HP (Hewlett-Packard)メーカーML370の使用説明書/サービス説明書
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HP Pr oL iant ML3 7 0 Gener ation 5 S er v er Maint enance and Se r v i ce Gui de J une 2006 (First Edition) Part Number 404682-001.
© Copyright 2006 Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice. The only warranties for HP products and services are set forth in t he express limited warranty statements accompanying such products and s ervic es.
Contents 3 C on ten ts Customer se lf re pair ........................................................................................................... ........... 5 Parts only warr anty service ......................................................
Contents 4 Diskette driv e cabl ing ......................................................................................................... ..................... 66 SAS cabling ........................................................................
Customer self repair 5 C ust omer s elf r epair HP products are designed with many Customer Self Re pair (CSR) parts to minimi ze repair time and allow for greater flexibility in perf orming defective parts re placement.
Customer self repair 6 • Obligatoire - Pièces pour lesquelles la réparation par le client est obligatoire. Si vous demandez à HP de remplacer ces pièces, les coûts de déplacement et main d'œuvre du service vous s eront facturés. • Facultatif - Pièces pour lesquelles la réparation par le client est facultative.
Customer self repair 7 In base alla disponibilità e alla località geografica, le parti CSR vengono sp edite con consegna entro il giorno lavorativo seguente. La consegna nel gior no stesso o entro quattro ore è off erta con un supplemento di costo solo in alc une zone.
Customer self repair 8 stellen. Im Falle von Customer Self Repair kommt HP für alle Kosten für die Lieferung und Rücksendung auf und bestimmt den Kurier-/Frachtdienst. Weitere Informationen über das HP Cu stomer Self Repair Programm erhalten Sie von Ihrem Servicepartner vor Ort.
Customer self repair 9 Para obtener más información acerca del programa de Reparaciones del propio cliente de HP, póngase en contacto con su proveedor de servicios local. Si está interesado en el programa para Norteamérica, visite la página web de HP siguiente ( http://www.
Customer self repair 10 G arant ieser v ic e " P ar ts On ly" Het is mogelijk dat de HP garantie alleen de garantieservice "Parts Only" omvat. Volgens de bepalingen van de Parts Only garantieservice zal HP kosteloos ver vangende onderdelen ter beschikking stellen.
Customer self repair 11.
Customer self repair 12.
Customer self repair 13.
Customer self repair 14.
Illustrated parts catalog 15 Illus tr ated par ts catalog In this section Mechanical components .......................................................................................................... ............... 16 System co mponents ..........
Illustrated parts catalog 16 Mec hanical co mponents Item Description Assembly part number Spare part number Customer self repair (on page 5 ) 1 Access panel (top cover) 389 059-001 409410-001 Mandato.
Illustrated parts catalog 17 Item Description Assembly part number Spare part number Customer self repair (on page 5 ) a) Wrap-around panel 389077-001 — M andatory 1 b) Top cover 389078-001 — Mand.
Illustrated parts catalog 18 1 Mandatory: Obligatorio—componentes para los que la reparación por parte del us uario es obligatoria. Si solicita a HP que realice la sustitución de estos componentes, tendrá que ha cerse cargo de los gastos de desplazamiento y de mano de obra de dicho servicio.
Illustrated parts catalog 19.
Illustrated parts catalog 20 S y stem c omponent s Item Description Assembly part number Spare part number Customer self repair (on page 5 ) System components 14 Hot-plug power supply, 1000 W 380622-001 403781-001 Optional 2 15 Hot-plug fan, 120 mm 384881-001 409421-001 Optional 2 16 3.
Illustrated parts catalog 21 Item Description Assembly part number Spare part number Customer self repair (on page 5 ) a) Dual-core, Intel® Xeon™ Processor 5050 (3.00-GHz, 66 7-MHz FSB, 2x2- MB L2 cache)† 405176-004 409423 -001 Optional 2 b) Dual-Core, Intel® Xeon™ Processor 5060 (3.
Illustrated parts catalog 22 Item Description Assembly part number Spare part number Customer self repair (on page 5 ) b) Receptacle, door snap, stone* 148525-004 — Optional 2 c) PCI retainer, card guide* 250967-004 — Optional 2 d) Clip, cable, adhesive, 1.
Illustrated parts catalog 23 Item Description Assembly part number Spare part number Customer self repair (on page 5 ) c) 60-GB SATA, 5,000- rpm* 379306-B21 382264-001 Optional 2 40 Keyboard* 382641-0.
