Go to “Flowchart 2.
2–2 4 Maintenance and Servi c e Guide T roubleshooting Flo wc h art 2. 1 6—N o Audio, P art 2 YN Continued from “Flowchart 2.15—No Audio , Pa r t 1 . ” Reload audio drivers. Audio driver in OS configured? Audio? Y Y Y N N N Correct drivers for application? Connect to external speaker .
T roubleshooting Maintenance and Serv ice Guide 2–25 Flo wc har t 2. 1 7—Nonfunctionin g De vice Done Any physical device detected? Y N Unplug the nonfunctioning device from the notebook and inspect cables and plugs for bent or broken pins or other damage.
2–2 6 Maintenance and Servi c e Guide T roubleshooting Flo wc h art 2. 1 8—N onfunc tioning K e yboard Y N Keyboard operating properly? Keyboard not operating properly . External device works? Replace system board. Replace system board. Connect notebook to good external keyboard.
T roubleshooting Maintenance and Serv ice Guide 2–2 7 Flo wc h art 2. 1 9—Nonfun ctionin g P ointin g De vice Y N Pointing device not operating properly . External device works? Replace system board. Replace system board. Connect notebook to good external pointing device.
2–2 8 Maintenance and Servi c e Guide T roubleshooting Flo wc h art 2.20—No N et w ork/Modem Conne ction Y Disconnect all power from the notebook and open. No network or modem connection. N Done Digital line? Network or modem jack active? Replace jack or have jack activated.
Maintenance and Serv ice Guide 3–1 3 I llustra ted P ar ts C a talog This chapter provides an illustrated parts breakdo wn and a reference for spare part numbers. 3. 1 S erial N umber Location When ordering parts or requesting information, provide the notebook serial number and model number located on the bottom of the notebook.
3–2 Maintenance and Service Guide Illustrated P ar ts Catalog 3.2 Notebook Major C ompon ents Notebook Major C omponents.
Illustr ated P ar ts Catalog Maintenance and Serv ice Guide 3–3 Ta b l e 3 - 1 Spare P arts: Notebook Major Components Item Description Spare P art Number 1 Display assemb lies (include wireless antenna boards and cables) 15.4-inch, WSXGA, TFT 15.4-inch, WXGA, TFT 15.
3–4 Maintenance and Service Guide Illustrated P ar ts Catalog Notebook Major C omponents.
Illustr ated P ar ts Catalog Maintenance and Serv ice Guide 3–5 Ta b l e 3 - 1 Spare P arts: Notebook Major Components (Continued) Item Description Spare P art Number 3 Ke yboards, without pointing .
3–6 Maintenance and Service Guide Illustrated P ar ts Catalog Notebook Major C omponents.
Illustr ated P ar ts Catalog Maintenance and Serv ice Guide 3–7 Ta b l e 3 - 1 Spare P arts: Notebook Major Components (Continued) Item Description Spare P art Number 8 Mini PCI communications car ds 802.11b/g Mini PCI modem, for use in most of the world 802.
3–8 Maintenance and Service Guide Illustrated P ar ts Catalog Notebook Major C omponents.
Illustr ated P ar ts Catalog Maintenance and Serv ice Guide 3–9 Ta b l e 3 - 1 Spare P arts: Notebook Major Components (Continued) Item Description Spare P art Number Miscellaneous Plastics Kit 3826.
3–10 Maintenance and Serv ice Guide Illustrated P ar ts Catalog Notebook Major C omponents.
Illustr ated P ar ts Catalog Maintenance and Serv ice Guide 3–11 Ta b l e 3 - 1 Spare P arts: Notebook Major Components (Continued) Item Description Spare P art Number 14 System boards With 128-MB v.
3–12 Maintenance and Serv ice Guide Illustrated P ar ts Catalog Notebook Major C omponents.
Illustr ated P ar ts Catalog Maintenance and Serv ice Guide 3–13 Ta b l e 3 - 1 Spare P arts: Notebook Major Components (Continued) Item Description Spare P art Number 19 Battery packs 8-cell, 4.
3–14 Maintenance and Serv ice Guide Illustrated P ar ts Catalog 3. 3 M iscell aneous Plas tic s Kit T able 3-2 Spare P art Number 382691-001 Item Description 1 Hard drive co ver (includes 2 captiv e.
Illustr ated P ar ts Catalog Maintenance and Serv ice Guide 3–15 3.4 Miscell aneous C ab le Kit Ta b l e 3 - 3 Spare P art Number 389014-001 Item Description 1 LED board cable 2 Bluetooth cable 3 T .
3–16 Maintenance and Serv ice Guide Illustrated P ar ts Catalog 3.5 M a s s S to ra g e D e vi c es Ta b l e 3 - 4 Spare P art Number Information Item Description Spare P art Number 1 Hard drives (i.
Illustr ated P ar ts Catalog Maintenance and Serv ice Guide 3–17 3.6 Miscell aneous (N ot I llustra ted) Ta b l e 3 - 5 Spare P art Information Description Spare P art Number Adjustable notebook sta.
3–18 Maintenance and Serv ice Guide Illustrated P ar ts Catalog P ower suppl y , 90 watt, slim line profile 374791-001 Pow e r c o rd s Fo r u s e i n : A ustralia and Ne w Zealand 246959-011 Belgiu.
Illustr ated P ar ts Catalog Maintenance and Serv ice Guide 3–19 3.7 Sequen tial P ar t N umber Listin g Screw Kit (includes the f ollowing screws; ref er to Appendix C , “Screw Listing, ” for more inf or mation on specifications and usage) 382692-001 ■ He x sock et HM5.
3–20 Maintenance and Serv ice Guide Illustrated P ar ts Catalog 246959-061 P ower cord f or use in Italy 246959-081 P ower cord f or use in Denmark 246959-201 P ower cord f or use in Brazil 246959-2.
Illustr ated P ar ts Catalog Maintenance and Serv ice Guide 3–21 373033-002 802.11a/b/g combination WLAN Mini PCI communications card f or use internationally 373033-291 802.
3–2 2 Maintenance and Servi c e Guide Illustrated P ar ts Catalog 378203-051 K eyboard, with point ing stick f or use in F rance 378203-061 K eyboard, with poi nting stick f or use in Italy 378203-0.
