HP (Hewlett-Packard)メーカーHP RP7405/7410の使用説明書/サービス説明書
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User Gu ide hp r p74 05/7410 Ser vers T hird E di tio n Manufacturing P art Number: A6752-96008 21102 USA © C opy right 2002.
ii Legal Noti ces The inf orm at ion in thi s docu me nt is s ub ject to cha nge wit ho ut n ot ice. Hewlet t-P ac kard makes n o warr an ty of any kind wit h rega r d to th is manual, in cluding , b u t n ot l imited to , th e impl ie d warra nties of mer chantabi lity and fitn ess for a partic ular purpose .
Con tents iii 1. Introd u ction hp rp7405/rp 7410 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Cell Boa rd . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Con tent s iv Replaci ng the T op Cov er . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62 Re m ovin g and Replaci ng a D isk Dri v e . . . . . . . . . . . . . . . . . . . . . .
Con tents v Aco u st i c No ise S pecific ation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98 Air Flow . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Con tent s vi.
Ta b l e s vii T a b le 1 . Revisions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . viii T a b le 1 -1. hp rp7405 Servers . . . . . . . . . . . . . . . . . . . . . . .
Ta b l e s viii.
Fig u r e s ix Fi g ure 1 . Declaration of Conformity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . xi Fi g ure 2 . Ja p anese RF I . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Fig u r e s x Fi g ure 4 -2. T op Cover R etaini ng Screws . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62 Fi g ure 4 -3. D isk Driv e L o c ation . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Pref ace.
viii Revisi on History T able 1 Revisions Re visi on P art N umbe r Re le ase Dat e Des crip tio n Third A675 2-96008 Novem ber 20 02 Corrected power cord and powe r reqirements se ction.
ix Nota tional Conve ntions W ARNING W arn ings high li ght p roc edur es or in form ati on ne cess ar y to a void in jury t o pe rso nne l. Th e wa rnin g sh ould te ll t he r ead er ex actl y wh at w ill res ult fro m what acti ons and ho w t o a void the m.
x Safe ty and R egulator y Regula tory Model: RSVLA-0102 F or y our protecti on, thi s product has b een teste d to var i o u s na t io nal and i nternation al regul ations a nd sta n dar ds.
xi Fi gure 1 Declar ation of Conformity.
xii USA R adio Fr equency Int erference FCC N otice The F ederal Communicatio n s Commission (in 47 CFR P art 15 s ubpart B) has specified that the following notic e be brou gh t to th e atten tio n o f th e u sers of t his prod uct.
xiii Kore an RF I Sta te ment Certi fication Nu mber: E - AA AAA - BB - CCCC • E: EMC r egistrati on • AAAAA: equipmen t codes (RRL notice, 2000.10.
xiv BSM I (T aiwan A rea) This produ ct is fully compliant to CN S 13438 (CISPR 22: 1993) Class A. Th e EMC label is in the fo rm shown in Figure 4. Fi gure 4 T aiwan Area EMC NO TE Electric al practices an d sugges tions in th is gu ide are based on No rth American practices.
xv Install a tion Con ditions See inst allation instruc t ions before conne cting this equipment to the input supply . V oir la noti ce d ’i nsta l lati on avan t d e ra ccor d er au rése au . W ARNING NO RD IC Class 1 Eq uipment Denma rk: Før til slutni ng af de øvri ge leder e, se medf ø l g ende inst allations vejlednin g .
xvi Li thium Bat tery C autio n W ARNING O bserve t h e corr ect polari ty when c h angin g the lithiu m battery . There is a dange r of exp l osio n i f ba tt ery is in sta lle d in c orre ct ly . Repla c e on ly with the same or equi v alen t type recommend ed by the manufactu r er .
xvi i Laser Safety NO TE If a Fibre Ch annel I /O card i s presen t , t he follow ing laser safety statement appl ies . This prod u ct contains a laser inter nal to the Op tica l L in k Modu le (OLM) for conn ecti on to the Fibre com mu ni c atio ns p ort .
xviii.
Chapter 1 1 1 Introduction The hp rp7410 is a memb er of Hewle tt-P ac kard’ s bu sin ess-critical com puting platfo rm family : a mid-range, mid- volume serv er , positi oned as an upgr ade to the cu rrent N -Class p roduc t in th e PL-1X p ro duct line.
Chapter 1 Introducti on hp rp7405/rp7410 Overvie w 2 hp rp 74 05/r p741 0 Over vi ew The hp rp74 05/rp7410 is a 10U , 8-way SM P , rack-mount se rver th at accomm odate s up to 32 G B of memo ry (64 GB available at a late r date); PCI-4X I/O; and intern al periph erals in cludin g disks and DVD/tape .
Chapter 1 Introduction hp rp7405/rp7410 Overvie w 3 Figure 1 -2 hp r p7405/r p7 410 Ser ver (w ithou t fro nt b ezel) Improvem ent s o ver its pred ecess or , N4000, include: • Be tter availa bility.
Chapter 1 Introducti on hp rp7405/rp7410 Overvie w 4 Sys tem B ack pl ane The syst em backp lan e compr ises th e syste m clock g ene rati on logic, the sys tem reset ge ner ation logic, DC- to -DC con ve rt ers, p ow er m on it or lo gic, an d t w o L o ca l Bu s a da pto r (LBA ) l i nk- to -PCI con ve rte r A S IC s.