Illustrated parts catalog 24 1 Mandatory: Obbligatorie—Parti che de vono essere necessariamente riparate dal cliente. Se il cliente ne affida la riparazione ad HP, deve sostenere le spese di sp edizione e di manodopera per il servizio. 2 Optional: Opzionali—Parti la cui riparazione da parte del clie nte è facoltativa.
Illustrated parts catalog 25.
Removal and replacement procedures 26 R emo v al and r eplacemen t pr ocedur es In this section Required tools ................................................................................................................. ....................... 26 Safety consid erations .
Removal and replacement procedures 27 Safet y c ons id er at ion s Before performing service procedur es, review all the safety information. Preventing electrostatic discharge To prevent damaging the system, be aware of the precautions you n eed to follow when setting up the system or handling parts.
Removal and replacement procedures 28 These symbols, on power supplie s or systems, indicate that the equipment is supplied by multiple sources of power. WARNING: To reduce the risk of injury from electric shock, remove all power cords to completely disconnect power fr om the system.
Removal and replacement procedures 29 Power down the server WARNING: To reduce the risk of person al injury, electric shock, or damage to the equipment, remove the power cord to remove power f rom the server. The front panel Power On/Standby button does not completely shut off system power.
Removal and replacement procedures 30 3. Extend the server from the rack. Reverse t he server installation steps in the documentation that ships with the rack-mounting option. 4. Press the server rail-rel ease latches and remove the server from the rack.
Removal and replacement procedures 31 A cces s panel WARNING: To reduce the risk of person al in jury from ho t surfaces, allow the drives and the internal system components to cool before touching them. CAUTION: Do not operate the server for long periods with the access panel op en or removed.
Removal and replacement procedures 32 4. Remove the rack bezel. To replace the component, reverse the removal procedure. Fe e t NOTE: This procedure applies to towe r servers only. To remove the component: 1. Power down the server (on page 29 ). 2. Place the server on its side.
Removal and replacement procedures 33 T o w er conf igur atio n panels To remove the component: 1. Power down the server (on page 29 ). 2. Remove the tower feet (" Feet " on page 32 ). 3. Remove the tower configuration panels: a. Use the T-10/T-15 Torx screwdriver to remove the two front panel sc rews.
Removal and replacement procedures 34 5. Remove the rail. 6. Repeat the steps to remove the other rail. To replace the component, reverse the removal procedure. P o w er suppl y blank CAUTION: Do not attempt to remove and replace a powe r supply as a hot-plug procedure unless both bays are populated with power supplies.
Removal and replacement procedures 35 Hot-plug po w er suppl y WARNING: To reduce the risk of electri c sh ock, do not disassemble the power supply or attempt to repair it.
Removal and replacement procedures 36 2. Remove the blank. To replace the component, reverse the removal procedure. Har d dr i v e To remove the component: CAUTION: To prevent improper cooling and thermal damag e, do not operate the server unless all bays are populated with either a component or a blank.
Removal and replacement procedures 37 Har d dr i v e cage and backplane To remove the component: 1. Power down the server (on page 29 ). 2. Do one of the following: • Open or remove the tower bezel, as need ed (" Front bezel " on page 30 ).
Removal and replacement procedures 38 8. Remove the four screws that secure the drive cage to the chassis. 9. Remove the SAS cage. To replace the component, reverse the removal procedure. Sy s t e m f a n s The server supports redundant hot-plug fans to provide proper airflow to the system if a primary fan fails.
Removal and replacement procedures 39 3. Remove the fan. To replace the component, reverse the removal procedure. Expansi on slo t co v er To remove the component: 1. Power down the server (on page 29 ). 2. Extend the server from the rack, if applicable (" Extend the server from the rack " on page 29 ).
Removal and replacement procedures 40 To replace the component, reverse the removal procedure. Expansi on boar d CAUTION: To prevent damage to the server or expansio n boards, power down the server and remove all AC power cords before removing or installing the exp ansion boards.
Removal and replacement procedures 41 CAUTION: Make a note of board locations. Be sure to install replacements in the same slots. To replace the component, reverse the removal procedure. Sl ot r ele ase l e v er To remove the component: 1. Power down the server (on page 29 ).
Removal and replacement procedures 42 4. Remove the processor air b affle. To replace the component, reverse the removal procedure. Center w al l To remove the component: 1.
Removal and replacement procedures 43 To replace the component, reverse the removal procedure. Media blanks To remove the component: 1. Power down the server (on page 29 ).