Illustr ated P ar ts Catalog Maintenance and Serv ice Guide 3–2 3 378203-AD1 K eyboard, with pointing stick f or use in K orea 378203-BA1 K eyboard, with point ing stick f or use in Slovenia 378203-BB1 K eyboard, with point ing stick f or use in Israel 378203-DD1 K eyboard, with pointing stick f or use in Iceland 378220-001 Intel P entium M 1.
3–2 4 Maintenance and Servi c e Guide Illustrated P ar ts Catalog 382677-001 A udio board (includes audio board cable and USB board cable) 382678-001 T op cov er f or use only with HP Compaq nc8230 .
Illustr ated P ar ts Catalog Maintenance and Serv ice Guide 3–25 382692-001 Miscellaneous Screw Kit 382693-001 Push button module 384132-001 Base enclosure f or use only with HP Compaq nw8240 models.
3–2 6 Maintenance and Servi c e Guide Illustrated P ar ts Catalog 385548-201 K eyboard, without poin ting stick f or use in Brazil 385548-211 K eyboard, without poin ting stick f or use in Hungar y .
Maintenance and Serv ice Guide 4–1 4 Remo val and Repla cemen t Preliminaries This chapter provides essential information for proper and safe remov al and replacement service.
4–2 Maintenance and Service Guide Remo val and Replaceme nt Pr eliminar ies 4.2 Ser vice Consi dera tions The follo wing sections include some of the considerations that you should keep in mind during disassembly and assembly procedures.
Remo val and Replacement Pr eliminaries Maintenance and Serv ice Guide 4–3 4. 3 P r e v ent ing Damage to Re mo v able Dr i v es Remov able driv es are fragile components that must be handled with care.
4–4 Maintenance and Service Guide Remo val and Replaceme nt Pr eliminar ies 4.4 Pre v enting Elec trosta tic D ama ge Many electronic components are sensiti ve to electrostatic discharge (ESD). Circuitry design and structure determine the degree of sensiti vity .
Remo val and Replacement Pr eliminaries Maintenance and Serv ice Guide 4–5 4.5 P a c k a ging an d T ranspor ting Precautions Use the follo wing grounding precautions when packaging and transporting equipment: ■ T o av oid hand contact, transport products in static-safe containers, such as tubes, bags, or boxes.
4–6 Maintenance and Service Guide Remo val and Replaceme nt Pr eliminar ies 4.6 W orksta tion Precautions Use the follo wing grounding precautions at workstations: ■ Cov er the workstation with appro ved static-shielding material (refer to T able 4-2, “Static-Shielding Materials” ).
Remo val and Replacement Pr eliminaries Maintenance and Serv ice Guide 4–7 4.7 Groundin g Eq uipm ent and Methods Grounding equipment must include either a wrist strap or a foot strap at a grounded workstation. ■ When seated, wear a wrist strap connected to a grounded system.
4–8 Maintenance and Service Guide Remo val and Replaceme nt Pr eliminar ies T able 4-1 sho ws ho w humidity af fects the electrostatic voltage le vels generated b y different acti vities. T able 4-2 lists the shielding protection provided b y antistatic bags and floor mats.
Maintenance and Serv ice Guide 5–1 5 Remo val and Repla cemen t Procedur es This chapter provides remo v a l and replacement procedures. There are 78 scre ws and scre w locks, in 15 dif ferent sizes, that may hav e to be removed, replaced, or loosened when servicing the notebook.
5–2 Maintenance and Service Guide Remo val and Replaceme nt Pr ocedur es 5 . 1 Serial N umber Report the notebook serial number to HP when requesting information or ordering spare parts.
Remo val and Replacement Pr ocedures Maintenance and Serv ice Guide 5–3 5 .2 Disassembl y Sequence Chart Use the chart belo w to determine the section number to be referenced when removing notebook components. Disassembl y Sequence Chart Section Description # of Screws Remo ved 5.
5–4 Maintenance and Service Guide Remo val and Replaceme nt Pr ocedur es Section Description # of Screws Remo ved 5.13 Heat sink 4 loosened 5.14 Processor 1 loosened 5.
Remo val and Replacement Pr ocedures Maintenance and Serv ice Guide 5–5 5 .3 Preparing t he N otebook for Disasse mbl y Before you begin an y remov al or installation procedures: 1. Shut down the notebook. If you are unsure whether the notebook is of f or in hibernation, turn the computer on, and then shut it do wn through the operating system.
5–6 Maintenance and Service Guide Remo val and Replaceme nt Pr ocedur es 4. Remove the battery pack b y follo wing these steps: a. T urn the notebook upside down with the rear panel to ward you. b . Slide and release the battery pack lock latch 1 to the right.
Remo val and Replacement Pr ocedures Maintenance and Serv ice Guide 5–7 5 .4 H ard Driv e 1. Prepare the notebook for disassembly ( Section 5.3 ). 2. Loosen the 2 PM2.0×4.0 screws 1 that secure the hard dri ve cov er to the notebook. 3. Lift the left side of the hard drive co ver and swing it to the right 2 .
5–8 Maintenance and Service Guide Remo val and Replaceme nt Pr ocedur es 5. Loosen the PM2.5×13.0 spring-loaded hard driv e retention scre w 1 . 6. Grasp the mylar tab 2 on the left side of the hard driv e and slide the hard dri ve to the right 3 to disconnect it from the system board.
Remo val and Replacement Pr ocedures Maintenance and Serv ice Guide 5–9 8. Remove the follo wing: 1 T wo PM3.0×5.0 screws 2 T wo PM3.0×4.0 screws 3 T wo PM1.5×4.0 screws 9. Lift the frame straight up 4 to remove if from the hard dri ve. 10. Remove the hard dri ve connector 5 from the hard driv e.
5–10 Maintenance and Serv ice Guide Remo val and Replaceme nt Pr ocedur es 5 .5 Notebook Feet The notebook feet are adhesi ve-back ed rubber pads. The feet are included in the Miscellaneous Plastics Kit, spare part number 382691-001.
Remo val and Replacement Pr ocedures Maintenance and Serv ice Guide 5–11 5. 6 M u l t i B ay I I D evi c e 1. Prepare the notebook for disassembly ( Section 5.3 ). 2. Position the notebook with the left side toward you. 3. If it is installed, remove the T8M2.
