HP (Hewlett-Packard)メーカー721546-001の使用説明書/サービス説明書
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HP Pr oL ian t ML3 1 0e Gen8 S er v er Maint enance and S er v i ce Guide Abstract This document is for an experience d service technician. It is helpful if you are q ualified in the servicing of comp.
© Copyright 2012, 2013 He wlett- Packard Development Company, L.P. The information c ontained herein is su bject to change without notice. The only warranties for HP products and services are set forth in the expr ess warranty statements accompanyin g such products and services.
Contents 3 Con tents Customer self repair ...................................................................................................................... 6 Parts only warranty service ............................................................
Contents 4 Troubleshooting .......................................................................................................................... 61 Troubleshooting resources ........................................................................
Contents 5 Acronyms and abbrevia tions ........................................................................................................ 86 Documentation feedbac k ................................................................................
Customer self repair 6 C u st omer s elf r epair HP products are desig ned with many Customer Self Re pair (CSR) parts to mini mize repair time and allow for greater flex ibility in per forming def ective parts rep lacement.
Customer self repair 7 Obligatoire - P ièces pour lesquelles la ré paration par le client est ob ligatoire. Si vous demand ez à HP de remplacer c es pièces, les c oûts de déplacemen t et main d'œuv re du service vo us seront facturé s. Facultati f - Pièces pour lesq uelles la répa ration par le clien t est facultat ive.
Customer self repair 8 In base alla disponibi lità e alla località geograf ica, le parti CSR vengono sp edite con consegna entro il giorno lavorat ivo seguente. La conse gna nel giorno stesso o entro quattro ore è o fferta con un sup plemento di costo solo in a lcune zone.
Customer self repair 9 defekte Teil nicht zurückschicken, kann HP Ihnen das Er satzteil in Rechnung stellen. Im Falle von Customer Self Repair kommt HP für alle Kosten für die Li eferung und Rüc ksendung auf und bestimmt den Kurier- /Frachtdienst.
Customer self repair 10 enviara el componente defectuoso requerido, HP podr á cobrarle por el de s ustitución. En el caso de to das sustitucion es que lleve a ca bo el cliente, H P se hará cargo de todos l os gastos de env ío y devolución d e componentes y esco gerá la empresa de transporte que se utilice para dicho servicio.
Customer self repair 11 Neem contact op met e en Service Partner voor me er informatie over he t Customer Self Repair pr ogramma van HP. Informatie o ver Service Partners vindt u op de HP website ( http:// www.
Customer self repair 12 No caso desse se rviço, a substituição de peç as CSR é obrigatória. Se desejar que a HP subs titua essas peças, serão cobradas as despesas de transporte e mão - de - obra do serviço.
Customer self repair 13.
Customer self repair 14.
Customer self repair 15.
Illustrated parts catalog 16 I llus tr ated parts catalog M echanic al components Item Description Spare part number Customer self repair (on page 6 ) 1 Access panel 686751 - 001 Mandatory 1 2 RPS cag.
Illustrated parts catalog 17 2 Optional: Facultatif— Pièces pour lesquelles la réparation p ar le client est facultative. Ces pièces sont également conçues pour permettre au cl ient d'effectuer lui - même la réparation.
Illustrated parts catalog 18.
Illustrated parts catalog 19 S ystem components Item Description Spare part number Customer self re pair (on page 6 ) 7 Optical drives — — a) SATA DVD - ROM drive 624591 - 0 01 Mandatory 1 b) SATA.
Illustrated parts catalog 20 Item Description Spare part number Customer self re pair (on page 6 ) d) 3 TB, 6G h ard drive* 628183 - 001 Mandatory 1 Non - hot - plug drives, SAS — — a) 450 GB, 6G .
Illustrated parts catalog 21 Item Description Spare part number Customer self re pair (on page 6 ) j) 900 GB, 6G hard drive* 653971 - 001 Mandatory 1 k) 1 TB, 6G h ard drive* 653954 - 001 Mandatory 1 .
Illustrated parts catalog 22 Item Description Spare part number Customer self re pair (on page 6 ) 22 HP 460 W CS Gold Hot Plug Power Supply Kit (92% efficie ncy) 511777 - 001 Mandatory 1 23 RPS backp.