Removal and replacement procedures 44 4. Slide the media latch to release the drive and exte nd the drive from the bay to access the cabling. CAUTION: To prevent improper cooling and thermal damag e, do not operate the server unless all bays are populated with either a component or a blank.
Removal and replacement procedures 45 4. Press the HP Systems Insig ht Display ejector butto n to extend the HP Systems Insight Display. 5. Disconnect the Systems Insight Display ca ble from the system board (" System board components " on page 80 ).
Removal and replacement procedures 46 WARNING: Always comply with all electrostati c and thermal guidelines to prevent bodily injury and ensure a properly functioning sy stem when performing hot-plug operati ons. WARNING: To preven t personal injury from hazardous energy: • Remove watches, rings, or other metal objects.
Removal and replacement procedures 47 6. Remove the FBDIMM. To replace the component, reverse the removal procedure. Pr oc essor CAUTION: To prevent possible server malfunction, do not mix processors of different speeds or cache sizes. Refer to the label on the processor heatsink for a description of the processor.
Removal and replacement procedures 48 6. Remove the heatsink. 7. Open the processor retaini ng latch and the processor socket retaining bracket..
Removal and replacement procedures 49 8. Using your fingers, remove the failed processor. To replace the component: IMPORTANT: Be sure the processor remains in side the processor installation tool. 1. If the processor has separated from the installation tool, carefully re-insert the proc essor in the tool.
Removal and replacement procedures 50 CAUTION: The processor is designed to fit one way in to the socket. Use the al ignment guides on the processor and socket to properly alig n the processor with the socket. Re fer to the server hood l abel for specific instructions.
Removal and replacement procedures 51 4. Close the processor retaini ng latch and the processor socket retaining bracket. 5. Clean the old thermal grease from the heatsink with the alcohol swa b.
Removal and replacement procedures 52 8. Close the heatsink retaining latches. 9. Install the processor air baffle. 10. Install the access panel. 11. Do one of the following: • Install and lock the bezel. • Slide the server back into the rack. 12.
Removal and replacement procedures 53 6. Remove the heatsink. To replace the heatsink: 1. Clean the old thermal grease fr om the heatsink and processor with the alcohol swab. Allow the alcohol to evaporate before continuing. 2. Apply all the grease to the top of the processor in one of the follow ing patterns to ensure even distribution.
Removal and replacement procedures 54 4. Close the heatsink retaining latches. 5. Install the processor air baffle. 6. Install the access panel. 7. Do one of the following: • Install and lock the bezel. • Slide the server back into the rack. 8. Power up the server.
Removal and replacement procedures 55 5. Remove the PPM. NOTE: The appearance of compatible PPMs may vary. To replace the component, reverse the removal procedure. CAUTION: Only install a PPM if the processor is inst alled. Both the PPM and the processor must be installed together, otherwise the system d oes not boot.
Removal and replacement procedures 56 8. Disconnect the signal cable from the power supply backplane. 9. Disconnect all cables from the system board, as necessary, to access the power su pply backplane. 10. Remove the power supply backplane. To replace the component, reverse the removal procedure.
Removal and replacement procedures 57 3. Remove the access panel (" Access panel " on page 31 ). 4. Remove all expansion boards (" Expansion board " on page 40 ). 5. Remove the processor air b affle (" Processor air baffle " on page 41 ).
Removal and replacement procedures 58 BB W C bat te r y pack CAUTION: To prevent a server malfunction or damage to the equipment, do not add or remove the battery pack while an array capacity expansion, RAID level migr ation, or stripe size migration is in progress.
Removal and replacement procedures 59 5. Remove the battery pack. To replace the component, reverse the removal procedure. S y st em boar d IMPORTANT: If replacing the system board or clearing NVRAM, you must r e-enter the server serial number through RBSU.
Removal and replacement procedures 60 11. Open the processor retaini ng latch and the processor socket retaining bracket. 12. Using your fingers, remove the processor from the failed system board. CAUTION: To avoid damage to the system board: • Do not touch the socket contacts.
Removal and replacement procedures 61 15. Lift the system board out of the chassis and tilt it to one side to clear t he cable guide. To replace the system board: 1. Install the spare system boa rd in the server before installing the proc essor. 2. Prepare the processor socket on the spare syst em board: a.
Removal and replacement procedures 62 b. Remove the processor socket protective c over. 3. Install the processor socket cover onto the processo r socket of the f ailed system board. The cover protects the socket during shipping when the failed board is returned.