5–12 Maintenance and Serv ice Guide Remo val and Replaceme nt Pr ocedur es 5 .7 External Memor y Modul e 1. Prepare the notebook for disassembly (refer to Section 5.
Remo val and Replacement Pr ocedures Maintenance and Serv ice Guide 5–13 3. Loosen the PM2.0×4.0 screw 1 that secures the memory module compartment cov er to the notebook. 4. Lift the right side of the cover up and swing it to the left 2 . 5. Remove the memory module compartment co ver .
5–14 Maintenance and Serv ice Guide Remo val and Replaceme nt Pr ocedur es 6. Spread the retaining tabs 1 on each side of the memory module socket to release the memory module. (The side of the module opposite the socket rises aw ay from the notebook.
Remo val and Replacement Pr ocedures Maintenance and Serv ice Guide 5–15 5 .8 Bluetoot h Board 1. Prepare the notebook for disassembly (refer to Section 5.3 ). 2. Position the notebook with the right side toward you. 3. Loosen the PM1.5×3.0 screw 1 that secures the Bluetooth cov er to the notebook.
5–16 Maintenance and Serv ice Guide Remo val and Replaceme nt Pr ocedur es 6. Remove the t wo PM1.5×3.0 scre ws 1 that secure the Bluetooth board to the Bluetooth cov er . 7. Remove the Bluetooth board 2 from the co ver . Re mo v ing the Bluetooth Boar d Co ver Re verse the abo v e procedure to install a Bluetooth board.
Remo val and Replacement Pr ocedures Maintenance and Serv ice Guide 5–17 5. 9 Ke yb o a rd Ke yboar d Spare P ar t Number Information With pointing stick Belgium Brazil Czech Repub lic Denmark F ran.
5–18 Maintenance and Serv ice Guide Remo val and Replaceme nt Pr ocedur es 1. Prepare the notebook for disassembly ( Section 5.3 ). 2. Position the notebook with the front panel toward you.
Remo val and Replacement Pr ocedures Maintenance and Serv ice Guide 5–19 3. Remove the t wo T8M2.0×9.5 screws that secure the ke yboard to the notebook.
5–20 Maintenance and Serv ice Guide Remo val and Replaceme nt Pr ocedur es 4. T urn the notebook display-side up with the front panel to ward you. 5.
Remo val and Replacement Pr ocedures Maintenance and Serv ice Guide 5–21 8. Release the zero insertion force (ZIF) connector 1 to which the ke yboard cable is connected and disconnect the ke yboard cable 2 from the system board. ✎ Step 9 applies to models with keyboards with pointing sticks.
5–2 2 Maintenance and Servi c e Guide Remo val and Replaceme nt Pr ocedur es 5. 1 0 Swi t c h C ove r ✎ Both switch cov er spare part kits include the LED board and LED board cable. 1. Prepare the notebook for disassembly ( Section 5.3 ). 2. Remove the ke yboard ( Section 5.
Remo val and Replacement Pr ocedures Maintenance and Serv ice Guide 5–2 3 5. T urn the notebook display-side up with the front panel to ward you. 6. Open the notebook as far as possible. 7. Use a flat-blade screwdri v er to lift up the left and right hinge cov er sections of the switch cov er 1 to detach it from the notebook.
5–2 4 Maintenance and Servi c e Guide Remo val and Replaceme nt Pr ocedur es 9. Disconnect the LED board cable 1 from the system board. 10. Remove the switch co ver 2 .
Remo val and Replacement Pr ocedures Maintenance and Serv ice Guide 5–25 ✎ If necessary , perform the following steps to remo ve the LED board from the switch cov er . 11. T urn the switch cov er upside down. 12. Remove the six PM1.5×3.0 scre ws 1 that secure the LED board to the switch cov er .
5–2 6 Maintenance and Servi c e Guide Remo val and Replaceme nt Pr ocedur es 5. 1 1 R TC B a t t e r y ✎ The R TC battery is included in the Miscellaneous Plastics Kit, spare part number 382691-001. 1. Prepare the notebook for disassembly ( Section 5.
Remo val and Replacement Pr ocedures Maintenance and Serv ice Guide 5–2 7 5. 1 2 Th e r m a l Pl a t e 1. Prepare the notebook for disassembly ( Section 5.
5–2 8 Maintenance and Servi c e Guide Remo val and Replaceme nt Pr ocedur es 3. Disconnect the fan cable from the system board 1 . ✎ The follo wing scre ws should be loosened and remov ed, then installed, in the 1, 2, 3, 4, 5, 6, 7, 8 sequence stamped on the thermal plate.
Remo val and Replacement Pr ocedures Maintenance and Serv ice Guide 5–29 5 . 1 3 Hea t Sink 1. Prepare the notebook for disassembly ( Section 5.3 ). 2.
5–30 Maintenance and Servi ce Guide Remo val and Replaceme nt Pr ocedur es ✎ The follo wing scre ws should be loosened and installed in the 1, 2, 3, 4 sequence stamped on the heat sink. 4. Loosen the four PM2.0×8.0 shoulder screws 1 that secure the heat sink to the notebook.
Remo val and Replacement Pr ocedures Maintenance and Serv ice Guide 5–31 ✎ The thermal paste should be thoroughly cleaned from the surfaces of the heat sink 1 and processor 2 each time the heat sink is remov ed. Thermal paste is included with all heat sink and processor spare part kits.
5–3 2 Maintenance and Servi c e Guide Remo val and Replaceme nt Pr ocedur es 5. 1 4 P ro c e s s o r 1. Prepare the notebook for disassembly ( Section 5.3 ). 2. Release the keyboard ( Section 5.9 ). 3. Remove the thermal plate ( Section 5.12 ). 4. Remove the heat sink ( Section 5.
Remo val and Replacement Pr ocedures Maintenance and Serv ice Guide 5–33 5. Use a flat-blade screwdri v er to turn the processor locking scre w one-quarter turn counterclockwise 1 until you hear ac l i c k . 6. Lift the processor straight up and remove it 2 .