Illustrated parts catalog 23 sustitución, pue de o no conllev ar costes adiciona les, dependiend o del tipo de s ervicio de garantía correspondiente al producto. 3 No: No — Algunos componentes no están dise ñados para que puedan ser reparados por el usuario.
Removal an d replacement procedures 24 R emo v al and r eplacemen t pr ocedur es R equired tools You need the following it ems for some procedur es: • T- 10/T - 15 Torx screwdriver (on page 75 ) •.
Removal an d replacement procedures 25 This symbol on an RJ - 45 receptacle indicates a network inte rface connection. WARNING: To reduce the ri sk of electric shock, fire, or dama ge to the equipment, do not plug telephone or telecommunicatio ns connectors into this receptacle.
Removal an d replacement procedures 26 Preparation procedures To access som e components and perf orm certain serv ice procedures, p erform one or more of the f ollowing procedures: • Unlock the tower bezel. • Remove the to wer bezel (on page 26 ).
Removal an d replacement procedures 27 To power do wn the server, use one of the follo wing methods: • Press and release the Power On/Standby button. This method initiates a controlled shutdown of applications and the OS before the server enters st andby mode.
Removal an d replacement procedures 28 o In a hot - plug drive configuratio n, remove the drive blank . To replace the LFF driv e blank, slide the component into the bay until it clicks. To replace th e SFF drive bla nk, while pressin g the release lat c h, slide the component into the bay until it is fully seated.
Removal an d replacement procedures 29 5. Remove the d rive. 6. Remove the d rive from the carrier. To replace th e component, rev erse the remova l procedure. H ot - plug drive CAUTION: To preve nt improper cooling and thermal damage, do not o perate the server unless all bays are popul ated with either a componen t or a blank.
Removal an d r eplacement p rocedures 30 4. Remove the d rive. To replace th e component, rev erse the remova l procedure. H ot - plug power supply CAUTION: To preve nt improper cooling and thermal damage, do not o perate the server unless all bays are popul ated with either a componen t or a blank.
Removal an d replacement procedures 31 CAUTION: The defau lt and redundant power suppli es in the server must have the same output power capacity. Verif y that all power supplies have the same part number and lab el color. The system becomes unstable and might shut down wh en it detects mismatched po wer supplies.
Removal an d replacement procedures 32 A ir baffle To remove the component: CAUTION: For proper cooling, do not op erate the server witho ut the access pa nel, baffles, expansion s lot covers, or bla nks installed. If the server suppor ts hot - plug componen ts, minimize the amount of time the access panel is o pen.
Removal an d replacement procedures 33 5. Disconnect th e SATA and power cables from the op tical drive. 6. Remove the optical dri ve. To replace th e component, rev erse the remova l procedure. Drive cage To remove the component: 1. Power down the serv er (on page 26 ).
Removal an d replacement procedures 34 o Four - bay LFF drive cage o Eight - bay SFF drive cage To replace th e component, rev erse the remova l procedure.
Removal an d replacement procedures 35 b. Disconne ct each power cor d from the server. 3. Remove the t ower bezel (on page 26 ). 4. Remove the a ccess panel (" Acce ss panel " on page 31 ). 5. Remove all insta lled drives (" Storage drive " on page 28 ).
Removal an d replacement procedures 36 o For a hot - plug drive cage, loosen the back plane thumbscrew, and then r emove the backplane assembly from the drive cage. To replace th e component, rev erse the remova l procedure. F ront I/O module To remove the component: 1.
Removal an d repla cement procedures 37 7. Remove the front I/O module. To replace th e component, rev erse the remova l procedure. Front system fan To remove the component: 1. Power down the serv er (on page 26 ). 2. Remove all power: a. Disconnect ea ch power cord from the power sour ce.
Removal an d replacement procedures 38 7. Press the release latch, and then remove the fan module. To replace th e component, rev erse the remova l procedure. D IMMs G eneral DIMM slot popul ation guidelines • The server h as four memory slo ts. • The server support s two channels with two DIM M slo ts per channel.
Removal an d replacement procedures 39 R emoving a DIMM 1. Power down the serv er (on page 26 ). 2. Remove all power: a. Disconnect ea ch power cord from the power sour ce. b. Disconne ct each power cor d from the server. 3. Unlock the tower bezel. 4.