Removal and replacement procedures 63 5. Close the processor retaining latch and the processor socket retaining bracket. 6. Clean the old thermal grease fr om the heatsink an d the top of the processor with the alcohol swab. Allow the alcohol to evaporate before continuin g.
Removal and replacement procedures 64 2. Select the System Options menu. 3. Select Serial Number . The following warning is displayed: WARNING! WARNING! WARNING! The serial number is loaded into the system during the manufacturing process and should NOT be modified.
Removal and replacement procedures 65 5. Remove the battery. IMPORTANT: Replacing the system board battery resets the system ROM to its defau lt configuration. After replacing the battery, reconfigure the system through RBSU. To replace the component, reverse the removal procedure.
Cabling 66 C abling In this section Cabling ov erview ............................................................................................................... .................... 66 Diskette driv e cabl ing ....................................
Cabling 67 S A S cabling NOTE: The center wall is removed for illustration purposes only. • SAS data cabling • SAS power cabling.
Cabling 68 CD-R OM dr i v e cabling V i deo cabling.
Cabling 69 P ar allel/ser ial po r t cabling BB W C opti on cabling.
Cabling 70 Int er nal U SB connec tor S tor age de v i ce cabling gui delines CAUTION: To prevent damage to the equipment, be sure that the server is powe red down, all cables are disconnected from the back of the server, and the powe r cord is disc onnected from the grounded (earthed) AC outlet before installing devic es.
Diagnostic tools 71 Diagno sti c tools In this section Automatic Serv er Reco very ...................................................................................................... ................ 71 HP Systems Insi ght Mana ger ................
Diagnostic tools 72 • From within Survey Utility • From within operating syste m-specific IML viewers • For NetWare: IML Viewer • For Windows®: IML Viewer • For Linux: IML Viewer Applicatio.
Diagnostic tools 73 HP R OM-Ba sed S etu p Utilit y RBSU, an embedded configuration util ity, performs a wide range of co nfiguration activities that may include: • Configuring system devices and in.
Diagnostic tools 74 • Preparing the system for inst alling "off-the-shelf" versions of leading o perating system software • Installing optimized server drivers, management agents, and ut.
Component identification 75 C ompone nt i dentif i cati on In this section Front panel components ......................................................................................................... ................. 75 Front panel LEDs and buttons .
Component identification 76 Item Description 6 DVD/CD-ROM drive 7 Removable media bays 8 Hard drive bays 1-8 • Tower model Item Description 1 Media bay spacer 2 DVD/CD-ROM drive 3 Removable media ba.
Component identification 77 F r ont pane l LEDs and buttons Item Description Status 1 UID button — 2 UID LED Blue = Activated Flashing blue = System is being managed remotely Off = Deactivated 3 Int.
Component identification 78 R ear panel componen ts Item Description 1 Keyboard connector 2 Mouse connector 3 USB connectors 4 iLO 2 management connector 5 Video connector 6 Serial connector 7 NIC 2 c.
Component identification 79 R ear panel LEDs Item Description Status 1 UID LED Blue = Activated Flashing blue = system is being remotely managed Off = Deactivated 2 iLO 2 activity LED Green or flashin.
Component identification 80 S y st em boar d componen ts Item Description 1 PCI Express slot 1, x4 2 PCI-X slot 2, 64-bit/133-MHz 3 PCI-X slot 3, 64-bit/133-MHz 4 PCI Express slot 4, x4 5 PCI Express .
Component identification 81 Item Description 24 Internal USB connector 25 Serial 2 connector 26 Parallel connector 27 Diskette drive connector System maintenance switch Position Default Function S1 Off Off = iLO 2 security is enabled. On = iLO 2 security is disabled.
Component identification 82 HP Systems Insight Display LED color Internal system health LED color Status PPM failure, slot X (amber) Red One or more of the following conditions may exist: • PPM in slot X has failed. • PPM is not installed in slot X , but the corresponding processor is installed.
Component identification 83 S A S and S A T A har d dr i v e LEDs Item Description Status 1 Fault/UID LED Amber = Drive failure Flashing amber = Fault-process activity Blue = Unit identification is ac.
Component identification 84 Online/activity LED (green) Fault/UID LED (amber/blue) Interpretation Flashing regularly (1 Hz) Off Do not remove the dri ve. Removing a drive may terminate the current operation and cause dat a loss. The drive is rebuilding, or it is part of an array that is undergoing capacity expansion or stripe migration.