Chapter 1 Introduction hp rp7405 Servers 5 hp rp 74 05 Se rver s Hewle tt-P ackar d offers a c o st-effective server based on the hp rp7410 by employ ing a r ed uced numbe r of proc essors , memory , core I/O, or po wer suppl ies as i ndicated i n T able 1-1.
Chapter 1 Introducti on Detai led hp rp7405/rp7410 Description 6 Det ail ed h p rp74 05/ rp74 10 De scri ptio n Fi gure 1-3 hp rp7 4 10 8-W ay B lock Diagram.
Chapter 1 Introduction Detailed h p rp7405/rp741 0 D escription 7 Cell Board The cel l bo ard c ontai ns the proces sors , mai n memo ry , and t he c ell cont rol ler (CC) A SIC t hat inte rfa ces th e proc es sors an d memory t o the off-board I/ O. Sh ow n in Fig ure 1 -4 is the CC .
Chapter 1 Introducti on Detai led hp rp7405/rp7410 Description 8 The h p r p7405/rp74 10 h as a 48V d istribut ed po wer system a nd receives t he 4 8V p ower from the syste m bac kplane board. The cell boar d cont a ins DC-to- D C converter s to gen erate the required volt age rails .
Chapter 1 Introduction Detailed h p rp7405/rp741 0 D escription 9 PDH Ri ser Bo ar d The PD H ris e r bo ard is a dau gh t er car d for the cel l boa rd .
Chapter 1 Introducti on Detai led hp rp7405/rp7410 Description 10 In th e singl e nP artit ion case , if two ce lls are present, e ither c e l l may be the root cell, assuming t he both cells have M P C ore I/O fun ction ality p res ent. If only one ce ll is p res ent, th at c ell is t he roo t cell ( an d sh ould be c ell 1).
Chapter 1 Introduction Detailed h p rp7405/rp741 0 D escription 11 Sys tem B ack pl ane The syst em backp lan e compr ises th e syste m clock g ene rati on logic, the sys tem reset ge ner ation logic, DC- to -DC c onv ert er s, pow er mon ito r lo gic, and two LBA lin k- to -P CI conv er te r ASI Cs .
Chapter 1 Introducti on Detai led hp rp7405/rp7410 Description 12 . Fi gure 1-9 I/O Subsys tem Architecture The s erver s upports two inte rnal SBAs . The SBAs gener ate 32 ro pe bus ses (16 p er SBA).
Chapter 1 Introduction Detailed h p rp7405/rp741 0 D escription 13 This concep t allows m axim um connect ivity for mainstr eam 5V -only , 33 MHz, 32 bit (PCI-1x) and 64-bit (PCI-2x ) ca rds, as we ll as f ull I/O ban dwidth ut ilizati on thro ugh t he u se o f 64-bit , 66 M Hz (P CI-4 x) univ ersal car ds.
Chapter 1 Introducti on Detai led hp rp7405/rp7410 Description 14 Mas s S torag e ( Disk) Bac kpl ane Internal m a ss storage co nnections (to dis ks) are ro uted on th e mass st orage backpla ne, having c onnec tors a nd termin ation logi c . A ll dis ks ar e h ot plu ggable.
Chapter 1 Introduction Detailed h p rp7405/rp741 0 D escription 15 Figure 1 -10 Right-Front View of hp rp7 405/rp7 410 The PCI I/O car d sec tion, l ocat ed tow ards the rea r , i s ac cess ed by remo vin g the to p co ver . The PCI OLR fan mo dules ar e located i n front of the P CI cards .
Chapter 1 Introducti on Detai led hp rp7405/rp7410 Description 16 Cell boards ar e access ed from th e right s ide of t he chass is behind a removab le side cover .
Chapter 2 17 2 Install ation.
Chapter 2 Ins t a lla ti o n Unpac king the Server 18 Unpac king the Se rver Hewlett -P ackard shippi n g cont a iner s are design ed to protect their cont en ts under norma l shippin g cond i tion s. Af ter th e equipmen t a r ri v es , carefu lly ins pect eac h carton f or sig n s of shippi ng damage.
Chapter 2 Ins t a lla ti o n Unpacki ng the Server 19 CA UTION T he plastic wrappin g ma teri al shoul d be cut off rather than pulled off . Pulling the pla st ic cove ring off re pres ent s an ESD haz ard.
Chapter 2 Ins t a lla ti o n Unpac king the Server 20 Step 5. Remove four bo lts h old ing do wn t he r amps and remo ve the ra mp s . See F igure 2-2.
Chapter 2 Ins t a lla ti o n Unpacki ng the Server 21 Step 6. Remove the six bolts from the base attac h ing the rack to the pall et. See Figu r e 2-3.
Chapter 2 Ins t a lla ti o n Unpac king the Server 22 Se curi ng th e Ca bi net Once in p osition , se cure an d sta b ilize th e ca binet usin g the leveli ng feet at th e cor ners of th e base a nd in stall the a nti-tip mechanisms on the bot tom fron t and r ear of th e rack.
Chapter 2 Ins t a lla ti o n Unpacki ng the Server 23 Fi gure 2-5 RONI Lifter Step 1. F ollow the in s tr u ctio ns on the out s ide o f the serve r packaging to remove the bandi ng and carto n top f r om the server pal l et. Fi gure 2-6 Server with Shipping Box Removed Step 2.
