HPメーカーProLiant ML350 G6の使用説明書/サービス説明書
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HP Pr oL ian t ML3 5 0 G6 S er v er Maint enance and Se r v i ce Guide Abstract This guide is for an experien ced service technician. HP assumes you are qualified in the servicing of comp uter equipme.
© Copyright 2009, 2015 Hewlett- Packard Development Company, L.P. The information contained herei n is subject to change without notic e. The only warranties for HP produ cts and services are set forth in the expr ess warranty statements accompanyin g such products and services.
Contents 3 Cont ents Customer self repair ...................................................................................................................... 5 Parts only warranty service ............................................................
Contents 4 DIMM .................................................................................................................................................... 55 Heatsink ..........................................................................
Customer self repair 5 C u st omer s elf r epair HP products are desig ned with many Customer Self Repai r (CSR) parts to minimiz e repair time and allow for greater flex ibility in perf orming defect ive parts replac ement.
Customer self repair 6 Obligatoire - P ièces pour lesquelles la ré paration par le client est ob ligatoire. Si vous demand ez à HP de remplacer c es pièces, les coût s de déplacemen t et main d'œuvr e du service vous seront facturés. Facultatif - Pièces pour lesquell es la réparat ion par le client est facultative.
Customer self repair 7 In base alla disponibi lità e alla località geografica , le parti CSR vengono sp edite con consegna entro il giorno lavorat ivo seguente. La consegn a nel giorno stesso o ent ro quattro ore è off erta con un supplemen to di costo solo in alcu n e zone.
Customer self repair 8 defekte Teil nicht zurückschicken, kann HP Ihne n das Ersatzteil in Rechnung stellen. Im Falle von Customer Self Repair ko mmt HP für alle Kost en für die Lieferun g und Rücksend ung auf und bestim mt den Kurier- /Frachtdienst.
Customer self repair 9 enviara el componente defectuoso requerido, HP podr á cobrarle por el de sus titución. En el caso de to das sustitucion es que lleve a cab o el cliente, HP se h ará cargo de todos l os gastos de enví o y devolución de componente s y escogerá la emp resa de transpo rte que se utili ce par a dicho servicio.
Customer self repair 10 Neem contact op met e en Service Partner voor me er informatie over het C ustomer Self Repair pro gramma van HP. Informatie o ver Service Partners vindt u op de HP website ( http://www .
Customer self repair 11 No caso desse se rviço, a substituição de peç as CSR é obrigatória. Se desejar que a HP substi tua essas peças, serão cobradas as despesas de transporte e mão - de - obra do serviço.
Customer self repair 12.
Customer self repair 13.
Customer self repair 14.
Illustrated parts catalog 15 I llus tr ated parts catalog Mechanical components Item Description Spare part number Customer self repair (on page 5 ) 1 Access panel 511769 - 001 Mandatory 1 2 DIMM baff.
Illustrated parts catalog 16 Item Description Spare part number Customer self repair (on page 5 ) 7 Standard SAS/SATA 6 - bay har d drive cage, LFF* 511784 - 001 Mandatory 1 8 Plastics an d hardware k.
Illustrated parts catalog 17 1 Mandatory: Obl igatorio — componentes para los que la repa ración por parte de l usuario es oblig atoria. Si soli cita a HP que realice la sustitución de estos componentes, tendrá que hacerse cargo de lo s gastos de desplazamiento y de mano de obra de d icho servicio.
Illustrated parts catalog 18.
Illustrated parts catalog 19 System components Item Description Spare part number Customer s elf repair (on page 5 ) System components 13 Hot - plug power supply — — a) AC, 460 W 511777 - 001 Mand.
Illustrated parts catalog 20 Item Description Spare part number Customer s elf repair (on page 5 ) f) 2.26 -GHz Intel® Xeon® processor E5520, 80 W* ** 490073 - 001 Optional 2 g) 2.40 - GHz Intel® Xeon® processor E5530, 80 W* ** 490072 - 001 Optional 2 h) 2.
Illustrated parts catalog 21 Item Description Spare part number Customer s elf repair (on page 5 ) a) 1 - GB PC3 - 1060 0 (DDR3 - 1333) ( RoHS)* 501539 - 001 Mandatory 1 b) 2 -GB PC3 - 10600 (D DR3 - .
Illustrated parts catalog 22 Item Description Spare part number Customer s elf repair (on page 5 ) e) 300 - GB, 15,000 - rpm, hot - plug, dual - port 416248 - 001 Mandatory 1 f) 300 - GB, 15,000 - rpm.
