HP (Hewlett-Packard)メーカーBL495cの使用説明書/サービス説明書
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HP Pr oL iant BL4 9 5c Gener a ti on 5 Serv er Blade Maint enance and Se r v i ce Gui de Part Number 491031-004 April 2009 (Fourth Edition).
© Copyright 2008, 2009 Hewlett-Packard Develop ment Company, L.P. The information contained herein is subject to chan ge without no tice. The only warranties for HP products and services a re set forth in the express warranty statements accompanying such produc ts and services.
Con t e nt s Customer se lf re pair ...................................................................................................................... 5 Parts only warr anty service .............................................................
External USB fu nctional ity ..................................................................................................... .......... 49 Component iden tifica tion ...........................................................................
C u st omer self r e pair HP products are designed with many Customer Self Repair (CSR) parts to minimi ze repair time and allow for greater flexibility in performing def ective parts re placement.
• Obligatoire - Pièces pour lesquelles la réparation par le client est obligatoire. Si vous demandez à HP de remplacer ces pièces, les coûts de déplac ement et main d'œuvre du service vous seront facturés. • Facultatif - Pièces pour lesquelles la réparation par le client est facultative.
NOTA: alcuni componenti HP non sono progettati per la ri parazione da parte del cl iente. P er rispe ttare la garanzia, HP richiede che queste parti siano sostituite da un c entro di assistenza autorizzato. Tali parti sono identificate da un "No" nel Ca talogo illustrato dei componenti.
anrufen und sich von einem Mitarbeiter per Telefon helfen lassen. Den Materiali en, die mit einem CSR- Ersatzteil geliefert werden, könn en Sie entnehmen, ob das defekte Teil an HP zurückgeschickt werden muss.
Centro de asistencia técnica de HP y reci birá ayu da telefónica por parte de un técnico. Con el envío de materiales para la sustitución de componente s CSR, HP especificará si los comp onentes defectuosos deberán devolverse a HP.
periode, gewoonlijk vijf (5) werkdagen, retourne ren aan HP. Het defecte onderdeel moet met de bijbehorende documentatie worden geretourneerd in het meeg eleverde verpakkingsmateriaal. Als u h et defecte onderdeel niet t erugzendt, kan HP u voor het vervangende onderdeel kosten in rekeni ng brengen.
Se r v iço de gar anti a ape nas par a peças A garantia limitada da HP pode incluir um serviço de garantia apenas para peças. Segundo os termos do serviço de garantia apenas para peças, a HP fo rnece as peças de reposição sem cobrar nenhuma taxa.
Customer self repair 12.
Customer self repair 13.
Customer self repair 14.
Customer self repair 15.
Illus tr at ed par ts catalog Server blade components Item Description Spare part number Customer self repair (on page 5 ) 1 Access panel 490819-001 Mandatory 1 2 Processors — — a) 2.3-GHz AMD Opteron™ Mod el 2356** 448035-001 Optional 2 b) 2.1-GHz AMD Opteron™ Mode l 2352* ** 448033-001 Optional 2 c) 1.
Item Description Spare part number Customer self repair (on page 5 ) f) 2.4-GHz AMD Opteron™ Model 237 8* ** 500514-001 Optional 2 g) 2.3-GHz AMD Opteron™ Mode l 2376 HE* ** 515187-001 Optional 2 h) 2.9-GHz AMD Opteron™ Mod el 2389* ** 534249-001 Optional 2 i) 2.
Item Description Spare part number Customer self repair (on page 5 ) j) QLogic QMH406 2 1GbE iSCSI BL-c Ada pter 488081-001 Mandatory 1 10 Hardware and pla stics kit 490818-001 Mandatory 1 a) Processo.
2 Optional: Optional—Teile, für die das Customer Self Repa ir-Verfahren optional ist. Diese Teile sind auch für Customer Self Repair ausgelegt. Wenn Sie jedoch den A ustausch dieser Teile von HP vornehmen lassen möchten, können bei diesem Service je nach den für Ihr Produkt vorgesehenen Garantiebedingungen zusätzliche Kosten anfallen.
Illustrated parts catalog 20.
R emo v al and r eplacement pr ocedur es Required tools You need the following item s for some procedures: • T-15 Torx screwdriver (provided inside the access panel) • Flathead screwdriver • HP Insight Diagnostics softw are (" HP Insight Diagnostics " on page 47 ) e removing them from their containers.
CAUTION: When performing non-hot-plug operatio ns, you must power down the server blade and/or the system. However, it may be necessar y to leave the server blade powered up when performing other operations, such as hot-plug instal lations or troubleshooting.
Power down the server blade Before powering down the server blade for any up grade or maintenance procedures, perform a backup of critical server data and programs. Depending on the Onboard Administrator configuration, use one of the following methods to power down the server blade: • Use a virtual power button selection through iLO 2.