Chapter 2 Ins t a lla ti o n Unpac king the Server 24 Step 3. Observe Figure 2-7. Remove the two foam c ushion for lift access. Fi gure 2-7 Remove Cushions for Lift Access Step 4. In sert the lif ter f orks un der the se rver . Step 5. Careful ly roll the lift forward until it is fully p osition ed aga inst the sid e of the server .
Chapter 2 Ins t a lla ti o n Unpacki ng the Server 25 Step 6. Slowly raise the se rve r off the palle t un til it clears th e pallet c ush ions. Fi gure 2-8 Raising a Server Off the P alle t Step 7. Roll the l i f t er an d serve r awa y from the pa l le t .
Chapter 2 Ins t a lla ti o n Unpac king the Server 26 U nload ing w ith Lif t Ha ndle P an els W ARNING Use thi s pr oc edu re o nly if no He wl ett -P a ckar d a ppr ov ed l i ft is av ail abl e. Thi s proced ure should on ly be attempt ed by two (2) a uthorized Hewl ett-P ackar d service pe ople.
Chapter 2 Ins t a lla ti o n Unpacki ng the Server 27 Step 4. Wi th one h andle in each hand , ins t all t he pin en d of t he panel i nto the backside of the front ra ck moun t ears on the chas s is . F igure 2-1 1 Insertin g the Pins In to the Rack Step 5.
Chapter 2 Ins t a lla ti o n Unpac king the Server 28 Step 6. Contin ue to pull the handle s apart unt il the sp rin g plun ger sn ap s into fina l positio n. T he sprin g plunger will drop down into t h e re cess posi tion. Step 7. Chec k that the handl es are s ecure by pressing the handl es toget her and mov ing back and forth .
Chapter 2 Ins t a lla ti o n Unpacki ng the Server 29 In stall ing th e Cable Ma nage ment A rm (CMA ) Once the serv er is i nstalled i n the rac k, the CMA mu st be inst alled on t he rear of the s erver .
Chapter 2 Ins t a lla ti o n Unpac king the Server 30 Step 2. Attach the othe r end of the CM A to the server using the thum b scre ws that cam e with the CM A. F igu re 2-1 6 Att achi ng CM A to the S er ver Insta lli ng Add- O n Produc ts This sectio n explains load or ders and dependencies for add-on product s.
Chapter 2 Ins t a lla ti o n Unpacki ng the Server 31 Embe dded Disks The hp rp74 05/rp7410 s erver can opera te in the diskles s (LAN boot) m ode. If disks are t o be install ed, the to p two disk s are driv en by the prim ary MP Core I/O set. Install th e first embed ded disk in the top left locatio n.
Chapter 2 Ins t a lla ti o n Unpac king the Server 32 Proce sso rs Each cell board can h ol d up to f our proc essors . Proc essor slot s are n u mber ed 0-3. In stall p rocesso r s in ascen ding orde r: slot 0, 1, 2 , and 3. It i s not ne cessary t o balan ce the nu mber of proc essors a cross b oth cell boards.
Chapter 2 Ins t a lla ti o n Unpacki ng the Server 33 Differe nt d en sities of mai n DIMM s c an be mixe d w ith in a s yst em, but ea ch set o f four D IMMs m ust be ident ical. A se t of D IMM s is def ined as t he group o f four DIMMs that must be loaded t ogether on a cell board.
Chapter 2 Ins t a lla ti o n Connect ing A C Input P o wer 34 Connect ing AC I nput P ower The hp rp7405/ rp7410 has five line cord configu rations: • All fou r line cord s • Cords A0 and A1 o nly • Cords B0 and B1 o nly • Cords A0 and B0 o nly • Cords A1 and B1 o nly A s ing le-line -cor d con figu ration is n o t a llowed .
Chapter 2 Ins t a lla ti o n Connecti ng A C Input Po wer 35 If two separ ate powe r source s are availab le, the two powe r supp lies can be plugge d into the separate powe r sour ces, increasin g sys tem r eliabili ty sho uld one powe r sourc e fail.
Chapter 2 Ins t a lla ti o n MP Core I/O Connections 36 MP Core I/O Con nectio ns Each hp rp740 5/rp7410 c an have up to two MP Co re I/O boar d sets ins talled. This allow s for tw o partition s to be opera ting, or allows for MP Core I/O redun dancy in a sin gle pa rtition config uratio n.
Chapter 2 Ins t a lla ti o n MP Cor e I/O Con nections 37 Setti ng Up t he CE T o ol (P C) The CE T ool is usuall y a l apt o p. It allows c ommunication with th e Management Processor (MP) in th e hp rp740 5/rp7410. The MP mo nitors the activity of e ithe r a one p artiti on or a mul tiple p artiti on c onfigura tion.
Chapter 2 Ins t a lla ti o n MP Core I/O Connections 38 If t he CE T ool is a laptop usi ng Reflect ion 1, check or chang e these co mmunications settings using t h e follow ing procedure: 1. From the Reflect i on 1 Ma in screen , pull down the Co nne ctio n menu an d selec t Co nne ctio n Se tup .