Illustrated parts catalog 23 Item Description Spare part number Customer s elf repair (on page 5 ) k) 146 - GB, 1 0,000 - rpm, hot - plug, dual - port, 6G 507283 - 001 Mandatory 1 l) 300 - GB, 10,000 .
Illustrated parts catalog 24 2 Optional — Parts for whi ch customer self rep air is optiona l. These parts are also designed for customer self repair. If, however, you require that HP replace them f or you, there may or may not be additional charges, depending on the type of warranty service d esignated for your p roduct.
I llustrated parts catalog 25 2 Optional: Opcional — Peças cujo reparo feit o pelo cliente é opc ional. Essas peç as também são pro jetadas para o reparo feit o pelo client e. No entanto, se desej ar que a HP as substi tua, pode haver ou não a cobrança de taxa adicional , dependendo d o tipo de serviço de ga rantia destinado a o produto.
Removal an d replacement procedures 26 R emo v al and r eplacemen t pr ocedur es R equired tools You need the following it ems for some procedur es: • T- 10/T - 15 Torx screwdriver • HP Insight Di.
Removal an d replacement procedures 27 NOTE: If the operating system automatically places the server in Standby mode, omit the ne xt step. 3. Press the Power On/Standby button to place the server in Standby mode . When the server activates Standby power mode , the system power LED chan ges to amber.
Removal an d replacement procedures 28 1. Power down the server (on page 26 ). 2. Extend the server from the rack (o n page 27 ). 3. Disconnect the cabling and remove the server from the rack. Fo r more information, see the documentation that ships with the rack mounting option.
Removal an d replacement procedures 29 CAUTION: Do not operate the serve r for long periods with the ac cess panel open or removed. Operating the se rver in this manner resu lts in improper airflow and impr oper cooling that can lead to thermal damage.
Removal an d replacement procedures 30 T ower foot To remove the component: 1. Power down the server (on page 26 ). 2. Remove the to wer bezel (" Front bezel " on page 29 ). 3. Place the serv er on its side. 4. Remove the fo ot. To replace th e component, rev erse the removal p rocedure.
Removal an d replacement procedures 31 R ack bezel To remove the component: 1. Power down the server (on page 26 ). 2. Extend the server from the rack (o n page 27 ). 3. Remove the acc ess panel (" Access p anel " on page 30 ). 4. Remove the beze l.
Removal and re placement procedures 32 4. Slide the rail fo rward and remove it from the server. 5. Repeat the ste ps above to remov e the other rail. To replace th e component, rev erse the removal p rocedure. L arge redundant f an air baffle To remove the component: 1.
Removal an d replacement procedures 33 To replace th e component, rev erse the removal p rocedure. D IMM baffle To remove the component: 1. Power down the server (on page 26 ). 2. Do one of the following: o Open or remov e the tower bezel, as needed (" Front bezel " on page 29 ).
Removal an d replacement procedures 34 5. Remove the fan blank. To replace th e component, rev erse the removal p rocedure. F an To remove the component: 1. Power down the server (on page 26 ). 2. Do one of the following: o Open or remov e the tower bezel, as needed (" Front bezel " on page 29 ).
Removal an d replacement procedures 35 6. Remove the fa n. To replace th e component, rev erse the removal p rocedure. P ower suppl y blank To remove the component: 1. Access the produc t rear panel (" Access the serv er rear panel (ra ck model) " on page 28 ).
Removal an d replacement procedures 36 H ot - plug power supply WARNING: To reduce the ris k of electric shock, d o not disassemble t he power supply or a ttempt to repair it.
Removal an d replacement procedures 37 Remove the component as indicate d. To replace the blank, slide the blank into the bay unti l it locks into place. S AS/SATA hard dri ve CAUTION: To pre vent improper cooling and thermal damage, do not o perate the server unless all bays are popul ated with either a compone nt or a blank.
Removal an d replacement procedures 38 S tandard hard drive cage The procedure i s the same for both the stan dard six - bay LFF hard dri ve cage and the st andard eight - bay SFF hard drive cage. To remove the component: 1. Power down the server (on page 26 ).
Removal an d replac ement procedures 39 NOTE: Remov e the shipping scr ew, if installed , before removin g the hard drive cag e. 7. Remove the hard drive c age. To replace the component: 1. Using a T - 15 Torx screwdriver , remove the sleev e from the spar e hard drive cage.