3. Remove the server blade. 4. Place the server blade on a flat, level work surface. WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them.
5. Disconnect the hard drive cables. 6. Remove the hard drive. 7. Disconnect the hard drive cables from th e hard drive. Retain for future use. To replace the component, reverse the r emoval procedure. DIMM baffle To remove the component: 1. Power down the server blade (on page 23 ).
4. Disconnect the hard drive cables. 5. Remove the hard d rive (" Hard drive " on page 24 ). 6. Remove the DIMM baffle. To replace the component, reverse the r emoval procedure. DIMMs To remove the component: 1. Power down the server blade (on page 23 ).
For this procedure, removing the hard drive from the DI MM baffle is not required. 6. Remove the DIMM. To replace the component, reverse the r emoval procedure. Mezzanine card Optional mezzanine cards enable network connectivity and provide Fibre Channel support.
To replace the component: 1. Install the mezzanine card. Press down above the back side of the connector to seat the card. 2. Install the access panel (" Access panel " on page 24 ).
To replace the component, reverse the r emoval procedure. Server blade handle To remove the component: 1. Power down the server blade (on page 23 ). 2. Remove the server blade (on page 23 ). 3. Remove the access panel (" Access panel " on page 24 ).
6. Remove the release button. To replace the component, reverse the r emoval procedure. Heatsink WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them. To remove the component: 1.
To replace the component: 1. Clean the old thermal grease fr om the processor with the alcohol swab. Allow the alcohol to evaporate before continuing. CAUTION: The heatsink thermal interface media is not reusable and must be replaced if the heatsink is removed from the proces sor after it has been installed.
4. Install the heatsink. Insert both screws, and then alternate tightening until the heatsink is seated properly. 5. Install the access panel (" Access panel " on page 24 ).
5. Open the processor retaining latch and the processor socket retaining bracket. 6. Using your fingers, remove the failed processor. To replace the component: CAUTION: The pins on the processor s ocket are very fragile. Any damage to them may require replacing the system board.
1. If the processor has separated from the installation tool, carefully re-insert th e proces sor in the tool. 2. Align the processor installation tool with the socket and install the processor. CAUTION: The processor is design ed to fit one way into the socket.
3. Press down firmly until the processor in stallation tool clicks and separates from the processor, and then remove the processor installation tool. 4. Close the processor retaining bracket and the processor retaining latch. 5. Clean the old thermal grease fr om the heatsink with the alcohol swab.
CAUTION: To avoid damage to the system board, processor soc ket, and screws, do not overtighten the heatsink screws. Use the wren ch supplied with the system to reduce the possibility of overtightenin g the screws. 7. Install the heatsink. Insert both screws, and then alternate tightening until the heatsink is seated properly.
2. Remove the server blade (on page 23 ). 3. Remove the access panel (" Access panel " on page 24 ). 4. Remove the battery tray. To replace the component, reverse the r emoval procedure. System board To remove the component: 1. Power down the server blade (on page 23 ).
11. Open the processor retaining latch and the processor socket retaining bracket. 12. Using your fingers, remove the processor from the failed system board. CAUTION: To avoid damage to the system board: • Do not touch the processor socket contacts.
13. Remove the system board assembly. To replace the system board: 1. Install the spare system board assembly. 2. Prepare the processor socket on the spare syst em board: Removal and replacement proce.
a. Remove the processor socket protective cover. b. Open the processor retaining latch and the processor socket retaining bracket. 3. Install the processor socket cover onto the pr ocessor socket of the f ailed system board. 4. Install the processor on the spare system board.
5. Close the processor retaining latch and th e processor socket retaini ng bracket. 6. Clean the old thermal grease fr om the heatsink an d the top of the processor with the alcohol swab.
8. Install the heatsink (" Heatsink " on page 30 ). 9. Install all components removed fr om the failed syst em board. IMPORTANT: Install all components with the same co nfiguration that was used on the failed system board. After you replace the system board, you must re-ent er the server serial number and the product ID.
WARNING: The computer contains an internal lithium manganese dioxide, a vanadium pentoxide, or an alkaline battery pack. A risk of fire and burns exists if the battery pack is not properly handled. To reduce the risk of personal injury: • Do not attempt to recharge the battery.
C abling Hard drive cabling CAUTION: When routing cables, always be sure th at the cables are not in a position where they can be pinched or crimped. Using the HP c-Class Blade SUV Cable The HP c-Clas.
Numerous configurations are possible. This sectio n offers tw o possible co nfigurations. For more information, see " USB support and functionality (on page 49 )." Accessing a server blade with local KVM For this configuration, a USB hub is not necessary.