Chapter 2 Ins t a lla ti o n MP Cor e I/O Con nections 39 On the front of the hp rp74 05/rp7410, a solid green Sta n db y Pow er , a solid gree n MP Present , and a flashing amber Att enti on light will illu m inate after abo ut 30 seco nds. Fi gure 2-22 Fron t P anel Display 2.
Chapter 2 Ins t a lla ti o n MP Core I/O Connections 40 The M P Main Menu appears: F igure 2 -2 3 MP Main Me nu Config uri ng LAN Info rma tion for the MP T o set the M P LAN I P address : 1 . At t he MP Mai n Men u p rom p t ( MP > ), en t er cm. F r om th e MP Command Menu promp t ( MP: C M> ), ente r lc (for L AN c onfi gur at ion) .
Chapter 2 Ins t a lla ti o n MP Cor e I/O Con nections 41 Enter lc and pr ess t h e Return key . The followin g screen appears: Figure 2 -24 Th e lc C om ma nd S creen NO TE The value in the “IP a ddress ” fi eld has been set at the fa ctory . The c ustomer mu s t provide the actual LAN IP address .
Chapter 2 Ins t a lla ti o n MP Core I/O Connections 42 1 0. A sc reen sim ila r to t he follo wing w ill a ppear a llowin g verific ation of the se ttings: Figure 2 -25 T he ls Com man d S cre en T o retu rn to the MP ma in menu, ente r ma . T o exit th e MP , enter x at the MP ma in menu.
Chapter 2 Ins t a lla ti o n MP Cor e I/O Con nections 43 The du co mma nd displays the M P Bus topo logy . A s cre en similar to the follo wing ap pears: Figure 2-26 The du Com ma n d S cree n 3. T here will be an aster isk (*) in the colu mn m arke d MP .
Chapter 2 Ins t a lla ti o n P ower ing On the hp rp7405/rp7410 Ser ver 44 P ow eri ng On the h p rp 74 05/rp 7410 Serv er Afte r powerin g on the M an ageme nt Proc esso r (MP) (+3.3 V HK P), and checki ng that the MP detec ts th e pres en ce of the c ell boar ds, power up t he ser v er .
Chapter 2 Ins t a lla ti o n Selecti ng a Boot Partit ion using the Management Processor 45 Sele cting a Boot P artitio n usi ng the Man agement P ro cessor At this point in the install ation process .
Chapter 2 Ins t a lla ti o n V erif ying t he System Configuratio n using Boot C onsole Handler (BCH) 46 V erify ing the Syste m Configurat ion using Boot Console Ha ndler (B CH ) From th e BCH main m enu , type in to go t he Inf orm at ion M enu.
Chapter 2 Ins t a lla ti o n Bootin g HP-UX using Boo t Console Handl er ( BCH ) 47 Boo ting HP- UX usin g Boo t Consol e Handl er (BCH) If Instan t Ignit ion was order ed, HP-U X will h ave been ins talled in the fact ory at the P rimar y P ath addre ss.
Chapter 2 Ins t a lla ti o n Booti ng HP-UX using B oot C onsol e Hand ler ( B CH) 48.
Chapter 3 49 3 T roubleshooti ng.
Chapter 3 T roub leshooting Common Instal lation Pr oblems 50 Common Insta llation Probl ems The follo w ing sec tions contain general proce dur es to help yo u locat e installa tio n proble ms. CA UTION Repl ace the top cov er befor e operating the ser v er , even for a shor t time .
Chapter 3 T r oub l eshooting Common Install ation Pro ble ms 51 9. Boot the server and if it does not function proper ly , refer to the followi ng proce du res . The Se rv er Do es No t P ow er On Use these st eps to check for power related problems: 1.
Chapter 3 T roub leshooting Common Instal lation Pr oblems 52 Bulk P o wer Su pply LE Ds Ther e is a single three-col or LED on ea ch bulk power supply . PCI P ower Supp ly LEDs Ther e are three LEDs on the PCI power supply . G reen and yello w LEDs follow OL* operati on .
Chapter 3 T r oub l eshooting Common Install ation Pro ble ms 53 Syste m, Stand by , and I/O F an LEDs Ther e is a single three-col or LED on ea ch Syst em, St a ndby , and I /O F an. SINC POST L EDs The four SINC PO ST LEDs (Green) d isplay the cur rent sta te of t h e SINC firmw are.
Chapter 3 T roub leshooting Common Instal lation Pr oblems 54 OL * LE D s PC I/C el l LE D OL* MP Co re I/O LEDs The MP Core I/O LED s are locat ed on the MP Cor e I/O Pa nel. T able 3-6 OL* LEDs Loca t ion LE D Driv en B y St ate De sc rip tion Chas sis Beside Cell and On Cell Cell Boa rd P o wer C ell LP M On Gr een 3.
Chapter 3 T r oub l eshooting Common Install ation Pro ble ms 55 LA N/SCSI ( PCI Sl ot) LEDs The LAN/SCSI LEDs a r e located on t h e PCI P anel . Management Processor Active SP On Gr een Ser v ic e Proces s or o n this MP Core I/ O Board is man aging box .
Chapter 3 T roub leshooting Common Instal lation Pr oblems 56.
Chapter 4 57 4 Remov al and Rep l acement.
Chapter 4 Removal and R eplacement Sh ut tin g Down nP ar titions and Po wering O ff Har dwar e Component s 58 Shut ting Down nP art itions an d P o wering Off Ha rdware Compone nts When y ou r emove and replace hardware you ma y nee d to shut dow n one or more nP artiti ons on t h e s erv er .
