IBMメーカーX220の使用説明書/サービス説明書
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ThinkP ad X220 T ablet and X220i T ablet Har dwar e Maint enance Manual.
Note: Before using this information and the pr oduct it supports, be sur e to read the gener al information under “Notices” on page 135. Second Edition (April 2011) © Copyright Lenovo 2011.
Contents About this manual . . . . . . . . . . . iii Chapter 1. Safety information . . . . . 1 General safety . . . . . . . . . . . . . . . . 1 Electrical safety . . . . . . . . . . . . . . . 2 Safety inspection guide . . . . . . . . . . . . 3 Handling devices that ar e sensitive t o electr ostatic discharge .
1140 DC-in connector , base cover , fan, digitizer pen case, and pen switch assembly . . . . . . 85 1150 System board and Expr essCard slot assemblies . . . . . . . . . . . . . . . . 89 1160 Speaker assembly . . . . . . . . . . . 92 1170 mSA T A solid state drive .
About this manual This manual contains service and r eference information for the following ThinkP ad ® products. ThinkP ad X220 T ablet and X220i T ablet Machine T ype 4294, 4296, 4297, 4298, 4299, 4300, and 4301 Use this manual along with the advanced diagnostic tests to troubleshoot pr oblems.
iv ThinkPad X220 T ablet and X220i T ablet Har dware Maintenance Manual.
Chapter 1. Safety information This chapter presents following safety information that you need to be familiar with befor e you service a ThinkPad Notebook.
Electrical safety Observe the following rules when working on electrical equipment. Important: Use only approved tools and test equipment. Some hand tools have handles covered with a soft mat erial that does not insulate you when working with live electrical curr ents.
– Use caution; do not become a victim yourself. – Switch off power . – Send another person t o get medical aid. Safety inspection guide The purpose of this inspection guide is to assist you in identifying pot entially unsafe conditions.
Notes: 1. Use product-specic ESD procedur es when they e xceed the r equirements not ed here. 2. Make sur e that the ESD protective devices you use have been certied (ISO 9000) as fully effective. When handling ESD-sensitive parts: • K eep the parts in prot ective packages until they ar e inserted into the product.
DANGER Some standby batteries contain a small amount of nickel and cadmium. Do not disassemble a standby battery, recharge it, throw it into re or water , or short-circuit it. Dispose of the battery as required by local ordinances or regulations. Use only the battery in the appropriate parts listing.
DANGER Unless hot swap is allowed for the FRU being replaced, do as follows before r emoving it: power off the computer , unplug all power cords fr om electrical outlets, remove the batt er y pack, and disconnect any interconnecting cables.
PERIGO Antes de ligar o computador após a substituição da FRU, certique-se de que todos os parafusos, molas e outras peças pequenas estejam no lugar e não estejam soltos dentro do computador . V erique isso sacudindo o computador e procurando ouvir sons de peças soltas.
A bateria de lítio pode causar incêndio, explosão ou graves queimadur as. Não a recarregue, r emova seu conector polarizado, desmonte-a, aqueça-a acima de 100°C (212°F), incinere-a, ou e xponha o conteúdo de sua célula à água. Descarte a bateria conforme requerido pelas leis ou regulamentos locais.
Certaines batt eries de secours contiennent du nickel et du cadmium. Ne les démonte z pas, ne les r echargez pas, ne les expose z ni au feu ni à l'eau. Ne les mettez pas en court-circuit. P our les mettre au rebut, conformez-vous à la r églementation en vigueur .
DANGER Si le r emplacement à chaud n'est pas autorisé pour l'unité remplaçable sur site que vous remplace z, procédez comme suit avant de retirer l'unité : mettez l'ordinateu.
Die Leuchtstoffröhr e im L CD-Bildschirm enthält Quecksilber . Bei der Entsorgung die örtlichen Bestimmungen für Sondermüll beachten. Der L CD-Bildschirm besteht aus Glas und kann z erbrechen, wenn er unsachgemäß behandelt wird oder der Computer auf den Boden fällt.
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Chapter 1 . Safety information 13.
Antes de encender el sistema despues de sustituir una FRU, compruebe que todos los tornillos, muelles y demás pie zas pequeñas se encuentran en su sitio y no se encuentr an sueltas dentro del sistema. Compruébelo agitando el sistema y escuchando los posibles ruidos que provocarían.
Las baterías contienen pequeñas cantidades de níquel. No las desmonte, ni recargue, ni las eche al fuego o al agua ni las cortocircuit e. Deséchelas tal como dispone la normativa local. Utilice sólo bat erías que se encuentren en la lista de pie zas al sustituir la batería.
Laser compliance statement (multilingual translations) The laser compliance stat ements in this section are provided in the following languages: • English • Ar abic • Br azilian P ortuguese • .
Chapter 1 . Safety information 17.
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Chapter 1 . Safety information 19.
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Chapter 1 . Safety information 21.
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Chapter 2. Important service information This chapter pr esents following important service information that applies to all machine types supported by this manual: • “Str ategy for r eplacing FRUs.
• If an adapter or a device consists of mor e than one FRU , any of the FRUs may be the cause of the error . Before replacing the adapter or device, r emove the FRUs, one by one, t o see if the sympt oms change. Replace only the FRU that changed the sympt oms.
Strat egy for replacing FRUs for C T O , CMV , and GA V Pr oduct denition Dynamic Congure T o Order (C TO) This provides the ability for a customer t o congur e an IBM ® or a Lenovo solution from an eSite, and have this congur ation sent to fulllment, where it is built and shipped directly to the customer .