Removal an d replacement procedures 40 2. Install the SFF hard drive cage into the server. 3. Connect all cables to the spare hard drive c age. CAUTION: Always po pulate each media bay wi th either a de vice or a blank. Proper airflow can only be maintained whe n the bays are populated.
Removal an d replacement procedures 41 7. Remove the hard drive c age. To replace the compon ent: 1. Slide the spare hard dr ive cage about three - fourths of the way into the bay, leaving room to connect cables at the back of the drive cage. 2. Connect all cables to the spare hard drive c age.
Removal an d replacement procedures 42 o Slide the server back into the rack. 7. Power up the server. S tandard hard d rive cage ba ckplane To remove the component: 1. Power down the server (on page 26 ). 2. Do one of the following: o Open or remov e the tower bezel, as needed (" Front bezel " on page 29 ).
Removal an d replacement procedures 43 o Eight - bay SFF hard drive cage backplane To replace th e component, rev erse the removal p rocedure. E xpansion slot cover To remove the component: 1. Do one of the following: o Unlock and remove t he bezel (" Front beze l " on page 29 ).
Removal an d replacement procedures 44 4. Remove the expansion slot cover. CAUTION: To pre vent improper cooling and thermal damage, do not o perate the server unless all PCI slots have eith er an expansion slot cover or an exp ansion board installed.
Removal an d replacement procedures 45 5. Push the release latches on the expansion board retai ner, and then open the retainer. 6. Remo ve the T - 15 Torx screw securing th e expansion board, if necessa ry. 7. Remove the expansio n board. To replace th e component, rev erse the removal p rocedure.
Removal an d replacement procedures 46 2. Remove the media bay blan k. To replace th e component, rev erse the removal p rocedure. Battery- backed wr ite cache proce dures Two types of procedur es are.
Removal an d replacement procedures 47 4. Remove the ca che module. To replace th e component, rev erse the removal p rocedure. B BWC b attery pack To remove the component: 1. Power down the server (on page 26 ). 2. Do one of the following: o Open or remov e the tower bezel, as needed (" Front bezel " on page 29 ).
Removal an d replacement procedures 48 5. Remove the batter y pack. To replace th e component, rev erse the removal p rocedure. R ecovering data from the battery - backed write cache If the server fails, use t he following procedur e to recover data temporarily sto red in the BBWC.
Removal an d replacement procedures 49 F lash - backed writ e cache proce dures Two types of procedur es are provided for the FBWC o ption: • Removal and replace ment of failed components: o Removin.
Removal an d replacement procedures 50 7. Open the ejector la tches on each side of the cach e module connector. N ormally, the cache module is ejected from the cache module connector. If th e module is not eject ed automatically , remove the ca che module.
Removal an d replacement procedures 51 CAUTION: In systems t hat use external data storage, be sure that the server i s the first unit to be powered down and the last to be powered back up. T aking this precautio n ensures that the system does not erro neously mark th e drives as failed wh en the server is po wered up.
Removal an d replacement procedures 52 5. Remove the fo ur T - 15 screws f rom the hard drive cage , and then slide the hard drive cag e partially out of the chassi s. 6. Disconnect any external cables from the PCI - X expansion boards. 7. Disconnect the power cable extension and the signal cable from the PCI - X expansion cage.
Remo val and replacemen t procedures 53 9. Remove the P CI - X expansion cage. 10. Remove any expansi on boards. To replace th e components, reverse the removal p rocedure. H alf - height or full - height media device To remove the component: 1. Power down the server (on page 26 ).
Removal an d replacement procedures 54 4. Disconnect data and powe r cables: 5. Remove the dev ice: o Half - height.
Removal an d replacement procedures 55 o Full - height To replace th e component, rev erse the removal p rocedure. IMPORTANT: Be sure to c onnect the right - angle end of the SA TA data cable to the s ystem board. Connecting it to the SATA drive may interfere wit h other installed media bay devices.
Removal an d replacement procedures 56 8. Remove the D I MM. To replace th e component, rev erse the removal p rocedure. For DIMM configura tion information, se e the server user guide. H eatsink To remove the component: 1. Power down the server (on page 26 ).
Removal an d replacement procedures 57 7. Remove the heatsink . To replace the compon ent: 1. Use the alcoh ol swab to remove all th e existing thermal grea se from the processor . Allow the alcohol to evaporate before con tinuing. 2. Remove the h eatsink protec tive cover.