Removal an d replacement procedures 40 c. Remove the h eatsink from t he processor ba ckplate. To replace the compon ent: 1. Clean the old thermal grea se from the processor with the alcohol swab. Allow the alcohol to evaporate before continuing. 2. Remove the t hermal inter face protective cover from the h eatsink.
Removal an d replacement procedures 41 c. Finish the installation by completely tightening the screws in the same sequence. 4. Install the air b affle (" Air baffle " o n page 32 ). 5. Install the access panel. 6. Lock the tow er bezel. 7. Connect ea ch power cord to the server.
Removal an d replacement procedures 42 5. Remove the a ir baffle (" Air baffle " on page 32 ). 6. Remove the h eatsink (" Heatsink " on page 39 ). CAUTION: To avoid damage to the processor, do not touch the bottom of the processor, especially the contac t area.
Removal an d replacement procedures 43 1. Install the processor. Use the notches on both sides of the processor to properly align it into the socket . CAUTION: Be sure to clos e the processor so cket retaining b racket before closi ng the processor locking lever.
Removal an d replaceme nt procedures 44 CAUTION: Do not overtighten the screws as this might damage the board, connectors, or screws and voids the warrant y of the board. 5. Install the heatsink: a. Position the h eatsink using the guide pin on the processor backplate.
Removal an d replacement procedures 45 7. Remove the expansion slot cover retainer. 8. If removing a full - length expansion boar d, remove the board retaine r securing it. 9. Remove the expansion bo ard. To replace th e component, rev erse the remova l procedure.
Removal an d replacement procedures 46 2. Remove all power: a. Disconnect ea ch power cord from the power sour ce. b. Disconne ct each power cor d from the server. 3. Unlock and open the tower bezel. 4. Remove the a ccess panel (" Acce ss panel " on page 31 ).
Removal an d replacement procedures 47 CAUTION: In systems that u se external data storage, be sure that the server is the first unit to be powered down and the last to be powered back up. Taking this precaution ensures that the sys tem does not erro neously mark t he drives as failed w hen the server is p owered up.
Removal an d replacement procedures 48 8. Remove the capacitor pack. To replace th e component, rev erse the remova l procedure. R ecovering d ata from the flash - backed write cache If the server f ails, use the follow ing procedure to reco ver data temporarily stored in the FBWC.
Removal an d replacement procedures 49 System battery If the server no longer automatically displays the correct date and time, then replace the battery that provide s power to the real - time clock.
Removal an d replacement procedures 50 R ear system fan To remove the component: 1. Power down the serv er (on page 26 ). 2. Remove all power: a. Disconnect ea ch power cord from the power sour ce. b. Disconne ct each power cor d from the server. 3. Unlock the tower bezel.
Removal an d replacement procedures 51 7. Remove the iLO mod ule from t he chassis. To replace th e component, rev erse the remova l procedure. E nabling the dedicated iLO management po rt The onboard NIC 1/shared iLO connector is set as the default syst em iLO port.
Removal an d replacement procedures 52 WARNING: To reduce the risk of perso nal injury from hot surface s, allow the power supply or power supply b lank to cool before touching it. 5. Disconnect the power su pply cables from the drive c age and the system board.
Removal an d replacement procedures 53 8. Remove the RPS backpl ane module. To replace the component, reverse the removal procedure. RPS cage To remove the component: 1. Power down the serv er (on page 26 ). 2. Remove all power: a. Disconnect ea ch power cord from the power sour ce.
Removal an d replacement procedures 54 11. Remove the p ower supply cage. To replace th e component, rev erse the remova l procedure. System board CAUTION: To avoid ESD da mage, when removing electros.
Removal an d replacement procedures 55 c. Remove the h eatsink from t he processor ba ckplate. CAUTION: To avoid damage to the processor, do not touch the bottom of the processor, especially the contac t area. 9. Open the process or locking lever, and then open the processor retaining bracket.
Removal an d replacement procedures 56 b. Lift the syst em board out of th e chassis. To replace th e system board: 1. Install the system board. 2. Connect all cables di sconnected from the faile d system board. 3. Install the DIMMs. 4. If removed, install the dedicated iLO manageme nt port.
