HP (Hewlett-Packard)メーカー633407-001の使用説明書/サービス説明書
ページ先へ移動 of 110
HP Pr oL ian t DL3 8 0 G7 Se r v er Maint enance and S er v i ce Gui de Abstract This guide describes identifi cation and maintenance procedures, diagnostic too ls, specifications and requirements for hardwar e components and software. This guide is for an expe rienced service technician.
© Copyright 20 10, 2 012 Hewlett- Packard Development Company, L.P. The information contained herei n is subject to change without notice. The only warranties for HP products and ser vices are set forth in the express warranty statements accompanyin g such products and services.
Contents 3 Con tents Customer self repair ...................................................................................................................... 6 Parts only warranty service ............................................................
Contents 4 Expansion boards ................................................................................................................................... 55 Half - length expans ion board .........................................................
Contents 5 Documentation feedbac k ........................................................................................................... 108 Index ..................................................................................................
Customer self repair 6 C u st omer s elf r epair HP products are desig ned with many Customer Self Repair (CSR ) parts to minimize repair time and allow for greater flexibi lity in performing def ective parts replace ment.
Customer self repair 7 Obligatoire - P ièces pour lesquelles la ré paration par le client est ob ligatoire. Si vous demand ez à HP de remplacer ces pi èces, les coûts de dépla cement et mai n d'œuvre du servi ce vous seront f acturés. Facultatif - Piè ces pour lesquell es la réparati on par le client est facultative.
Customer self repair 8 In base alla disponibi lità e alla località geograf ica, le parti CSR vengono sp edite con consegna entro il giorno lavorat ivo seguente. La conse gna nel giorno stesso o entro quattro ore è o fferta con un sup plemento di costo solo in a lcune zone.
Customer self repair 9 defekte Teil nicht zurückschicken, kann HP Ihnen das Ersatzteil in Rechnung stellen. Im Falle von Customer Self Repair ko mmt HP für alle Kost en für die Liefer ung und Rücksend ung auf und best immt den Kurier- /Frachtdienst.
Customer self repair 10 enviara el componente defectuoso requerido, HP podrá cobr arle por el de sustitución. En el c aso de todas sustitucion es que lleve a ca bo el cliente, H P se hará cargo de todos l os gastos de env ío y devolución d e componente s y escogerá la em presa de transp orte que se utilic e pa ra dicho servicio.
Customer self repair 11 Neem contact op met e en Service Partner voor meer infor matie over het Customer Self Repai r programma van HP. Informatie o ver Service Partners vindt u op de HP website ( http://www.
Customer self repair 12 No caso desse se rviço, a substituição de peças CSR é obr igatória. Se desejar que a HP su bstitua essas peças, serão cobradas as despesas de transporte e mão - de - obra do s erviço.
Customer self repair 13.
Customer self repair 14.
Customer self repair 15.
Illustrated parts catalog 16 I llus tr ated parts catalog Mechanical components Item Description Spare part number Customer self repair (on page 6 ) 1 Access panel 610525 - 001 Mandatory 1 2 Power sup.
Illustrated parts catalog 17 Item Description Spare part number Customer self repair (on page 6 ) grease) 13 Hardware kit* 496058 - 001 Mandatory 1 a) Optical dev ice blank — — b) Fan blank — .
Illustrated parts catalog 18 2 Optional: Opcional — compone ntes para los que la repa ración por parte del usuario es opcional. Estos componente s también están diseñados para que puedan ser r eparados po r el usuario.
Illustrated parts catalog 19 System components Item Description Spare part number Customer self repair (on page 6 ) System components 14 Hot - plug fan, 60 - mm 496066 - 001 Mandatory 1 15 Power suppl.
Illustrated parts catalog 20 Item Description Spare part number Customer self repair (on page 6 ) a) PC3 - 8500 (DDR3 - 1066), 4 - GB (RoHS) 4R kit 501535 - 001 Mandatory 1 b) PC3 - 8500 (DDR3 - 1066).