5–34 Maintenance and Servi ce Guide Remo val and Replaceme nt Pr ocedur es 5. 1 5 T PM S e c u r i t y C a r d 1. Prepare the notebook for disassembly ( Section 5.3 ). 2. Release the keyboard ( Section 5.9 ). 3. Remove the PM1.5×3.0 scre w 1 that secures the TPM security card to the notebook.
Remo val and Replacement Pr ocedures Maintenance and Serv ice Guide 5–35 5 . 1 6 Internal Memor y Modul e 1. Prepare the notebook for disassembly ( Section 5.
5–3 6 Maintenance and Serv ice Guide Remo val and Replaceme nt Pr ocedur es 3. Spread the retaining tabs 1 on each side of the memory module socket to release the memory module board. (The side of the module opposite the socket rises a way from the notebook.
Remo val and Replacement Pr ocedures Maintenance and Serv ice Guide 5–3 7 5. 1 7 To u c h Pa d 1. Prepare the notebook for disassembly ( Section 5.3 ). 2. Remove the ke yboard ( Section 5.9 ). 3. T urn the notebook upside do wn with the front toward you.
5–38 Maintenance and Servi ce Guide Remo val and Replaceme nt Pr ocedur es 5. T urn the notebook display-side up with the front to ward you. 6. Open the notebook as far as possible. 7. Lift up on the front edge of the T ouchPad 1 until it disengages from the notebook.
Remo val and Replacement Pr ocedures Maintenance and Serv ice Guide 5–39 9. Disconnect the T ouchPad cable 1 from the system board. 10. Remove the T ouchPad 2 .
5–40 Maintenance and Servi ce Guide Remo val and Replaceme nt Pr ocedur es 5. 1 8 M i n i P C I C o m m u n i c a t i o n s C a r d 1. Prepare the notebook for disassembly ( Section 5.3 ). 2. Remove the ke yboard ( Section 5.9 ). 3. Remove the T ouchPad ( Section 5.
Remo val and Replacement Pr ocedures Maintenance and Serv ice Guide 5–41 ✎ Make note of which antenna cable is attached to which antenna clip on the Mini PCI communications card before disconnecting the cables. 4. Disconnect the auxiliary and main antenna cables 1 from the Mini PCI communications card.
5–4 2 Maintenance and Serv ice Guide Remo val and Replaceme nt Pr ocedur es 5 . 1 9 Di spla y Asse mbl y 1. Prepare the notebook for disassembly ( Section 5.3 ) and remov e the follo wing components: a. K eyboard ( Section 5.9 ) b . Switch cov er ( Section 5.
Remo val and Replacement Pr ocedures Maintenance and Servi ce Guide 5–43 ✎ Make note of which antenna cable is attached to which antenna clip on the Mini PCI communications card before disconnecting the cables. 2. Disconnect the wireless antenna cables 1 from the Mini PCI communications card.
5–44 Maintenance and Serv ice Guide Remo val and Replaceme nt Pr ocedur es 5. Remove the two T8M2.0×9.5 scre ws 1 and the two PM2.0×2.0 scre ws 2 that secure the display assembly to the notebook.
Remo val and Replacement Pr ocedures Maintenance and Serv ice Guide 5–45 6. Position the notebook with the rear panel toward you. 7. Remove the four T8M2.0×9.5 scre ws 1 that secure the display assembly to the notebook. 8. Lift the display assembly straight up 2 to remove it.
5–46 Maintenance and Servi ce Guide Remo val and Replaceme nt Pr ocedur es 5. 2 0 T o p C ove r 1. Prepare the notebook for disassembly ( Section 5.3 ) and remov e the follo wing components: a. Hard dri ve ( Section 5.4 ) b . K eyboard ( Section 5.9 ) c.
Remo val and Replacement Pr ocedures Maintenance and Serv ice Guide 5–4 7 3. Remove the two rubber scre w cov ers 1 and the ele ven T8M2.0×9.5 scre ws 2 that secure the top cov er to the notebook.
5–48 Maintenance and Servi ce Guide Remo val and Replaceme nt Pr ocedur es 4. T urn the notebook right-side up with the front panel to ward you. 5. Disconnect the speaker cable 1 from the system board. 6. Remove the f i ve T8M2.0×4.0 screws 2 that secure the top cov er to the notebook.
Remo val and Replacement Pr ocedures Maintenance and Serv ice Guide 5–49 7. Lift the front edge of the top cover 1 until it diseng ages from the base enclosure. 8. Lift the top cover straight up 2 and remo ve it. Re mo v ing the T op Co ver Re verse the abo v e procedure to install the top cov e r .
5–50 Maintenance and Servi ce Guide Remo val and Replaceme nt Pr ocedur es 5. 2 1 M o d e m B o a r d 1. Prepare the notebook for disassembly ( Section 5.3 ) and remov e the follo wing components: a. Hard dri ve ( Section 5.4 ) b . K eyboard ( Section 5.
Remo val and Replacement Pr ocedures Maintenance and Serv ice Guide 5–51 2. Remove the two T8M2.0×4.0 scre ws 1 that secure the modem board to the system board. 3. Lift the right side of the modem board 2 to disconnect it from the system board. 4. Disconnect the modem cable 3 from the modem board.
5–5 2 Maintenance and Servi c e Guide Remo val and Replaceme nt Pr ocedur es 5. 22 Sys t e m B o a r d ✎ When replacing the system board, ensure that the follo wing components are remov ed from the defecti ve system board and installed on the replacement system board: ■ Memory modules ( Section 5.
Remo val and Replacement Pr ocedures Maintenance and Serv ice Guide 5–53 1. Prepare the notebook for disassembly ( Section 5.3 ) and remov e the follo wing components: a. Hard dri ve ( Section 5.4 ) b . MultiBay II de vice ( Section 5.6 ) c. Bluetooth board ( Section 5.
5–54 Maintenance and Servi ce Guide Remo val and Replaceme nt Pr ocedur es 2. Disconnect the R TC battery cable from the system board ( Section 5.11 ). 3. Position the notebook with the front panel toward you. 4. Disconnect the audio board cables 1 and 2 from the audio board.
Remo val and Replacement Pr ocedures Maintenance and Servi ce Guide 5–5 5 5. Position the notebook with the rear panel toward you. 6. Remove the follo wing: 1 T wo HM5.0×10.0 screw locks on each side of the e xternal monitor connector 2 Se ven T8M2.