Chapter 4 Remov al and Replacement Shutt ing D o wn nP art it i ons and P oweri ng Of f Har dware Componen ts 59 F or exampl e, th e shu tdo wn -h 240 comm a nd will sh ut dow n and ha lt HP-U X on the nPartiti on after w a iting for a g r ace period of four minu tes (240 secon ds).
Chapter 4 Removal and R eplacement Sh ut tin g Down nP ar titions and Po wering O ff Har dwar e Component s 60 Step 9. Use the MP Command menu’ s PE com mand t o po wer on th e hard wa re co mpone nt th at you p owere d off. Step 10. Use the MP Command menu’ s PS command to confirm the stat us of the newly replac ed compon ent.
Chapter 4 Remov al and Replacement Remo ving and R eplaci ng the T op Cover 61 Remov ing and Repla cing the T op Cover It i s necessary to remov e and repl ace one or more of the c overs to access t he components w ith i n th e serve r chassis. CA UTION Observe all ESD safe ty p recau tions be fore atte mptin g this proced ure.
Chapter 4 Removal and R eplacement Remo ving and R eplaci ng the T op C over 62 Rem ovi ng th e T op C ove r Fi gure 4-2 T op Cover Re taining Scr e ws Step 1. Loos en the retain ing screws securin g the cover to the rear of the chassis . Step 2. Sli de the cover tow ard th e rear of the ch assis .
Chapter 4 Remov al and Replacement Removing and Replaci ng a Disk Drive 63 Remov ing and Repla cing a Disk D rive The disk dr ives are loca t ed i n the fr ont of the c hassis . T h e nPar tition mu st be shutdown t o re mov e or repla ce the driv e th at serves as t he boot disk .
Chapter 4 Removal and R eplacement Remo ving and R eplaci ng a Disk D rive 64 Rem o vi ng a Di sk Dr i ve Figure 4-4 Disk Drive Det ail Step 1. Disen gage th e front lockin g latch on the disk drive by pushin g the releas e tab to the right an d the latch lev er t o th e left.
Chapter 4 Remov al and Replacement Removing and Replaci ng a Disk Drive 65 #pvcre ate #vgcfg rest ore.
Chapter 4 Removal and R eplacement Remo ving and R eplaci ng a CD/D V D Drive 66 Remov ing and Repla cing a CD/ DVD Driv e The CD/D VD is located i n the front of the chas sis. The system power to this compo nent must b e removed before attemp ting t o remo ve or replac e it.
Chapter 4 Remov al and Replacement Rem o vin g and Rep l aci ng a CD/ D V D Dr ive 67 Removing a CD/DVD Drive Fi gure 4-6 CD/DVD Detail Step 1. T o r emove the CD/D VD, depr ess the front lockin g latch to loosen the driv e from the chassi s. Step 2. Dis en gage the cables from t he rear of the CD/DVD .
Chapter 4 Removal and R eplacement Remo ving and R eplaci ng a CD/D V D Drive 68 R eplac ing a C D/DV D Fi gure 4-7 CD/DVD Detail Step 1. Conn ec t the cabl es t o the rea r of the CD /DVD .
Chapter 4 Remov al and Replacement Remo ving and Replacing a Fr ont Smart Fan Assembl y 69 Remov ing and Replaci ng a F ront Smart F an A ssembly The Fron t Smart F an A sse mbly is lo cated in the front of the chassis. The fan assem bly is a hot swapp able compon en t.
Chapter 4 Removal and R eplacement Remo ving and R eplaci ng a Fr ont Smar t F an Assemb ly 70 Rem ovi n g a Fron t S m art F a n A ss em b ly F igure 4-9 F ront F an Detail Step 1. Push th e F an Releas e Pin away from the fan. Step 2. Sli de t he fan awa y f r om the connector .
Chapter 4 Remov al and Replacement Remo vi ng and Replacin g a Rear Smart F an A ssembly 71 Remov ing and Repla c in g a Rea r Smar t F an A ssembly The Re ar S mart F an As semb ly is loc ated in t he r ear o f th e chass is. The F an ass em bly is a h ot swappa ble compon en t.
Chapter 4 Removal and R eplacement Remo ving and R eplaci ng a Rear S m ar t Fan Assembl y 72 R emovin g a Rear S mart F an Ass embly Fi gure 4-11 Rear F an Detail Step 1. Push th e F an Releas e Pin away from the fan. Step 2. Sli de t he fan awa y f r om the connector .
Chapter 4 Remov al and Replacement Remo vi ng and Replacin g a PCI Smart F an A ssembly 73 Remov ing and Repla c in g a PC I Smart F an Assembl y The PCI Smart F an Ass embly is lo cated in the rea r of th e PCI cardcag e. T h e F an ass embly is a hot s wappable compon en t.
Chapter 4 Removal and R eplacement Remo ving and R eplaci ng a PCI S m art Fan Assembl y 74 Rem ovi ng a P CI S m art F a n As se mbl y Fi gure 4-1 3 PCI Smart F an Assemb ly Detail Step 1. Secu rely grasp the two thu m b holds o n the fan asse mbl y .