Illustrated parts catalog 21 Item Description Spare part number Customer self repair (on page 6 ) s) 2.13 - GHz Intel Xeon processor E5606 628699 - 001 Optional 2 t) 1.
Illustrated parts catalog 22 Item Description Spare part number Customer self repair (on page 6 ) 38 Optical dri ve data and power c able* 496071 - 001 Mandatory 1 39 AC power cord * 142258 - 001 Mandatory 1 40 HP Smart A rray P410i cache mod ule battery cable* 488137 - 001 Mandatory 1 41 Battery cable, 24 i n.
Illustrated parts catalog 23 3 No: Non CSR — Alcuni comp onenti HP non sono progettati per la riparazi one da parte del cliente. Per rispettare la garanzia, HP richiede che queste parti siano sostituite da un centro di assistenza autorizzato. Tali parti sono identif icate da un “No” nel Catalogo illust rato dei componen ti.
Illustrated parts catalog 24.
Removal and rep lacement procedures 25 R emo v al and r eplacemen t pr ocedur es R equired tools You need the following it ems for some procedur es: • T- 10/T - 15 Torx screwdriver (included w ith t.
Removal an d replacement procedures 26 NOTE: If the op erating system automaticall y places the serv er in Standby mode, omit the ne xt step. 3. Press the Power On/Standby button to place the server in Standby mode. When the server activates Standby power mode , the system power LED changes to ambe r.
Removal an d replacement procedures 27 R emove the server f rom the rack To remove the ser ver from an HP, Compaq branded, telco, o r third - party rack: 1. Power down the serv er (on page 25 ). 2. Extend the server from the rack (on pag e 26 ). 3. Disconnect the cablin g and remove the server from the rack.
Removal an d replacement procedures 28 1. Remove the cable arm re tainer. 2. Open the cable management arm. C able management arm with right - hand swing NOTE: To access some components, you may ne ed to remove the cable management ar m. To access the produ ct rear panel components, open the c able management arm: 1.
Removal an d replacement procedures 29 4. Remove the cable manage ment arm. S afety consider ations Before performin g service procedures, r eview all the safety informa tion. P reventing electr ostatic discharge To prevent damaging the system, be aware of the precautions you need to follow when setting up the system or handling parts.
Removal an d replacement procedures 30 WARNING: To reduce the risk of electri c shock or damage to the equi pment: • Do not disable the power cord grounding pl ug. The grounding plug is an important safety feature. • Plug the power cord int o a grounded (earthed ) electrical outlet that is eas ily accessible at all times.
Removal an d replacement procedures 31 A ir baffle To remove the component: CAUTION: For proper cooling, do not op erate the server without the a ccess panel, baffles, expansion s lot covers, or bla nks installed. If the server suppor ts hot - plug componen ts, minimize the amount of time the access panel is o p en.
Removal an d replacement procedures 32 o If no full - lengt h expansion bo ards are install ed, remove the ful l - length expansio n board shipping bracket as indicate d. o If full - length expansion boards are ins talled, remove the full - length expan sion board shipping bracket as indicate d.
Removal an d replacement procedures 33 2. Extend or remove the server from the rack (" Extend the server from the rack " on page 26 ). 3. Remove the a ccess panel (" Acce ss panel " on page 30 ).
Removal an d replacement procedures 34 CAUTION: For proper cooling, do not op erate the server without the a ccess panel, baffles, expansion s lot covers, or bla nks installed. If the server supports hot - plug components, min imize the amount of time the access panel is o p en.
Removal an d replacement procedures 35 To replace th e component, reve rse the removal procedure. H ot - plug power supply WARNING: To reduce the risk of perso nal injury from hot surface s, allow the power supply or power supply b lank to cool before touching it.
Removal an d replacement procedures 36 NOTE: If using the power cord anchor, be sure to leave eno ugh slack in the power cord s o that the redundant power supply can be removed without dis connecting the power cord from the primary power suppl y. 5. Close the cable manage ment arm.