5–5 6 Maintenance and Serv ice Guide Remo val and Replaceme nt Pr ocedur es 7. Flex the left side of the base enclosure 1 until the serial connector 2 is clear of the base enclosure. 8. Lift the left side of the system board 3 until it rests at an angle.
Remo val and Replacement Pr ocedures Maintenance and Serv ice Guide 5–5 7 9. Flex the right side of the base enclosure 1 until the USB 2 , 1394 3 , S-V ideo 4 , and RJ-45 connectors 5 are clear of the base enclosure. 10. Lift the right side of the system board 6 until it rests at an angle.
5–5 8 Maintenance and Serv ice Guide Remo val and Replaceme nt Pr ocedur es 11. Lift the system board straight up and remove it. Re mo v ing the S ystem Boar d Re verse the abo v e procedure to install the system board.
Remo val and Replacement Pr ocedures Maintenance and Serv ice Guide 5–5 9 5 .23 S ystem Board Frame 1. Prepare the notebook for disassembly ( Section 5.3 ) and remov e the follo wing components: a. Hard dri ve ( Section 5.4 ) b . MultiBay II de vice ( Section 5.
5–60 Maintenance and Servi ce Guide Remo val and Replaceme nt Pr ocedur es 2. Disconnect the following cables from the system board: 1 Audio connector board cable 2 USB connector board cable 3 Serial connector board cable 4 Modem cable 3. Remove the two T8M2.
Remo val and Replacement Pr ocedures Maintenance and Serv ice Guide 5–61 4. Lift the rear edge of the system board 1 until it rests at an angle. 5. Slide the system board back 2 until the front-right section of the system board 3 is clear of the scre w boss 4 on the system board frame.
5–6 2 Maintenance and Serv ice Guide Remo val and Replaceme nt Pr ocedur es 7. If necessary , remove the RJ-11 connector module and cable 1 from the clips 2 in the system board frame. Re mo v ing the RJ-11 Connec tor Module and Ca ble Re verse the abo v e procedures to install the system board frame.
Remo val and Replacement Pr ocedures Maintenance and Serv ice Guide 5–63 5. 24 Pus h B u t t o n M o d u l e 1. Prepare the notebook for disassembly ( Section 5.3 ) and remov e the follo wing components: a. Hard dri ve ( Section 5.4 ) b . MultiBay II de vice ( Section 5.
5–64 Maintenance and Servi ce Guide Remo val and Replaceme nt Pr ocedur es 2. Remove the PM2.0×6.0 scre w 1 that secures the push button module to the base enclosure. 3. Remove the push b utton module 2 . Remo ving the P ush Button Module Re verse the abo v e procedures to install the push b utton module.
Remo val and Replacement Pr ocedures Maintenance and Servi ce Guide 5–65 5 .25 Serial C onnec tor Modul e 1. Prepare the notebook for disassembly ( Section 5.3 ) and remov e the follo wing components: a. Hard dri ve ( Section 5.4 ) b . MultiBay II de vice ( Section 5.
5–66 Maintenance and Servi ce Guide Remo val and Replaceme nt Pr ocedur es 2. Remove the two HM5.0×10.0 scre w locks 1 that secure the serial connector module to the system board frame. 3. Remove the serial connector module 2 from the system board frame.
Remo val and Replacement Pr ocedures Maintenance and Serv ice Guide 5–6 7 5. 26 A u d i o B o a r d 1. Prepare the notebook for disassembly ( Section 5.3 ) and remov e the follo wing components: a. Hard dri ve ( Section 5.4 ) b . MultiBay II de vice ( Section 5.
5–6 8 Maintenance and Serv ice Guide Remo val and Replaceme nt Pr ocedur es 2. Remove the two T8M2.0×4.0 scre ws 1 that secure the audio board to the base enclosure. 3. Lift the left side of the audio board 2 to disengage it from the base enclosure.
Maintenance and Serv ice Guide 6–1 6 Spec ifica tions This chapter provides physical and performance specif ications. Ta b l e 6 - 1 Notebook Dimensions Metric U .S. Height Width Depth (front to back) 35.6 cm 26.0 cm 2.8 to 3.4 cm 14.02 in 10.24 in 1.
6–2 Maintenance and Service Guide Spe cificat ions Relative humidity (noncondensing) Operating Nonoperating 10% to 90% 5% to 95% 10% to 90% 5% to 95% Maximum altitude (unpressurized) Operating (14.
Specific atio ns Maintenance and Serv ice Guide 6–3 Ta b l e 6 - 2 15.4-inch, WSXGA, TFT Displa y Dimensions Height Width Diagonal 20.7 cm 33.1 cm 39.1 cm 8.1 in 13.0 in 15.4 in Number of colors Up to 16.8 million Contrast ratio 200:1 Brightness 180 nits typical Pixel resolution Pitch Fo r m at Configuration 0.
6–4 Maintenance and Service Guide Spe cificat ions Ta b l e 6 - 3 15.4-inch, WXGA, TFT Displa y Dimensions Height Width Diagonal 20.7 cm 33.1 cm 39.1 cm 8.1 in 13.0 in 15.4 in Number of colors Up to 16.8 million Contrast ratio 200:1 Brightness 180 nits typical Pixel resolution Pitch Fo r m at Configuration 0.
Specific atio ns Maintenance and Serv ice Guide 6–5 Ta b l e 6 - 4 15.4-inch, UXGA, TFT Displa y Dimensions Height Width Diagonal 20.7 cm 33.1 cm 39.1 cm 8.1 in 13.0 in 15.4 in Number of colors Up to 16.8 million Contrast ratio 200:1 Brightness 180 nits typical Pixel resolution Pitch Fo r m at Configuration 0.
6–6 Maintenance and Service Guide Spe cificat ions Ta b l e 6 - 5 Hard Drives 60-GB* 80-GB* 60-GB* 40-GB* Dimensions Height Width We i g h t 9.5 mm 70 mm 102 g 9.
Specific atio ns Maintenance and Serv ice Guide 6–7 60-GB* 80-GB* 60-GB* 40-GB* Seek times (typical read, including setting) Single trac k Ave r a g e Maximum 3 ms 13 ms 24 ms 3 ms 13 ms 24 ms 3 ms .