Removal an d replacement procedures 58 4. Close the hea tsink loc king levers. 5. Install the lar ge redundant fan air baffle, i f removed. 6. Install the access panel. 7. Do one of the following: o Close or insta ll the tower bezel, as needed. o Slide the server back into the rack.
Removal an d replacement procedures 59 6. Remove the h eatsink. 7. Open the pro cessor locking lever and the proce ssor socket retain ing bracket. 8. Using the pro cessor tool, rem ove the process or from the system board: a. Line up the processor tool, ensuring the locking lever g raphic on the tool is orient ed correctly.
Removal and replacement procedures 60 c. Release the tabs, and then carefull y lift the processor and tool straight up. 9. Carefully rotate the tool, and then push i n and release the tabs to secure the processor in the tool. CAUTION: To avoid damage to the processor, do not touch the bottom of the processor, especially the cont act area.
Removal an d replacement procedures 61 1. Carefully insert th e processor into the processor in stallation tool. Han dle the processor by t he edges only, and do not touch the bottom of the processor, especially the contact area.
Removal an d replacement procedures 62 2. Be sure the tool is oriented correctly. Align the processor installation tool with the socket, and then install the processor . THE PINS ON THE SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED . CAUTION: THE PINS ON THE SYSTEM B OARD ARE VERY FRAGILE AND EASILY DAMAGED.
Removal an d replacement procedures 63 3. Press and hold the tabs on the process or installation tool to separate it from the processor, and then remove the tool.
Removal an d replacement procedures 64 6. Close the hea tsink locking lev ers. 7. Install the lar ge redundant fan air baffle, i f removed. 8. Install the access panel. 9. Do one of the following: o Close or install the tower bezel, as need ed. o Slide the server back into the rack.
Removal an d replacement procedures 65 11. Remove the h eatsink (" Heatsink " on page 56 ). CAUTION: To avoi d damage to the processor: • Handle the processor only by the edges. • Do not touch the bottom of the processor, especi ally the contact area.
Removal an d replacement procedures 66 a. Line up the processor tool, ensuring the locking lever g raphic on the tool is orient ed correctly. b. Press in on the plastic tabs, and then place the tool on the proce ssor. c. Re lease the tabs, and then carefully lift the processor and tool straight up.
Removal an d replaceme nt procedures 67 16. Using the system boar d tray handles, slide the tr ay forward and remove the fai led system board. To repl ace the component: 1. Install the spa re system boar d in the server befor e installing the p rocessor.
Removal an d replacement procedures 68 2. Open the pro cessor locking lever and the proce ssor socket retain ing bracket. Do not remove th e processor sock et cover . IMPORTANT: Be sure the processor remains in side the processor insta llation tool. 3.
Removal an d replacement procedures 69 4. Align the processor installation tool wi th the socket, and then install t he processor. THE PINS ON TH E SYSTEM BOARD AR E VERY FRAGILE AND E ASILY DAMAGED . CAUTION: THE PINS ON THE SYSTEM B OARD ARE VERY FRAGILE AND EASILY DAMAGED.
Removal an d replacement procedures 70 5. Press the tabs on the processor ins tallation tool to separate it from the processor, and then remove the tool. 6. Close the pro cessor socket r etaining brac ket and the proces sor locking lever. The proce ssor socket cover is automaticall y ejected .
Removal an d replacement procedures 71 9. Apply all the grease to the top of the processor i n the following pattern to ensure even distribution. 10. Install the heatsink. 11. Close the hea tsink locking lev ers. IMPORTANT: Install all components with the same configuration that was used on the failed system board.
Removal an d replacement procedures 72 2. Select the Advanced Options menu. 3. Select Se rvice Options . 4. Select Se rial Number . The following warnin gs appear: WARNING! WARNING! WARNING! The serial number is loaded into the system during the manufacturing process and should NOT be modified.
Removal an d replacement procedures 73 11. Remove the pow er sup ply backplane. To replace th e component, rev erse the removal p rocedure. Battery If the server no longer automatically displays the correct date and time, you may need to replace the battery that provides power to the r eal - time cloc k.
Removal an d repl acement procedure s 74 4. Remove the battery. IMPORTANT: Replacing the syst em board battery resets the system RO M to its default configuration. After replacing the battery, reconfigure the system through RBSU. To replace th e component, rev erse the removal p rocedure.