Removal an d replacement procedures 37 5. Remove the optical dri ve. To replace th e component, rev erse the remova l procedure. O ptical driv e cage To remove the comp onent: CAUTION: To preve nt improper cooling and thermal damage, do not operate the se rver unless all bays are popul ated with either a component or a blank .
Removal an d replacement procedures 38 6. Remove the optical dri ve cage. To replace th e component, rev erse the remova l procedure. P ower su pply backplan e To remove the component: 1. Power down the serv er (on page 25 ). 2. Remove all power supplies (" Hot - plug power supply " on pag e 35 ).
Remo val and replacemen t procedures 39 H ot -plug fan The server supports variable fan speeds. The fans ope rate at minimum speed until a temperatu re change requires a f an speed increa se to cool the serv er.
Removal an d replacement procedures 40 3. Remove the fa n. CAUTION: Do not operate the ser ver for long periods with the acces s panel open or removed. Operating the se rver in this manner results in impro per airflow and improper cooling that can lead to thermal damage.
Removal an d replacement procedures 41 5. Disconnect all cables from the hard drive backplane. 6. Remove the hard drive back plane. To replace the compon ent, reverse the removal procedure. S FF hard drive cage To remove the component: 1. Power down the serv er (on page 25 ).
Removal an d replacement procedures 42 7. Remove the hard drive cage . To replace the component, reverse the removal procedure. L FF hard dri ve backplane To remove the component: 1. Power down the serv er (on page 25 ). 2. Extend or remove the server from the rack (" Extend the server from the rack " on page 26 ).
Removal an d replacement procedures 43 6. Remove the hard drive back plane. To replace the compon ent, r everse the removal procedure. LFF hard drive cage To remove the component: 1. Power down the serv er (on page 25 ). 2. Extend or remove the server from the rack (" Extend the server from the rack " on page 26 ).
Removal an d replacement procedures 44 To replace th e component, rev erse the remova l procedure. Systems Insight Disp lay To remove the component: 1. Power down the serv er (on page 25 ). 2. Extend the server from the rack (on pag e 26 ). 3. Remove the a ccess panel (" Acce ss panel " on page 30 ).
Removal an d replacement procedures 45 7. Remov e the three T - 10 Torx screws, and then detach the front bezel. To replace th e component, rev erse the remova l procedure.
Removal and replacement procedures 46 F an cage To remove the component: 1. Power down the serv er (on page 25 ). 2. Extend or rem ove the server fr om the rack (" Remove th e server from the r ack " on page 27 , " Extend the server from t he rack " on page 26 ).
Removal an d replacement procedures 47 To replace the component, rev erse the remova l steps. When re - installing the fans, press down on the top of each fan to be sur e it is seated pr operly.
Removal an d replacement procedures 48 o To remove slot covers 2 and 3, lift up on the latch, re move the latch, and then remov e the cover. o To remove slot covers 5 and 6, push down on the latch, rotate the latch down, and then remove the cover.
Removal an d replacement procedures 49 CAUTION: Do not detach the c able that connects the battery pack to the cache module. Detaching the cable c auses any unsaved data in the cache mo dule to be lost. R emoving the cache m odule To remove the component: 1.
Removal an d replacement procedures 50 5. Disconnect the cable, and then remove the battery pack. To replace th e component, rev erse the remova l procedure. R ecovering d at a from the battery - backed write c ache If the server fails, use the following proc edure to recover data tem porarily stored in the BBWC.
Removal an d replacement procedures 51 5. Power up the recovery se rver. A 1759 POST message is displayed, s tating that valid data was flushed from the cache. This data is now stored on the drives in the recovery server. You can now transfer the drives (and c ontroller, if on e was used) to a nother server.