Chapter 4 Remov al and Replacement Removing and Replaci ng a Bulk P o wer Suppl y 75 Remov ing and R epla cing a Bulk P owe r Suppl y The b ul k power s upply is loc ated in the fro nt of t h e chassi s. Th e BPS i s a hot sw appable c omponent. CA UTION Observe all ESD safe ty p recau tions be fore atte mptin g this proced ure.
Chapter 4 Removal and R eplacement Remo ving and R eplaci ng a Bul k P ower Su pply 76 Rem o vi ng a BP S Fig u r e 4 -1 5 B P S D et ai l Step 1. Pull the ext r ac tion leve rs locate d on the u pper front outer po rtion of the BPS . Step 2. Sli de t he BPS forwa r d using the extracti ons levers to remove it from the chass is.
Chapter 4 Remov al and Replacement Removing and Repl acing a PCI Po wer Module (Bric k) 77 Remov ing and Repla cing a PCI P ower Modul e (Bri ck) The PCI power modu le is located in the fr ont of t he chassis . The PCI power module is a hot pl uggable compon en t.
Chapter 4 Removal and R eplacement Remo ving and Replacing a PCI P ower M odule (Bric k) 78 Removing a PCI P ower Module (Brick) F igure 4-17 PCI P ower Module Detai l Step 1. Secu rely grasp the han dle on the front of the p ower m odule. Step 2. Firmly d epre ss the secu ring thu mb latch .
Chapter 4 Remov al and Replacement Remo vi ng and Replaci ng the PCI V ol tage Regul ator Modu les 79 Re mo vi ng a n d R epl ac in g t h e P CI V ol tag e R eg ula t or M od u le s Removing PCI VRM Step 1. P owe r down server . IMPOR T ANT Power mus t b e remo ved from both P CI Chassi s 0 and PCI C hassis 1 to continue.
Chapter 4 Removal and R eplacement Remo ving and Replacing t he PCI V oltage R egulator Modules 80 Step 4. Pu t rig ht s ide cove r ba c k onto cha ss is.
Chapter 4 Remov al and Replacement Removin g and Repl acing a PC I C ard 81 Remov ing and Repla cing a PCI C ard The PCI car d s are loca te d in t h e rear of t he cha s sis in t he PC I car d cage. PC I ca rds a r e hot sw app ab le compon en ts . CA UTION Observe all ESD safe ty p recau tions be fore atte mptin g this proced ure.
Chapter 4 Removal and R eplacement Remo ving and R eplaci ng a PCI C ard 82 Step 3. W ai t fo r SA M t o co m ple te its cr iti c al re sou rce an al ysi s fo r th e sel ec te d c a rd and th en r evie w th e analysis r esults.
Chapter 4 Remov al and Replacement Removin g and Repl acing a PC I C ard 83 Step 13. Connec t all cables to the replac emen t PCI card. Step 14. In SAM’ s Re place Card wi ndow , cl ick th e OK b utton . SAM p owers th e PCI slo t ba ck on, and tu rn s off (stop s blink ing ) the slot’s atte ntion indic ator .
Chapter 4 Removal and R eplacement Remo ving and R eplaci ng the M ass Stora ge Backpl ane 84 Remov ing and Repla cing the Mas s Storag e Backplane Removi ng the Bac kpla ne Step 1. Rem ove all intern al dis ks. F igure 4-21Locating In ternal Dis k s Step 2.
Chapter 4 Remov al and Replacement Removing and Replacing the Mass Storage Backpl ane 85 Ens u re t hat yo u not ice wher e each i s remov ed, so t hat th ey may be corr ectly r einstalled . Fi gure 4-22Locating the Mass Storage Backplan e Step 5. Uns c rew the two captive screw s and remove back plane/b racket assembl y .
Chapter 4 Removal and R eplacement Remo ving and R eplaci ng the M ass Stora ge Backpl ane 86 R eplac ing t he Back plan e Step 1. Align and pr ess the backplan e/br acke t asse mbly in to it s mou nt. Step 2. F asten the two captiv e screws . Step 3.
Chapter 4 Remov al and Replacement Remo ving and Replacing a MP/S C SI Boar d 87 Remov ing and Repla cing a MP/S CSI Bo ard The M P/SCS I boar d is locate d in the r ear of th e c hassis. The MP/SCSI bo ard is a h ot plu ggable com ponent. Ther e may be up to two M P/SCSI boards install ed in a system.
Chapter 4 Removal and R eplacement Remo ving and R eplaci ng a MP/SCSI Board 88 Removing a MP/SCSI board Fig u r e 4 -2 5 M P / S CS I D e ta i l Step 1. Label an d r emove all c ables con nected to t he M P/SCSI bo ard to be re moved. Step 2. Loos en the two retain i ng screw s securin g the MP/SCSI board to the chassis .
Appendi x A 89 A Rep la c ea bl e P a rt s.
A ppe ndi x A Replaceab le Par ts 90 T able A- 1 hp rp74 05/r p7410 Fi eld Rep lace able U nit (F RU) Lis t FRU Description Re placement P art Numbe r Exc han ge P art Numbe r 18GB 10K RP M SCSI D isk A6537-67001 A6537-69001 1GB DIM M (single) A6098AX A6098-69 001 240V N .
Appendi x A Replaceable Parts 91 Assembl y , Front Bezel, No NamePlate A6752-040 66 Ballast, J147 9 (1 p er system) J1479-60 001 None Box, DVD Filler A6752-67041 None Cable Managem ent Arm 5065-5951 N.