1. Connect the SUV cable to the serv er blade. 2. Connect the video connector to a monitor. 3. Connect a USB hub to one USB connector. 4. Connect the following to the USB hub: o USB CD/DVD-ROM drive o.
Diagno s tic tools Troubleshooting resources The HP ProLiant Servers Trouble shooting Guide provides procedures for resolving common problems and comprehensive courses of action for fault isolation and identification, error message interpretation, issue resolution, and software maintenance on ProLiant servers and server bl ades.
This functionality supports o perating systems that may not be supported by the server blade. For operating systems supported by the server blade, see the HP website ( http://www.
Redundant ROM support The server enables you to up grade or configure the ROM safely with redundant ROM support. The server has a 4-MB ROM that acts as two, separate 2-MB RO Ms. In the standard implementation, one side of the ROM contains the current ROM program versi on, wh ile the other side of the ROM contains a backup version.
C ompone nt i dentif icati on Front panel components Item Description 1 Local I/O conn ector 2 Serial label pull tab 3 Server blade handle button 4 Power On/Standby button 5 Server blade handle Compon.
Front panel LEDs Item Description Status 1 UID LED Blue = Identified Blue flashing = Active remote management Off = No active remote management 2 Internal health LED Green = Normal Flashing = Booting .
System board components Item Description 1 DIMM slots 2 Hard drive data connect or 2 3 Hard drive data connector 1 4 Hard drive power connector 1 5 Hard drive power connector 2 6 Internal USB connecto.
System maintenance switch Position Function Default 1* iLO 2 security override Off 2 Configuration lock Off 3 Reserved Off 4 Reserved Off 5* Password disabled Off 6* Reset configuration Off 7 Reserved Off 8 Reserved Off *To access redundant ROM, set S1, S5, and S6 to ON.
Accessing the redundant ROM If the system ROM is corrupt ed, the system automatica lly switches to the redundant ROM in most cases. If the system does not automatically switch to th e redundant ROM, perform the foll owing steps: 1. Power down the server blade (on page 23 ).
Sp e c i fic a t io n s Environmental specifications Specification Value Temperature range* Operating 10 ° C to 35 ° C (50 ° F to 95 ° F) Shipping -40 ° C to 60 ° C (-40 ° F to 140 ° F) Storag.
A c r on y ms and a bbr e v i ati ons CSR Customer Self Repair HP SIM HP Systems Insight Manager iLO 2 Integrated Lights-Out 2 IML Integrated Management Log ISEE Instant Support Enterprise Edition OSE.
WEBES Web-Based Enterprise Service Acronyms and abbreviations 57.
Inde x A access panel 24 Array Diagnostic Utility (ADU) 48 B baffles 25 battery 16, 42 buttons 50 C cables 44 cabling 44 cautions 21 component identification 50, 52 components 50, 52 conne.
system battery 42 system board 37 system components 21, 50 system maintenance switch 52, 53 T tools 21, 47 Torx screwdriver 21 troubleshooting 47 U USB connectors 52, 54 USB support 49 utiliti.
デバイスHP (Hewlett-Packard) BL495cの購入後に（又は購入する前であっても）重要なポイントは、説明書をよく読むことです。その単純な理由はいくつかあります：
HP (Hewlett-Packard) BL495cをまだ購入していないなら、この製品の基本情報を理解する良い機会です。まずは上にある説明書の最初のページをご覧ください。そこにはHP (Hewlett-Packard) BL495cの技術情報の概要が記載されているはずです。デバイスがあなたのニーズを満たすかどうかは、ここで確認しましょう。HP (Hewlett-Packard) BL495cの取扱説明書の次のページをよく読むことにより、製品の全機能やその取り扱いに関する情報を知ることができます。HP (Hewlett-Packard) BL495cで得られた情報は、きっとあなたの購入の決断を手助けしてくれることでしょう。
HP (Hewlett-Packard) BL495cを既にお持ちだが、まだ読んでいない場合は、上記の理由によりそれを行うべきです。そうすることにより機能を適切に使用しているか、又はHP (Hewlett-Packard) BL495cの不適切な取り扱いによりその寿命を短くする危険を犯していないかどうかを知ることができます。
ですが、ユーザガイドが果たす重要な役割の一つは、HP (Hewlett-Packard) BL495cに関する問題の解決を支援することです。そこにはほとんどの場合、トラブルシューティング、すなわちHP (Hewlett-Packard) BL495cデバイスで最もよく起こりうる故障・不良とそれらの対処法についてのアドバイスを見つけることができるはずです。たとえ問題を解決できなかった場合でも、説明書にはカスタマー・サービスセンター又は最寄りのサービスセンターへの問い合わせ先等、次の対処法についての指示があるはずです。