6–8 Maintenance and Service Guide Spe cificat ions Ta b l e 6 - 6 Primary 8-cell, Li-Ion Battery Pac k Dimensions Height Width Depth We i g h t 2.00 cm 9.40 cm 13.40 cm 0.34 kg 0.79 in 3.70 in 5.28 in 0.75 lb Energ y V oltage Amp-hour capacity W att-hour capacity 11.
Specific atio ns Maintenance and Serv ice Guide 6–9 Ta b l e 6 - 7 DV D - R O M D r i v e Applicable disc DV D - R O M ( DV D - 5 , DV D - 9 , DV D - 1 0 , DV D - 1 8 ) CD-ROM (Mode 1 and 2) CD Digi.
6–10 Maintenance and Serv ice Guide Spe cificat ions Ta b l e 6 - 8 D VD/CD-RW Combo Drive Applicable disc Read: D VD-R, D VD-RW , D V D-ROM (D VD-5, D VD-9, D VD-10, DV D - 1 8 ) , CD-ROM (Mode 1 a.
Specific atio ns Maintenance and Serv ice Guide 6–11 Disc thickness 1.2 mm (0.047 in) T rack pitch 0.74 µm Access time CD media D VD media Random Full stroke < 110 ms < 210 ms < 130 ms < 225 ms A udio output level Line-out, 0.
6–12 Maintenance and Serv ice Guide Spe cificat ions Ta b l e 6 - 9 D VD+R W/R and CD-R W Combo Drive Applicable disc Read: DV D - R , DV D - R W, D VD-RO M (D VD-5, DV D - 9 , DV D - 1 0 , DV D - 1.
Specific atio ns Maintenance and Serv ice Guide 6–13 Disc thickness 1.2 mm (0.047 in) T rack pitch 0.74 µm Access time CD D VD Random Full stroke < 175 ms < 285 ms < 230 ms < 335 ms A udio output level A udio-out, 0.
6–14 Maintenance and Serv ice Guide Spe cificat ions T able 6-10 System DMA Hard ware DMA System Function DMA0 Not applicable DMA1* Not applicable DMA2* Not applicable DMA3 Not applicable DMA4 Direct memor y access controller DMA5* A vailable f or PC Card DMA6 Not assigned DMA7 Not assigned *PC Card controller ca n use DMA 1, 2, or 5.
Specific atio ns Maintenance and Serv ice Guide 6–15 T able 6-11 System Interrupts Hard ware IRQ System Function IRQ0 System timer IRQ1 Standard 101-/102-K ey or Microsoft Natural K eyboard IRQ2 Cas.
6–16 Maintenance and Serv ice Guide Spe cificat ions Hard ware IRQ System Function IRQ11 Intel USB EHCI controller—24CD Intel USB UHCI controller—24C4 Intel USB UHCI controller—24C7 Intel Pro/.
Specific atio ns Maintenance and Serv ice Guide 6–17 T able 6-12 System I/O Addresses I/O Address (he x) System Function (shipping configuration) 000 - 00F DMA controller no .
6–18 Maintenance and Serv ice Guide Spe cificat ions I/O Address (he x) System Function (shipping configuration) 0A2 - 0BF Unused 0C0 - 0DF DMA controller no.
Specific atio ns Maintenance and Serv ice Guide 6–19 I/O Address (he x) System Function (shipping configuration) 2F0 - 2F7 Unused 2F8 - 2FF Infrared por t 300 - 31F Unused 320 - 36F Unused 370 - 377.
6–20 Maintenance and Serv ice Guide Spe cificat ions T able 6-13 System Memory Map Size Memory Address System Function 640 KB 00000000-0009FFFF Base memor y 128 KB 000A0000-000BFFFF Video memory 48 .
Maintenance and Serv ice Guide A–1 A Conn ec tor P in Assi gnm ents Ta b l e A - 1 A udio-Out (Headphone) Pin Signal Pin Signal 1 A udio out, left channel 3 Ground 2 A udio out, r ight channel.
A–2 Maintenance and Service Guide Connec tor P in Assignments Ta b l e A - 2 A udio-In (Micr ophone) Pin Signal Pin Signal 1 A udio signal in 3 Ground 2 A udio signal in.
Connect or P in Assignments Maintenance and Serv ice Guide A–3 Ta b l e A - 3 Universal Serial Bus Pin Signal Pin Signal 1 +5 VDC 3 Data + 2 Data – 4 Ground.
A–4 Maintenance and Service Guide Connec tor P in Assignments Ta b l e A - 4 Serial Pin Signal Pin Signal 1 Carrier detect 6 Data set ready 2 Receiv e data 7 Ready to send 3 T ransmit data 8 Clear t.
Connect or P in Assignments Maintenance and Serv ice Guide A–5 Ta b l e A - 5 External Monitor Pin Signal Pin Signal 1 Red analog 9 +5 VDC 2 Green analog 10 Ground 3 Blue analog 11 Monitor detect 4 .
A–6 Maintenance and Service Guide Connec tor P in Assignments Ta b l e A - 6 RJ-45 (Network) Pin Signal Pin Signal 1 T ransmit + 5 Unused 2 T ransmit – 6 Receiv e – 3 Receiv e + 7 Un used 4 Unus.
Connect or P in Assignments Maintenance and Serv ice Guide A–7 Ta b l e A - 7 RJ-11 (Modem) Pin Signal Pin Signal 1 Unused 4 Unused 2T i p 5U n u s e d 3 Ring 6 Unused.
A–8 Maintenance and Service Guide Connec tor P in Assignments Ta b l e A - 8 S-Video-Out Pin Signal Pin Signal 1 S-VHS color (C) signal 5 TV -CD 2 Composite video signal 6 S-VHS intensity ground 3 S.
Maintenance and Serv ice Guide B–1 B P o w e r Cord Set Req uirements 3-Con duc tor P o w er C ord Set The wide range input feature of the notebook permits it to operate from any line v oltage from 100 to 120 or 220 to 240 volts A C.
B–2 Maintenance and Service Guide P ow er Cord Set Requir ements Gen eral Requirements The requirements listed belo w are applicable to all countries. ■ The length of the po wer cord set must be at least 1.5 m (5.0 ft) and a maximum of 2.0 m (6.5 ft).