Removal an d replacement procedures 52 8. Open the ejec tor latches on each side of t he cache module connect or. Normally, the cache mod ule is ejected from the cache module connector. If t he module is not eject ed automatical ly, remove the cache module.
Removal an d repla cement procedures 53 CAUTION: In systems that u se external data storage, be sure that the server is the first u nit to be powered down and the last t o be powered back up. T aking this precaution ensures that the system does not erro neously mark t he drives as failed w hen the server is p owered up.
Removal an d replacement procedures 54 CAUTION: For proper cooling, do not op erate the server without the a ccess panel, baffles, expansion s lot covers, or bla nks installed. If the server suppor ts hot - plug componen ts, minimize the amount of time the access panel is o p en.
Removal an d replacement procedures 55 o To remove slot covers 5 and 6, push down on the latch, rotate the latch down, and then remove the cover. Ex pansion bo ards Half- length expansion board To remove the component: 1. Power down the serv er (on page 25 ).
Removal an d replacement procedures 56 7. Remove the expansion bo ard. To replace th e component, rev erse the remova l procedure. Full- length expansion board To remove the component: 1. Power down the serv er (on page 25 ). 2. Extend the server from the rack (on pag e 26 ).
Removal an d replacement procedures 57 To replace th e component, rev erse the remova l procedure. H eatsink To remove the heatsink: 1. Power down the serv er (on page 25 ). 2. Extend the server from the rack (on pag e 26 ). 3. Remove the a ccess panel (" Acce ss panel " on page 30 ).
Removal an d replacement procedures 58 To replace th e heatsink: 1. Clean the old therm al grease from the pro cessor with the alcohol swa b. Allow the alcohol to evapor ate before continuing. 2. Apply all the grease to the top of the processor in the follo wing pattern to ensure even distribution.
Removal an d replacement procedures 59 4. Close and lock the heatsink retaining latches. 5. Install the air b affle (" Air baff le " on page 31 ). 6. If the PCI ri ser cage was re moved, install th e PCI riser cage (" PCI riser cage " on page 32 ).
Removal an d repl acement procedure s 60 10. Remove the p ower supply cage assembly. To replace th e component, rev erse the remova l procedure. P rocessor CAUTION: To avoid dama ge to the processor and system boar d, only authorized personnel should attempt to replace or install the processor in this server.
Removal an d replacement procedures 61 6. Open the heatsink retaining bracket. 7. Remove the h eatsink..
Removal an d replacement procedures 62 8. Open the pro cessor lockin g lever and the p rocessor socket retaining bracket. 9. Using the pro cessor tool, re move the proce ssor from the syst em board: a. Line up the proces sor tool, ensuring the locking l ever graphic on the tool is or iented correctly.
Removal an d replacement procedures 63 10. Carefully rotate the tool, and then push in and releas e the tabs to secure the processor in the tool. CAUTION: To avoid dama ge to the processor, do not touc h the bo ttom of the processor, especially the contac t area.
Removal an d replacement procedures 64 To replace th e processor: 1. Carefully inse rt the processor into the proce ssor installation tool. Handle the processor by th e edges only, and do not touch the bottom of the p rocessor, espec ially the contact area.
Removal an d replacement procedures 65 2. Be sure the tool is oriented correctly. Align the processor installation tool with the socket, and then install the processo r. THE PINS ON THE SYST EM BOARD ARE VERY F RAGILE AND EASILY DAM AGED . CAUTION: THE PINS ON THE SYSTEM BOARD ARE VERY FRAGILE AND EASILY D AMAGED.
Removal an d replacement procedures 66 3. Press and hold the tabs on the processor instal lation tool to separate it from the processor, and then remove the tool.
Removal an d replacem ent procedures 67 6. Apply all the grease to the top of the processor in the follo wing pattern to ensure even distribution. 7. Install the heatsink.
Removal an d replacement procedures 68 8. Close and lock the heatsink retaining latches. 9. Install the air b affle (" Air baffle " o n page 31 ). 10. If the PCI ri ser cage was re moved, install th e PCI riser cage (" PCI riser cage " on page 32 ).