Component identification 85 Item Description 8 FBDIMM slot 8, bank D P o w er suppl y backplane LED If the power supply backplane LED is illumina ted, the power supply backplane has failed.
Component identification 86 Item Description Configuration 5 Fan 5 Redundant 6 Fan 6 Redundant S y st ems Insigh t Displa y LEDs To view a quick reference for co mponent identification and status, access the Systems Insight Display.
Component identification 87 Item Description Status 9 Processor 2 LED Amber = Failure Off = Normal 10 PPM 2 LED Amber = Failure Off = Normal 11 Hot-plug fan LE Ds Amber = Failure or fan is not install.
Specifications 88 S pec if i cati ons In this section Environmental specificat ions ................................................................................................... ................. 88 Server spec ificat ions ......................
Specifications 89 Specification Value Weight (maximum) 40.8 kg (110 l b) Weight (when lightly loaded) 24.9 kg (55 lb) Input requirements Rated input voltage 100 VAC to 240 VAC * Rated input frequency 47 Hz to 63 Hz Rated input current 10 A (100 V) to 6.
Specifications 90 Specification Value Drives supported 1 Drive height One-third heig ht Drive rotation 300 rpm Transfer rate High 500 Kb/s Low 250 Kb/s Bytes/sector 512 Sectors per track (high/low) 18.
Specifications 91 Specification Value Track pitch 1.6 µm (6.3 × 10 -7 in) Cache/buffer 128 KB Startup time < 10 s Stop time < 5 s (single); < 30 s (multisession) Laser parameters Type Semiconductor laser GaAs Wave length 700 ± 25 nm Divergence angle 53.
Acronyms and abbreviations 92 A c r on y ms and abbr e v iati ons ABEND abnormal end ASR Automatic Server Recovery BBWC battery-backed write cache BIOS Basic Input/Output System DDR double data rate D.
Acronyms and abbreviations 93 NMI non-maskable interrupt NVRAM non-volatile memory ORCA Option ROM Configuration for Arrays PCI Express peripheral component interconnect express PCI-X peripheral compo.
Acronyms and abbreviations 94 SIM Systems Insight Manager SNMP Simple Network Management Protocol UID unit identification USB universal serial bus VHDCI very high density cable interconnect.
Index 95 A AC power supply 79 access panel 31 air baffle 28, 41 ASR (Automatic Server Recovery) 71, 92 Automatic Server Recovery (ASR) 71, 92 Autorun menu 73 B battery 80 battery-backed write cache (B.
Index 96 LEDs, SATA hard drive 83 LEDs, Systems Insight Display 86 M management tools 71 media drive 43 media drive blank 43 memory boards 46 memory slots 80, 84 N network connector LEDs 79 NIC (netwo.
Index 97 V video connector 75.
デバイスHP (Hewlett-Packard) ML370の購入後に（又は購入する前であっても）重要なポイントは、説明書をよく読むことです。その単純な理由はいくつかあります：
HP (Hewlett-Packard) ML370をまだ購入していないなら、この製品の基本情報を理解する良い機会です。まずは上にある説明書の最初のページをご覧ください。そこにはHP (Hewlett-Packard) ML370の技術情報の概要が記載されているはずです。デバイスがあなたのニーズを満たすかどうかは、ここで確認しましょう。HP (Hewlett-Packard) ML370の取扱説明書の次のページをよく読むことにより、製品の全機能やその取り扱いに関する情報を知ることができます。HP (Hewlett-Packard) ML370で得られた情報は、きっとあなたの購入の決断を手助けしてくれることでしょう。
HP (Hewlett-Packard) ML370を既にお持ちだが、まだ読んでいない場合は、上記の理由によりそれを行うべきです。そうすることにより機能を適切に使用しているか、又はHP (Hewlett-Packard) ML370の不適切な取り扱いによりその寿命を短くする危険を犯していないかどうかを知ることができます。
ですが、ユーザガイドが果たす重要な役割の一つは、HP (Hewlett-Packard) ML370に関する問題の解決を支援することです。そこにはほとんどの場合、トラブルシューティング、すなわちHP (Hewlett-Packard) ML370デバイスで最もよく起こりうる故障・不良とそれらの対処法についてのアドバイスを見つけることができるはずです。たとえ問題を解決できなかった場合でも、説明書にはカスタマー・サービスセンター又は最寄りのサービスセンターへの問い合わせ先等、次の対処法についての指示があるはずです。