P ow er Cord Set R equirements Maintenance and Serv ice Guide B–3 Countr y- Spec ifi c Requirements 3-Conductor P ower Cord Set Requirements Country Accredited Agency Applicable Note Number A ustral.
B–4 Maintenance and Service Guide P ow er Cord Set Requir ements The Netherlands KEMA 1 Norwa y NEMK O 1 Sweden SEMK O 1 Switzerland SEV 1 United Kingdom BSI 1 United States UL 2 ✎ NOTES: 1. The flexib le cord must be <HAR> T ype HO5VV -F , 3-conductor , 1.
Maintenance and Serv ice Guide C–1 C Scre w Li st ing This appendix provides specif ication and reference information for the scre ws and scre w locks used in the notebook. All scre ws and scre w locks listed in this appendix are av ailable in the Scre w Kit, spare part number 382692-001.
C–2 Maintenance and Servi ce Guide Scr ew L isting Phillips P M2 .0×4. 0 Scr ew L ocations Ta b l e C - 1 Phillips PM2.0×4.0 Screw Color Qty . Length Thread Head Width Black 3 4.0 mm 2.0 mm 4.0 mm Where used: 1 T wo screws that secure the hard driv e cover to the notebook (scre ws are captured on the cov er by C clips; documented in Section 5.
Sc rew Li s t i n g Maintenance and Serv ice Guide C–3 Phillips P M2 .5×13 .0 S cr ew L ocation Ta b l e C - 2 Phillips PM2.5×13.0 Spring-Loaded Hard Drive Retention Screw Color Qty .
C–4 Maintenance and Servi ce Guide Scr ew L isting Phillips P M3. 0×5 . 0 and P M3. 0×4.0 S cr ew L ocations Ta b l e C - 3 Phillips PM3.0×5.0 Screw Color Qty . Length Thread Head Width Silver 2 5.0 mm 3.0 mm 5.0 mm Where used: 1 T wo screws that secure the hard driv e frame to the hard drive (documented in Section 5.
Sc rew Li s t i n g Maintenance and Serv ice Guide C–5 Phillips P M1.5×4. 0 Scr ew L ocations Ta b l e C - 5 Phillips PM1.5×4.0 Screw Color Qty . Length Thread Head Width Black 2 5.0 mm 1.5 mm 4.5 mm Where used: 2 screws that secure the hard driv e fram e to the hard drive (documented in Section 5.
C–6 Maintenance and Servi ce Guide Scr ew L isting T orx T8M2 . 0×4. 0 Sc r e w Locati on Ta b l e C - 6 T orx T8M2.0×4.0 Screw Color Qty . Length Thread Head Width Black 16 4.0 mm 2.0 mm 4.5 mm Where used: One screw that secures the MultiBa y II device to the notebook (documented in Section 5.
Sc rew Li s t i n g Maintenance and Serv ice Guide C–7 T orx T8M2 . 0×4. 0 Sc r e w L ocations Ta b l e C - 6 T orx T8M2.0×4.0 Screw (Continued) Color Qty . Length Thread Head Width Black 16 4.0 mm 2.0 mm 4.5 mm Where used: 5 screws that secure the top co v e r to the notebook (documented in Section 5.
C–8 Maintenance and Servi ce Guide Scr ew L isting T orx T8M2 . 0×4. 0 Sc r e w L ocations Ta b l e C - 6 T orx T8M2.0×4.0 Screw (Continued) Color Qty . Length Thread Head Width Black 16 4.0 mm 2.0 mm 4.5 mm Where used: 1 T wo screws that secure the modem bo ard to the notebook (documented in Section 5.
Sc rew Li s t i n g Maintenance and Serv ice Guide C–9 T orx T8M2 . 0×4. 0 Sc r e w L ocations Ta b l e C - 6 T orx T8M2.0×4.0 Screw (Continued) Color Qty . Length Thread Head Width Black 16 4.0 mm 2.0 mm 4.5 mm Where used: 2 screws that secure the audio boar d to the notebook (documented in Section 5.
C–10 Maintenance and Serv ice Guide Scr ew L isting T orx T8M2 . 0×4. 0 Sc r e w L ocations Ta b l e C - 6 T orx T8M2.0×4.0 Screw (Continued) Color Qty . Length Thread Head Width Black 16 4.0 mm 2.0 mm 4.5 mm Where used: 4 screws that secure the thermal pl ate to the notebook (documented in Section 5.
Sc rew Li s t i n g Maintenance and Serv ice Guide C–11 Phillips P M1.5×3 .0 Sc re w Locati ons Ta b l e C - 7 Phillips PM1.5×3.0 Screw Color Qty .
C–12 Maintenance and Serv ice Guide Scr ew L isting Phillips P M1.5×3 .0 Sc re w Locati ons Ta b l e C - 7 Phillips PM1.5×3.0 Screw (Continued) Color Qty . Length Thread Head Width Silver 9 1.5 mm 3.0 mm 3.0 mm Where used: 6 screws that secure the LED board to the s witch cover (documented in Section 5.
Sc rew Li s t i n g Maintenance and Serv ice Guide C–13 Phillips P M1.5×3 .0 Sc r ew Locati on Ta b l e C - 7 Phillips PM1.5×3.0 Screw (Continued) Color Qty . Length Thread Head Width Silver 9 1.5 mm 3.0 mm 4.0 mm Where used: One screw that secures the TPM security card to the notebook (documented in Section 5.
C–14 Maintenance and Serv ice Guide Scr ew L isting T orx T8M2 . 0×9 .5 Sc r ew Locati ons Ta b l e C - 8 T orx T8M2.0×9.5 Screw Color Qty . Length Thread Head Width Black 20 9.5 mm 2.0 mm 5.0 mm Where used: 1 T wo screws that secure the k eyboard to the notebook (documented in Section 5.
Sc rew Li s t i n g Maintenance and Serv ice Guide C–15 T orx T8M2 . 0×8. 0 Sc r e w L ocations Ta b l e C - 8 T orx T8M2.0×9.5 Screw (Continued) Color Qty . Length Thread Head Width Black 20 9.5 mm 2.0 mm 5.0 mm Where used: 11 screws that secure the top co v er to the notebook (documented in Section 5.