Removal an d replacement procedures 69 6. Remove the D IMM. To replace th e component, reve rse the removal procedure. For DIMM config uration information, se e the server user guide.
Removal an d replacement procedures 70 7. Remove the battery. To replace th e component, rev erse the remova l procedure. For more informa tion about batt ery replacement or proper disposal, contact an authorized re seller or an authorized service provider.
Removal an d replacement procedures 71 System board To remove the component: 1. Power down the serv er (on page 25 ). 2. Extend or rem ove the server fr om the rack (" Remove th e server from the r ack " on page 27 , " Extend the server from t he rack " on page 26 ).
Removal an d replacement procedures 72 14. Remove the h eatsink. 15. Open the pro cessor lockin g lever and the p rocessor socket reta ining bracket. 16. Using the pro cessor tool, re move the proce ssor from the syst em board: a. Line up the proces sor tool, ensuring the locking l ever graphic on the tool is or iented correctly.
Removal an d replacement procedures 73 c. Release the tabs, and then carefully lift the processo r a nd tool straight up. 17. Carefully rotate the tool, and then push in and releas e the tabs to secure the processor in the tool. CAUTION: To avoid damage to the processor, do not touch the bottom of the processor, especially the contac t area.
Removal an d replacement procedures 74 20. Remove the system boar d. To replace the compon ent: 1. Install the spare s ystem board. CAUTION: Failure to completely open t he processor locking lever p revents the processor fr om seating during insta llation, leading to har dware damage.
Removal an d replacement procedures 75 2. Open the pro cessor lockin g lever and the p rocessor socket reta ining bracket. Do not remove the processor sock et cover . IMPORTANT: Be sure the processor rema ins inside the processor in stallation tool. 3.
Removal an d replacement procedures 76 4. Align the processor installation tool with the socke t, and then install the processor. THE PINS ON THE SYSTEM BOARD AR E VERY FRAGILE AND E ASILY DAMAGED . CAUTION: THE PINS ON THE SYSTEM B OARD ARE VERY FRAGIL E AND EASILY DAMAGED.
Removal an d replacement procedures 77 5. Press the tabs on the processor install ati on tool to separate it f rom the processor, and then remove the tool. 6. Close the pro cessor socket retaining bra cket and the proce ssor locking l ever. The processor sock et cover is automatically ejected .
Removal an d replacement procedures 78 9. Apply all the grease to the top of the processor in the follo wing pattern to ensure even distribution. 10. Install the hea tsink. IMPORTANT: Install all components with the s ame configuration that was used on the failed system board.
Removal an d replacement procedures 79 WARNING! WARNING! WARNING! The serial number is loaded into the system during the manufacturing process and should NOT be modified. This option should only be used by qualified service personnel. This value should always match the serial number sticker located on the chassis.
Cabling 80 C abling S AS hard dr ive cabling O ptical driv e cabling.
Cabling 81 B BWC batte ry cabling F BWC capacitor pack cabling.
Diagnostic tool s 82 D i agno sti c tools T roubleshooting resources The HP ProLiant Serv ers Troubleshooting Guid e provides procedure s for resolving common prob lems and comprehensiv e courses of a.
Diagnostic tool s 83 Survey functionality is installed with every SmartStart - assisted HP Insight Diagnostics installation, or it can be installed through the HP PSP. NOTE: The curre nt version of SmartStart pro vides the memory spare part nu mbers for the server.
Diagnostic tool s 84 U SB support HP provides both stan dard USB 2.0 support and legacy USB 2.0 support. Standard su pport is provided by the OS through the appr opriate USB device drivers. Befo re the OS loads, HP provides support for USB devices thro ugh legacy USB support, which is enabled by def ault in the system RO M.
Component ident ification 85 C om ponen t i dentif i cati on F ront panel comp onents • SFF model Item Description 1 Quick release levers (2) 2 Systems Insight Display 3 Hard drive bay s 4 SATA opti.