Removal an d replacement procedures 57 6. Open the processor locking lever, and then open the processo r retaining bracket. 7. Remove the p rocessor sock et cover. CAUTION: THE PINS ON THE SYSTE M BOARD ARE VERY FRAG ILE AND EASILY DAMAGE D. To avoid damage to the s ystem board: • Do not touch the processor socket contacts.
Remo val and replacemen t procedures 58 8. Install the processor. Use the notches on both sides of the processor to properly align it into the socket . CAUTION: Be sure to close th e processor so cket retaining br acket before closin g the processor locking lever.
Removal an d replacement procedures 59 CAUTION: Do not overtighten the screws as this might damage the board, connectors, or screws and voids the warrant y of the board. 12. Install the heatsink: a. Position the h eatsink using the guide pin on t he processor backplate .
Removal an d replacement procedures 60 19. Lock the tow er bezel. 20. Connect ea ch power cord to the server. 21. Connect each power cord to the power source. 22. Press the Power On/Standby button. The server exits s tandby mode and applies fu ll power to the system.
Troubleshootin g 61 T r ouble shootin g T roubleshooting resources The H P ProLiant Gen8 Tr oubleshooting Guide, V olume I: Trouble shooting pr ovides procedur es for resolving common problems and c o.
Diagnostic tool s 62 D i agno sti c tools H P Insight D iagnostics HP Insight Diagnostic s is a proactive server management tool, available in both offline and online version s, that provides diag nos.
Diagnostic tool s 63 Support 7.x provides anytime, anywhere personalized acce ss to your IT environment through HP Insight Online, and is also the re commended version for H P Proactive Care Service. • HP Insight Remote Support A dvanced supports medium - sized to la rge environments with up t o 3,500 devices.
Diagnostic tool s 64 U SB support and functionality U SB support HP provides both stan dard USB 2.0 support and legacy USB 2.0 support. Standard su pport is provided by the OS through the appr opriate USB device drivers.
Component ident ification 65 C om ponen t i dentif i cati on F ront panel comp onents Item Description 1 Optical drive ( optional) 2 Media driv e bay 3 USB connectors 4 Power On/Standby button and sys.
Component ident ification 66 Front panel LEDs and b uttons Item Description Status 1 UID button/LED Solid blue = Activated Flashing blue (1 Hz/cycle per sec) = Remo te management or firmware upgrad e .
Component ident ification 67 R ear panel comp onents Item Description 1 Non - hot - plug power supply 2 Slot 4 PCIe x16 (8, 4, 1)* 3 Slot 3 PCIe x8 (8, 4, 1)* 4 Slot 2 PCIe x8 (4, 1)* 5 Slot 1 PCIe x4.
Com ponent ident ification 68 R ear panel LEDs and b uttons Item Description Status 1 NIC link LED Green = Link exists Off = No link ex ists 2 NIC status LED Green = Activi ty exists Flashing green = .
Component ident ification 69 S ystem board c omponents Item Description 1 RPS connecto r 2 Processor socket 3 System battery 4 24 - pin power su pply connector 5 Mini - SAS connector 6 SATA connectors.
Component ident ification 70 * For more informa tion on the expansion slot sp ecification s, see " PCIe expansion slot d efinitions (on page 70 )." DIMM slot locations DIMM slots a re numbered sequen tially (1 th rough 4) for the pr ocessor.
Component ident ification 71 Position Def ault Function S2 Off Off = System configu ration can be changed. On = System configuration is lock ed. S3 Off Reserved S4 Off Reserved S5 Off Off = Power - on password is enabled. On = Power - on password is disable d.
Component ident ification 72 Drive numbering • Four - bay LFF drive model • Eight - bay SFF drive mode l.
Component ident ification 73 H ot - plug drive LED definitio ns Item LED Status Definition 1 Locate Solid blu e The drive i s being identifi ed by a host applicatio n. Flashing blue The drive carrie r firmware is bein g updated or req uires an update .
Component ident ification 74 F BWC module LED definitions The FBWC module ha s three single - color LEDs (one amber and two green). Th e LEDs are duplicated on the reverse sid e of the cache module t o facilitat e status viewing. 1 - Amber 2 - Green 3 - G reen Interpre tation Off Off Off The cache module is not powered.