Diagnostic tool s 75 D i agno sti c tools T roubleshooting resour ces The HP ProLiant Servers T roubleshooting Guid e provides p rocedures for resolving common p roblems and comprehensiv e courses of .
Diagnostic tool s 76 HP Insight Diagnosti cs Online Edition is a web - based application that captures system configuration and other related data ne eded for effective server management. Available in M icrosoft® Windows® and Linux versions, the utility helps to ensure proper sys tem operation.
Diagnostic tool s 77 HP Insight Remote Suppo rt software HP strongly recommends that you install HP Insight Remote Su p port softwa re to complete the insta llation or upgrade of your product and to enable enhan ced delivery of your HP Warran ty, HP Care Pack Servi ce, or HP contractual support agreement.
Component identif ication 78 C om ponen t i dentif i cati on F ront panel comp onents Item Description 1 Power On/Standb y button 2 UID button 3 USB connect ors (2) 4 Hot - plug hard driv e bays (8 - .
Component identif ication 79 F ront panel LEDs and b utton s Item Description Status 1 System power LED Green = Power on Flashing green = W aiting for power d ue to group power cap ping Amber = System in standby, but power still applied Off = Power cord not attached or power s upply failure 2 Health LED Green = Normal Amber = Syste m degraded.
Component identif ication 80 R ear panel comp onents Item Description 1 Power supply bay 2 2 Keyboard co nnector 3 Power suppl y bay 1 (populated) 4 Video connecto r 5 USB connect ors (2) 6 RJ - 45 Et.
Component identif ication 81 R ear pane l LEDs and buttons Item Description Status 1 Power supply 2 LED Green = Power s upply is on and fu nctioning. Off = AC pow er is not available or AC power supply has fai led.
Component identif ication 82 Item Description Status 9 NIC 1 activity LED Green or flashing = Network activity Off = No network activity S ystem boar d components Item Description 1 Processor 1 D IMM .
Component identif ication 83 Item Description 16 Slot 1 PCIe 2 x8 (4, 2, 1)¹ 17 Slot 2 PCIe 2 x8 (4, 2, 1)² 18 10Gb sideb and connector ( MII 24 - pin) 19 Slot 3 PCIe 2 x8 (8, 4, 2, 1)³ 20 Slot 4 P.
Component identif ication 84 System board LEDs Item Description Status 1 Power supply 1 Amber = No AC p ower or failed pow er supply Off = Power sup ply is on and function ing. 2 Power supply 2 Amber = No AC p ower or failed pow er supply Off = Power sup ply is on and function ing.
Component identif ication 85 Item Description Status 10 Processor 1 Amber = Proces sor 1 failed. Off = Processor 1 is functioning. 11 System fan 1 Amber = Fan is missing or has failed. Off = Fan is funct ioning. 12 Processor 1 D IMMs Amber = An error ha s occurred.
Component identif ication 86 D IMM ident ification IMPORTANT: This se rver does not support mixing RDIMMs and UDIMMs. Attempting to mix these two types causes the server to halt dur ing BIOS initialization. The memory subsystem may be populated with ei ther RDIMMs or UDIMMs, but mixing the two types is no t supported.
Component identif ication 87 S AS/SATA de vice numbers • SFF configuration with an optional SAS expand er • SFF configuration with a second SAS controller.
Component identif ication 88 • LFF configuration S AS and SATA drive LEDs Item Description 1 Fault/UID LED (amber/blue) 2 Online LED (green).
Component identif ication 89 S AS and SATA hard drive LE D combinations Online/activity LED (green) Fault/UID LED (amber/blue) Interpretation On, off, or flashing Alternating amber and blue The drive h as failed, or a predictiv e failure alert has been received for this drive; it also has been selected by a managemen t application .
Component identif ication 90 B attery pac k LEDs Item Color Description 1 Green System Power LED. This LED is on when th e system is powered up an d 12 V system power is available. Thi s power supply is us ed to mai ntain the batter y charge and provide supp lementary power to the cache microcontroller.
Component identif ication 91 LED3 pattern LED4 pattern Interpretation Off Flashing (1 Hz) The battery pack is below the minimum charge level and is being charged. Features that require a battery (such as write cache, capacity expansion, strip e size migration, a nd RAID migration) a re unavai lable temporarily until charging is complete.
Component identif ication 92 1 Green LED 2 Amber LED Interpretation Off Off The flash code is corrupt. F an location s and configur ations CAUTION: To maintain pro per cooling, all fan bays mus t be populated with a fan or a fan bl ank.