Component ident ification 86 Item Description 6 USB connectors (2) • LFF model Item Description 1 Quick release levers (2) 2 Systems Insight Display 3 Hard drive bay s 4 USB connect ors (2) 5 Video .
Component ident ification 87 Item Description Status 2 System health LED Green = Normal Amber = System degraded. Red = System c ritical. To identify comp onents in degraded or critical state, see " Systems Insight Displa y LEDs (on page 87 ).
Component ident ification 88 Item Description Status 1 NIC link/activit y LED Green = Network link Flashing green = Network link and activity Off = No link to network.
Component ident ification 89 Systems Insi ght Display LED and color H ealth LED System power LED Status Power supply (amber) Red Amber • Only one po wer supply is installe d and that power supply is in standby.
Component ident ification 90 10 Video connecto r 11 NIC 1 conne ctor 12 NIC 2 conne ctor 13 Mouse conne ctor 14 Keyboard con nector 15 Serial connect or 16 iLO 3 connecto r 17 NIC 3 conne ctor 18 NIC 4 conne ctor R ear panel LEDs and b uttons Item Description Status 1 Power supply LED Green = Normal Off = System is of f or power supply ha s failed.
Component ident ification 91 Secondary (slot - form factor) Primary (slot - form factor) PCIe2 riser slot description PCIe2 x16 riser slot description PCIe2 /PCI - X riser slot description 4 - FL/FH 1.
Component ident ification 92 System board S ystem board componen ts Item Descrip tion 1 Processor 2 D IMM slots 2 SAS power conne ctor A 3 SAS power conne ctor B 4 Front I/O connector 5 SATA optical d.
Component ident ification 93 Item Descrip tion 16 Processor 1 DIMM slots 17 Secondary ris er connector 18 SAS connector A 19 SAS connector B 20 Cache modu le connector 21 Fan connector 1 22 Fan connec.
Comp onent ident ification 94 Crash dump log analysis is an essential part of diagnosing reliability pr oblems, such as hangs in operating systems, d ev ice driver s, and applications. Many crashes freeze a system, and the on ly available action for administrators is to cycle the system power.
Component ident ification 95 D IMM identification To determine DIMM characteristics, use the label attac hed to the DIMM and the following illustration and table. Item Description Definition 1 Size — 2 Rank 1R = Single - ra nk 2R = Dual - ra nk 4R = Quad - rank 3 Data width x4 = 4 - bit x8 = 8 - bit 4 Voltage rating L = Low voltage (1.
Component ident ification 96 S AS and SA TA device numb ers • SFF device bay numbe ring • Optional SFF device bay nu mbering • LFF device bay numbe ring.
Component ident ification 97 S AS and SATA drive LEDs Item Description 1 Fault/UID LED (amber/blue) 2 Online LED (green) S AS and SATA drive LED combin ations Online/activity LED (green) Fault/UID LED.
Component ident ification 98 Online/activity LED (green) Fault/UID LED (amber/blue) Interpretat ion Off Steadily amber A critical faul t condition has been ide ntified for this drive, and the controller has p laced it offline. Repla ce the drive as soon as possible.
Component ident ification 99 B attery pac k LEDs Item Color Description 1 Green System Power LED. This LED i s on when the system is powered up an d 12 V system power is available. Thi s power supply i s used to maintai n the battery charg e and provide supp lementary power to the cache microc ontroller.
Component ident ification 100 LED3 pattern LED4 pat tern Interpretation Off Flashing (1 Hz) The battery pack is below the minimum charge level and is being charged. Features that require a battery (such as wri te cache, capacity expansion, st ripe size migration, and RAI D migration) are unava ilable temporarily until charging is complete.
Component ident ification 101 1 Green LED 2 Amber LED Interpretation Off Off The flash code is corrupt. Hot - plug f ans CAUTION: To avoid damag e to server components, fan blanks must be installed in fan bays 5 and 6 in a single - proc essor configuration.