Component ident ification 75 F an locations Item De scription 1 Rear system fa n (fan 1, for proces sor cooling) 2 Front system fan (fan 2, for ex pansion board cooling) T-10/T-15 Torx screwdriver The ser ver includes a T - 10/T - 15 Torx scre wdriver locat ed on the side of th e media drive cage.
Cabling 76 C abling C abling overview This section provides guidelines that help you make i nformed decisions about c abling the server and hardware options to optimize performance. For information on cabling peripheral comp onents, refer to the white pa per on high - density deployment at the HP website ( http://www.
Cabling 77 S ystem fan cablin g Item Description 1 Rear system fan cable 2 Front system fan cable S torage cabling F our - bay LFF drive cabling Non-hot- plug, SATA drive support only.
Cabling 78 Item Description 1 Power cable 2 Data cable Non-hot- plug, SATA and SAS drive support Item Description 1 Power cable 2 Data cable Hot- plug, SATA drive support Item Description 1 Power cabl.
Cabling 79 Item Description 2 Mini - SAS cable Hot- plug, SATA and SAS drive support Item Description 1 Power cable 2 Mini - SAS cable E ight - bay SFF drive cabling This drive configura tion supports hot - plug SATA and SAS drives.
Cabling 80 Item Description 2 Mini - SAS cable 3 Mini - SAS cable M edia drive cabl ing • Media drives in a nonre dundant power configuration Item Description 1 Upper media dr ive power cable 2 Lowe.
Cablin g 81 • Media drive in a redu ndant power configurat ion Item Description 1 Upper media dr ive SATA cable 2 Upper media dr ive power cable P ower su pply cabling N onredundant power supply cab.
Cabling 82 R edundant power supply cabling Item Description 1 24 - pin power supply cable 2 26 - pin RPS c able 3 4- pin power supply cable (with the 8 - pin to 4 - pin adapter cable conne cted) C apa.
Specifications 83 S pec if icati ons E nvironmental spec ifications Specification Value Temperature range* Operating 10 ° C to 35 ° C (50 ° F to 95 ° F) Nonoperating - 30 ° C to 60 ° C ( - 22 ° F to 140 ° F) Relative humidity (noncondensing) Operating, maximum wet bul b temperature of 28°C (82.
Specifications 84 H P 350 W 4U Integrated Power Supply Specification Value Input requirements — Rated input voltage 100 V AC to 2 40 V AC Rated input frequency 47 Hz to 63 Hz Rated input cu rrent 6 .
Support and other resources 85 S uppo r t and othe r re s o u rc e s Before you contac t HP Be sure to have the follo wing information available before you call HP : • Active Health S ystem log (HP ProLiant Ge n8 or later products) Download and have av ailable an Active He alth System log for 3 days before the fai lure was detected.
Acronyms and ab breviations 86 A c r on y ms and abbr e v iati on s ABEND abnormal end AMP Advanced Memory Protec tion ASR Automatic Server R ecovery CSR Customer Self Re pair DDR double data rate FBW.
Acronyms and ab breviations 87 NMI nonmaskable inte rrupt NVRAM nonvolatile memory PCIe peripheral component interconnect express POST Power - On Self Test RBSU ROM - Based Setup Utility RDIMM registe.
Acronyms and ab breviations 88 UDIMM unregistered dua l in - line memory mo dule UID unit identification USB universal serial bus.
Documentation feedback 89 Doc ument ati on f eedbac k HP is committed t o providing documentati on that meets your n eeds. To help us improve the documentation, send any erro rs, suggestion s, or comments to Documentation Feedback ( mailto:docsf eedback@hp.
Index 90 A access panel 31 air baffle 32 ASR (Automatic Se rver Recovery) 64 authorized r eseller 85 Automatic Server R ecovery (ASR) 64 B bezel, tower 26 blanks 27 board components 69 C cables 76 cab.
Index 91 M management tools 62 mechanical compone nts 16 media drive bay cabli ng 80 N NMI f unctionality 71 O optical drive 32, 65 P part numbers 16 PCI expansion slots 70 phone numbers 85 power down.
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