A ppe ndi x A Replaceab le Par ts 92 PCI Fille r P late 5001-6892 None PCI Power M odule (Brick) 0950-3819 A6093-69023 P ower Cord, C19/ CEE 7-7 4. 5m Black CA Assembly 8120-689 9 None P ower Cord, C19/GB 1002 4.5m Black CA Assembly 8121-007 0 None P ower Cord, C19/IEC-309 L6-20 4 .
Appendi x B 93 B Syst em Specificat ions This ch apter des cribes the basic se rver conf igura tion and its phy sical sp ecificatio ns and requir emen ts:.
A ppe ndi x B System Speci ficat ions Dime nsi ons and W eights 94 Dimensions a nd W eig hts This sec tion p rovide s dim ens ions and we ig hts of the s yst em com pon ents. Shippin g bo x, palle t, ra mp, and c ontai ner ad ds approx imate ly 50 lb s to the total syste m weig ht.
Appendi x B System Speci ficat ions Electri cal Specifi cations 95 Elect r ic al S pe ci fica t ion s This sec tion provide s electric al specific ations for hp rp740 5/rp7410 ser vers. Ground ing The site buildin g sha ll provide a safety groun d/pr otectiv e ear th for each AC service entra nce to all cabine ts.
A ppe ndi x B System Speci ficat ions Elect rical Specifi cat ions 96 Syste m P ower Sp ecifi c ati ons T able B -4 and T able B-5 lis t th e AC powe r r equir ements for an hp rp7405 /rp7410 server . Th ese tab les prov ide informat ion to help det erm in e the amoun t of AC pow er needed f or your computer r oom.
Appendi x B System Speci ficat ions En vir onmental Specifi cati ons 97 Envi ronment al Speci fications This section provides the enviro nmental, pow er diss i pati on, nois e emission, and air flow speci fication s for th e hp rp7405/r p7410 serve r .
A ppe ndi x B System Speci ficat ions En vir onmental S pecifications 98 PCI /Ma ss St orag e Se cti on C ooli ng Six (6) 92mm fans loc a ted be t ween t h e Mass St orag e D evic es and the PCI Card Ca ge p rovide airflo w through these devices . The PCI fans are powere d off of housekeeping power and + run at full s peed at a ll times .
Appendi x B System Speci ficat ions En vir onmental Specifi cati ons 99 Figur e B-1 illustra tes the location of the inlet and outlet airduc ts on a sing le cabinet.
A ppe ndi x B System Speci ficat ions En vir onmental S pecifications 100.
Appendi x C 101 C Site Preparati on.
A ppe ndi x C Site Prepar at ion Elect rical Consider ati ons 102 Elect r ic al C onsi der at i ons Prope r des ign an d in stallatio n o f a powe r dist ributio n sy stem for an h p r p7405/rp74 10 s erver requir es specia lized skills.
Appendi x C Site P r eparat i on Electrical L oad Requi rements (Ci rcuit B reaker Si zing) 103 El ectr ic al Lo a d Re qu i reme n t s (C irc u it B r ea ker Si zin g ) It i s alwa ys a good i dea t .
A ppe ndi x C Site Prepar at ion Po w e r Q u a l i t y 104 Po w e r Q u a l i t y This equipment is des i gn ed to oper ate over a wide r ange o f voltages and f requencies . I t h as b een test ed and shown to com ply wi th EMC Sp ecification EN50082.
Appendi x C Site P r eparat i on Dis tribut ion H ardw are 105 Dist rib ution H ard ware Thi s s ectio n de scri bes w ire sel ecti on an d the ty pes of ra cew ays (el ect ric al co ndui ts) used in the d ist ribu tio n syst em.
A ppe ndi x C Site Prepar at ion Gr ound ing Systems 106 Gro unding Sy s tems hp rp740 5/rp7410 serv ers requ ire tw o methods of grounding : • P ower distr ibution safety grou n ding • Hi gh freq.
Appendi x C Site P r eparat i on Gr oundi ng Systems 107 NO TE In some cases pow er dist ribution s ystem green (green/ y e l lo w ) wir e ground c onductors are too long and inducti ve to pro v ide adequat e high frequenc y ground return paths .
A ppe ndi x C Site Prepar at ion Gr ound ing Systems 108 • Good—Use t he rais ed floor st r uctu r e as a g round gri d. In this ca s e, the floor must be designed as a g rou n d grid with bo lted.
Appendi x C Site P r eparat i on System In stall ation Gui delines 109 Sys tem I nstall ation Gui del ines This sec tion cont ains inform ation about ins tallati on practice s . Some comm on pitfalls are highlig hted . Both powe r cable and data com muni cati ons cabl e installa tions ar e discus se d.
A ppe ndi x C Site Prepar at ion En vir onmental E lements 110 Env ironme n tal El em ent s The follow ing environ mental elem ents can affect an hp rp740 5/rp7410 ser ver installat ion: • Comput er.
Appendi x C Site P r eparat i on Envi ronmental Elements 111 At altitud es abov e 10,00 0 feet (3048 m ), the lower air d ensit y reduces th e coo ling capabi lity of air condit ionin g syste ms. If yo ur fa cility is loc ated ab ove th is altit ude, th e r ecom mend ed t emp er ature rang es m ay n eed to b e modified.