Component ident ification 102 CAUTION: A thermal event can damage server co mp onents when the Thermal Shutdown feature is disabled in RB SU..
Specifications 103 S pec if icati ons E nvironmental spec ifications Specification Value Temperature range* Operating 10 C to 35 C (50 F to 95 F) Shipping - 30 C to 50 C ( - 22 F to 122 F) Storage - 30°C to 60°C ( - 22°F to 14 0°F) Maximum wet bulb temperature 28 C (82.
Specif ications 104 Rated input cu rrent 10 A at 100 V AC 4.9 A at 200 VAC Rated input po wer 930 W at 100 V AC input 1348 W at 20 0V AC input BTUs per hour 3530 at 120V A C input 4600 at 200V to 240V.
Specifications 105 Rated steady - state power 460 W at 100 V to 120V AC input 460 W at 200 V to 240V AC input Maximum peak power 460 W at 100V to 120V AC input 460 W at 200 V to 240V AC input H ot - p.
Acronyms and abbreviation s 106 A c r on y ms and abbr e v iati on s ASR Automatic Server R ecovery BBWC battery - backed write c ache DDR double data rate FBWC flash - backed write cache iLO Integrat.
Acronyms and abbreviation s 107 SAS serial attached SCSI SATA serial ATA TPM Trusted Platform Modu le UID unit identification USB universal serial bus.
Documentation feedback 108 Doc ument ati on f eedbac k HP is committed to pro viding documentation that meets your needs. To help us improve the do cumentation, send any erro rs, suggestion s, or comments to Documentation Feedback ( mailto:docsf eedback@hp.
Index 109 A access panel 30 air baffle 31 B battery 69 battery cablin g for BBWC 81 battery pack LEDs 99 battery - backed write cache (BBWC) 48, 50, 99 battery - backed write c ache battery pack 48 BB.
Index 110 LEDs, battery pack 99 LEDs, hard drive 97 LEDs, SAS hard drive 97 LEDs, troubleshooting 98 M management tools 82 mechanical compone nts 16 mechanical specificat ions 103 memory 95 memory dum.
デバイスHP (Hewlett-Packard) 633407-001の購入後に（又は購入する前であっても）重要なポイントは、説明書をよく読むことです。その単純な理由はいくつかあります：
HP (Hewlett-Packard) 633407-001をまだ購入していないなら、この製品の基本情報を理解する良い機会です。まずは上にある説明書の最初のページをご覧ください。そこにはHP (Hewlett-Packard) 633407-001の技術情報の概要が記載されているはずです。デバイスがあなたのニーズを満たすかどうかは、ここで確認しましょう。HP (Hewlett-Packard) 633407-001の取扱説明書の次のページをよく読むことにより、製品の全機能やその取り扱いに関する情報を知ることができます。HP (Hewlett-Packard) 633407-001で得られた情報は、きっとあなたの購入の決断を手助けしてくれることでしょう。
HP (Hewlett-Packard) 633407-001を既にお持ちだが、まだ読んでいない場合は、上記の理由によりそれを行うべきです。そうすることにより機能を適切に使用しているか、又はHP (Hewlett-Packard) 633407-001の不適切な取り扱いによりその寿命を短くする危険を犯していないかどうかを知ることができます。
ですが、ユーザガイドが果たす重要な役割の一つは、HP (Hewlett-Packard) 633407-001に関する問題の解決を支援することです。そこにはほとんどの場合、トラブルシューティング、すなわちHP (Hewlett-Packard) 633407-001デバイスで最もよく起こりうる故障・不良とそれらの対処法についてのアドバイスを見つけることができるはずです。たとえ問題を解決できなかった場合でも、説明書にはカスタマー・サービスセンター又は最寄りのサービスセンターへの問い合わせ先等、次の対処法についての指示があるはずです。