Component identif ication 93 • Single - processor, standard fan c onfiguration Item Description 1 Rear fan 1 2 Rear fan 2 3 Front fan 3 4 Processor 1 5 DIMM baffl e • Single - processor, redundant.
Component identif ication 94 Item Description 3 Front fan 3 4 Front fan 4 5 Processor 1 6 DIMM baffl e 7 Large redunda nt fan air baffl e • Dual - proc essor, non - r edundant fan configuration Item.
Component identif ication 95 • Dual - processor, redun dant fan configuration Item Description 1 Rear fan 1 2 Rear fan 2 3 Front fan 3 4 Front fan 4 5 Processor 1 6 Processor 2 7 DIMM baffl es 8 Lar.
Component identif ication 96 O ptional hard dr ive cage jumper location and configuration settin gs • Optional two - bay LFF backplane • Optional eight - bay SFF bac kplane Drive cage Installation Pin setting 1 Standard No jumper 2 Optional 1- 2* *Optional driv e cages ship with the jum per set across pin s 1 and 2.
Specifications 97 S pec if icati ons E nvironmental specif ications Specification Value Temperature range* Operating 10 ° C to 35 ° C ( 50 ° F to 95 ° F) Shipping - 40 ° C to 70 ° C ( - 40 ° F to 158 ° F) Maximum wet bulb temperature 28 ° C (82.
Specifications 98 Rated input po wer 930 W at 100 V AC input 1348 W at 20 0V AC input BTUs per hour 3530 at 120V AC input 4600 at 200V to 240V AC in put Power supply output Rated steady - state power .
Specifications 99 Maximum peak power 460 W at 100 V to 120V AC inpu t 460 W at 200 V to 240V AC inpu t.
Acronyms and abbreviation s 100 A c r on y ms and abbr e v iati ons ADU Array Diagnostics U tility AMP Advanced Memory Protec tion FBWC flash - backed write cac he iLO Integrated Lights - Out IML Inte.
Acronyms and abbreviation s 101 POST Power - On Self Te st PSP HP ProLiant Support Pack RBSU ROM - Based Setup Utility RDIMM registered d ual in - line memory modul e SAS serial attached SCSI SATA ser.
Index 102 A access panel 30 accessing ser vers 28 adapter LEDs 78, 79, 81, 84 additional inform ation 75 ADU (Array Diagnost ic Utility) 76 B battery 73 battery - backed write cache (BBWC) 46, 48, 90 .
Index 103 L Large redundant air baff le 32 LED, health 78, 79 LED, system p ower 79 LED, UID 79, 81 LEDs 88, 89 LEDs, front panel 79 LEDs, hard drive 88, 89 LEDs, NIC 78, 79, 81, 84 LEDs, rear panel 8.
デバイスHP ProLiant ML350 G6の購入後に（又は購入する前であっても）重要なポイントは、説明書をよく読むことです。その単純な理由はいくつかあります：
HP ProLiant ML350 G6をまだ購入していないなら、この製品の基本情報を理解する良い機会です。まずは上にある説明書の最初のページをご覧ください。そこにはHP ProLiant ML350 G6の技術情報の概要が記載されているはずです。デバイスがあなたのニーズを満たすかどうかは、ここで確認しましょう。HP ProLiant ML350 G6の取扱説明書の次のページをよく読むことにより、製品の全機能やその取り扱いに関する情報を知ることができます。HP ProLiant ML350 G6で得られた情報は、きっとあなたの購入の決断を手助けしてくれることでしょう。
HP ProLiant ML350 G6を既にお持ちだが、まだ読んでいない場合は、上記の理由によりそれを行うべきです。そうすることにより機能を適切に使用しているか、又はHP ProLiant ML350 G6の不適切な取り扱いによりその寿命を短くする危険を犯していないかどうかを知ることができます。
ですが、ユーザガイドが果たす重要な役割の一つは、HP ProLiant ML350 G6に関する問題の解決を支援することです。そこにはほとんどの場合、トラブルシューティング、すなわちHP ProLiant ML350 G6デバイスで最もよく起こりうる故障・不良とそれらの対処法についてのアドバイスを見つけることができるはずです。たとえ問題を解決できなかった場合でも、説明書にはカスタマー・サービスセンター又は最寄りのサービスセンターへの問い合わせ先等、次の対処法についての指示があるはずです。