A ppe ndi x C Site Prepar at ion En vir onmental E lements 112 • Under floor air distribut ion s ys tem—Dow nfl ow air condit ioning equipment lo cated on the raise d floor of the c omputer r oom uses t he cav ity beneat h t he raised fl oor a s plenum for t he s upply ai r .
Appendi x C Site P r eparat i on Envi ronmental Elements 113 CA UTION Low hum idity con tri butes to un de sirably high lev els of e lectro stat ic char ges. This incre as es th e elec trostati c discharge (ESD) vol ta ge potential. ESD can c ause component d a mage d uring serv icing op eration s.
A ppe ndi x C Site Prepar at ion En vir onmental E lements 114 Special precautio ns are nece ssary if the com puter r oom is near a source of air pollution . Some air pollutants, espec ially hy drogen su l fide (H2S), are not on ly unplea sa nt but corro sive as w ell.
Appendi x C Site P r eparat i on Envi ronmental Elements 115 Acoustics Computer equ ipment and air condit i onin g blowers cause comput er rooms to be noisy .
A ppe ndi x C Site Prepar at ion Com p ut er Ro o m S a fe ty 116 Compu ter R oom Safet y Insid e the c ompu ter r oom, fi re protect ion and a dequate l ighting (fo r equipment servicin g) are i mportant safety c onside ra tions. F e de ral and loca l safety co des go vern co mpute r install atio ns.
Appendi x C Site P r eparat i on Faci lity Characteristics 117 F ac il ity C h ar ac t eri s tic s This sec tion c ontain s infor matio n abou t facili ty charac teristics that must be con side red for the ins tallatio n or operatio n o f a n hp rp 7405 /rp7410 serv er .
A ppe ndi x C Site Prepar at ion Faci lity Characteristics 118 Aver age F lo or Load ing The av erage floor load va l ue , defined in T a ble C-4, is not appropr i ate for a ddress ing rai s ed flo or r atin gs a t the floor grid sp acing lev el.
Appendi x C Site P r eparat i on Faci lity Characteristics 119 Win do w s A void h o u sing computers in a r oom with windows . Sunli ght ent ering a computer room may cause problems . Magneti c tape s torage me dia is da maged if e xposed t o direct sunlight.
A ppe ndi x C Site Prepar at ion Space Req ui rements 120 Space Requir e ments This sectio n conta ins inform ation about sp ace requir em ents for a n h p r p7405/rp74 10 s erver . Th is data s hould be u sed a s t he b asic guid elin e fo r spac e p lan d evelo pme nts.
Appendi x C Site P r eparat i on Space Requiremen ts 121 The service a rea space r equiremen t s , shown in F i gure C-3, are mi nimum di men sion s. If other e quipment is loc ated so t hat it exhaus.
A ppe ndi x C Site Prepar at ion Zinc P art ic le Contaminat ion 122 Zinc P article Contam inatio n Metalli c part iculate s can be especi ally har mf ul around electr onic equipm ent.
123 Index A AC p ow er s pecific ations , 95 acoustic s , 115 ai r cond iti onin g , 111 syste m r ecom me ndat ions , 111 ai r cond iti onin g ducts , 113 air d istribu tion sy stem room s pace r etu.
Index 124 I I/O S ubsystem , 4 , 11 , 12 installin g se rver into the rac k , 28 IP addre ss default , 40 lc Comand Screen , 41 K K eyston e syste m air du cts , 99 envir onmental eleme nts , 110 powe.
デバイスHP (Hewlett-Packard) HP RP7405/7410の購入後に（又は購入する前であっても）重要なポイントは、説明書をよく読むことです。その単純な理由はいくつかあります：
HP (Hewlett-Packard) HP RP7405/7410をまだ購入していないなら、この製品の基本情報を理解する良い機会です。まずは上にある説明書の最初のページをご覧ください。そこにはHP (Hewlett-Packard) HP RP7405/7410の技術情報の概要が記載されているはずです。デバイスがあなたのニーズを満たすかどうかは、ここで確認しましょう。HP (Hewlett-Packard) HP RP7405/7410の取扱説明書の次のページをよく読むことにより、製品の全機能やその取り扱いに関する情報を知ることができます。HP (Hewlett-Packard) HP RP7405/7410で得られた情報は、きっとあなたの購入の決断を手助けしてくれることでしょう。
HP (Hewlett-Packard) HP RP7405/7410を既にお持ちだが、まだ読んでいない場合は、上記の理由によりそれを行うべきです。そうすることにより機能を適切に使用しているか、又はHP (Hewlett-Packard) HP RP7405/7410の不適切な取り扱いによりその寿命を短くする危険を犯していないかどうかを知ることができます。
ですが、ユーザガイドが果たす重要な役割の一つは、HP (Hewlett-Packard) HP RP7405/7410に関する問題の解決を支援することです。そこにはほとんどの場合、トラブルシューティング、すなわちHP (Hewlett-Packard) HP RP7405/7410デバイスで最もよく起こりうる故障・不良とそれらの対処法についてのアドバイスを見つけることができるはずです。たとえ問題を解決できなかった場合でも、説明書にはカスタマー・サービスセンター又は最寄りのサービスセンターへの問い合わせ先等、次の対処法についての指示があるはずです。