C–16 Maintenance and Serv ice Guide Scr ew L isting T orx T8M2 . 0×9 .5 Sc r ew Locati ons Ta b l e C - 8 T orx T8M2.0×9.5 Screw (Continued) Color Qty . Length Thread Head Width Black 20 9.5 mm 2.0 mm 5.0 mm Where used: 2 screws that secure the displa y asse mbly to the notebook (documented in Section 5.
Sc rew Li s t i n g Maintenance and Serv ice Guide C–17 Phillips P M2 .0×2 .0 Sc re w Locati ons Ta b l e C - 9 Phillips PM2.0×2.0 Screw Color Qty . Length Thread Head Width Black 5 2.0 mm 2.0 mm 7.0 mm Where used: 3 screws that secure the s witch co ver to the notebook (documented in Section 5.
C–18 Maintenance and Serv ice Guide Scr ew L isting Phillips P M2 .0×2 .0 Sc re w Locati ons Ta b l e C - 9 Phillips PM2.0×2.0 Screw (Continued) Color Qty . Length Thread Head Width Black 5 2.0 mm 2.0 mm 7.0 mm Where used: 2 screws that secure the displa y asse mbly to the notebook (documented in Section 5.
Sc rew Li s t i n g Maintenance and Serv ice Guide C–19 Phillips P M2 .0×10. 0 Spr ing-Loaded S cr ew L ocati ons T able C-10 Phillips PM2.0×10.0 Spring-Loaded Screw Color Qty . Length Thread Head Width Silver 4 10.0 mm 2.0 mm 5.0 mm Where used: 4 screws that secure the thermal pl ate to the notebook (documented in Section 5.
C–20 Maintenance and Serv ice Guide Scr ew L isting Phillips P M2 .0x8. 0 Shoulder Scr ew Locati ons T able C-11 Phillips PM2.0x8.0 Shoulder Screw Color Qty .
Sc rew Li s t i n g Maintenance and Serv ice Guide C–21 Hex S ock et HM5 . 0×10. 0 Sc re w Loc k Locations T able C-12 Hex Soc ket HM5.0×10.0 Screw Lock Color Qty . Length Thread Head Width Silver 4 10.0 mm 2.5 mm 5.0 mm Where used: 1 T wo screw loc ks that secure the system board to the notebook (documented in Section 5.
C–2 2 Maintenance and Servi c e Guide Scr ew L isting T orx T8M2 . 0×6 . 0 Sc r e w Locations T able C-13 T orx T8M2.0×6.0 Screw Color Qty . Length Thread Head Width Black 7 6.0 mm 2.0 mm 4.5 mm Where used: 7 screws that secure the system boar d to the notebook (documented in Section 5.
Sc rew Li s t i n g Maintenance and Serv ice Guide C–2 3 Phillips P M2 .0×6 . 0 Scr ew L ocation T able C-14 Phillips PM2.0×6.0 Screw Color Qty . Length Thread Head Width Silver 1 6.0 mm 2.0 mm 4.0 mm Where used: One screw that secures the push b u tt on module to the base enclosure (documented in Section 5.
Maintenance and Serv ice Guide Index–1 Ind e x 1394 port 1–10 A adjustable notebook stand, spare part number 3–17 , 3–20 Advanced Docking Station, HP, spare part number 3–17 , 3–21 arrow k.
Index–2 Maintenance and Servi ce Guide Index components bottom 1–18 front 1–6 keyboard 1–11 , 1–12 left-side 1–9 rear 1–9 right-side 1–8 top 1–14 , 1–16 Computer Setup Advanced Men.
Index Maintenance and Serv ice Guide Index–3 E electrostatic discharge 4–4 , 4–8 external monitor port location 1–11 pin assignments A–5 F f1 to f12 keys 1–13 features 1–2 feet illustrat.
Index–4 Maintenance and Servi ce Guide Index K keyboard removal 5–17 spare part numbers 3–3 , 3–5 , 3–21 , 3–22 , 3–23 , 3–25 , 3–26 , 5–17 troubleshooting 2–26 keyboard componen.
Index Maintenance and Serv ice Guide Index–5 MultiBay II 1–8 MultiBay II device removal 5–11 spare part numbers 3–13 , 3–16 , 3–21 , 5–11 N network jack location 1–9 pin assignments A.
Index–6 Maintenance and Servi ce Guide Index RJ-11 jack location 1–9 pin assignments A–7 RJ-45 jack location 1–9 pin assignments A–6 RTC battery illustrated 3–14 removal 5–26 S Screw Kit.
Index Maintenance and Serv ice Guide Index–7 top components 1–14 , 1–16 top cover removal 5–46 spare part numbers 3–9 , 3–24 , 5–46 TouchPad 1–17 removal 5–37 spare part numbers 3–.
デバイスCompaq NX8220の購入後に(又は購入する前であっても)重要なポイントは、説明書をよく読むことです。その単純な理由はいくつかあります:
Compaq NX8220をまだ購入していないなら、この製品の基本情報を理解する良い機会です。まずは上にある説明書の最初のページをご覧ください。そこにはCompaq NX8220の技術情報の概要が記載されているはずです。デバイスがあなたのニーズを満たすかどうかは、ここで確認しましょう。Compaq NX8220の取扱説明書の次のページをよく読むことにより、製品の全機能やその取り扱いに関する情報を知ることができます。Compaq NX8220で得られた情報は、きっとあなたの購入の決断を手助けしてくれることでしょう。
Compaq NX8220を既にお持ちだが、まだ読んでいない場合は、上記の理由によりそれを行うべきです。そうすることにより機能を適切に使用しているか、又はCompaq NX8220の不適切な取り扱いによりその寿命を短くする危険を犯していないかどうかを知ることができます。
ですが、ユーザガイドが果たす重要な役割の一つは、Compaq NX8220に関する問題の解決を支援することです。そこにはほとんどの場合、トラブルシューティング、すなわちCompaq NX8220デバイスで最もよく起こりうる故障・不良とそれらの対処法についてのアドバイスを見つけることができるはずです。たとえ問題を解決できなかった場合でも、説明書にはカスタマー・サービスセンター又は最寄りのサービスセンターへの問い合わせ先等、次の対処法についての指示があるはずです。