• eSupport can be used to view the list of key commodities built in a particular machine serial (this is the same recor d found in PEW). • eSupport can be accessed at the following W eb site: http://www.lenovo.com/support • T o view the key commodities, click Download & Drivers .
Chapter 3. General check out This chapter pr esents following information: • “What to do rst” on page 27 • “Checkout guide” on page 28 – “Diagnostics using PC-Doctor for DOS” on p.
The following are not covered under warr anty: • L CD panel cracked fr om the application of e xcessive force or from being dropped • Scr atched (cosmetic) parts • Dist ortion, deformation, or d.
Note: When you initializ e the comput er conguration, some devices ar e disabled, such as the serial port. If you test one of these devices, you will need to enable it by using Conguration utility for DOS. The utility is available on the following W eb site: http://www.
Diagnostics Interactive T ests • Run Normal T est • Run Quick T est • CPU/Coprocessor • System board • Video Adapter • Fixed Disks • Diskette Drives • Other Devices • ThinkPad Device.
Lenovo ThinkV antage T oolbo x Lenovo ThinkV antage ® T oolbo x is a diagnostic pr ogram that works thr ough the Windows oper ating system. It enables you t o view sympt oms of comput er pr oblems an.
T able 1. FRU tests FRU Applicable t est System boar d 1. Diagnostics ➙ CPU/Coprocessor 2. Diagnostics ➙ Systemboar d 3. If the docking station or the port replicat or is attached to the ThinkP ad Notebook, detach it. 4. Place the computer on a horizontal surface, and run Diagnostics ➙ ThinkP ad Devices ➙ HDD Active P rotection T est .
P ower system checkout T o verify a symptom, do the following: 1. T urn off the computer . 2. Remove the batt ery pack. 3. Connect the ac power adapt er . 4. Check that power is supplied when you turn on the comput er . 5. T urn off the computer . 6. Disconnect the ac power adapter and install the char ged battery pack.
P erform oper ational char ging. If the batt ery status indicat or or icon does not turn on, r emove the battery pack and let it r eturn to room temper ature. Reinstall the batt ery pack. If the char ge indicator or icon still does not turn on, replace the battery pack.
Wire V oltage (V dc) Red +2.5 t o +3.2 Black Ground Red(+) Black(-) • If the voltage is corr ect, replace the syst em board. • If the voltage is not correct, r eplace the backup batt ery . • If the backup battery discharges quickly after replacement, r eplace the system boar d.
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Chapter 4. Related service information This chapter pr esents following information: • “Restoring the factory cont ents by using Pr oduct Recovery discs” on page 37 • “Restoring the fact ory.
Recovery Disc Set and the drive at the same time so that you can r ecover the new drive with the pr e-installed software when they arrive. F or information on which discs t o order , see “Recovery discs” on page 129.
11. After you have completed the Windows setup, you might want to r estore the original startup sequence. Start the ThinkP ad Setup progr am and then press F9 to r estore the default settings.
2. Remove the batt ery pack. F or how t o remove the batt ery pack, see “1020 Battery pack” on page 61. 3. Remove the backup battery . F or how to remove the backup battery, see “1080 Backup battery” on page 72. 4. T urn on the computer and wait until the POS T ends.
1. Press Fn+F3. A panel for selecting a power plan (in Windows XP , power scheme) appears. 2. Select P ower off display (k eep current power plan) (in Windows XP , k eep current power scheme ). Y ou can also put the computer into scr een blank mode, pr ess ThinkV antage button and use the ThinkV antage Pr oductivity Center .
T o cause the comput er to enter hibernation mode, do any of the following: • P ress the Fn+F12 keys. • If you have dened one of the following actions as the event that causes the syst em to go into hibernation mode, perform that action. – Closing the lid.
Numeric error codes T able 2. Numeric error codes Symptom or error FRU or action, in sequence 0175 Bad CRC1, st op POS T task—The EEPROM checksum is not corr ect. System board. 0176 System Security—The system has been tamper ed with. 1. Run the ThinkP ad Setup progr am, and save the current setting by pressing F10.
T able 2. Numeric error codes (continued) Symptom or error FRU or action, in sequence 0197 Invalid remot e change r equested. The remote conguration for the security chip has failed. Conrm the operation and try again. 0199 System Security— Security passwor d retry count ex ceeded.
T able 2. Numeric error codes (continued) Symptom or error FRU or action, in sequence 0270 Real-time clock error . 1. Charge the backup battery for more than 8 hours by connecting the ac power adapter . 2. Replace the backup battery and run the ThinkP ad Setup pr ogram to reset the time and date.
T able 2. Numeric error codes (continued) Symptom or error FRU or action, in sequence 1810 Hard disk partition layout error . 1. If the Access Predesktop Area has been previously disabled, then go to the ThinkPad Setup progr am by pressing F1 to open the ThinkP ad Setup program.
T able 2. Numeric error codes (continued) Symptom or error FRU or action, in sequence 2102 Initialization error on HDD1 (Ultrabay har d disk drive) 1. Reseat the hard disk drive. 2. Ultrabay har d disk drive. 3. System board. 2110 Read err or on HDD0 (Main hard disk drive) 1.
T able 3. Error messages (continued) Symptom or error FRU or action, in sequence Cannot boot fr om any device. Check the status of device which you want to boot from. Device not found. 1. The device you want to boot fr om. 2. System board. Device Err or .
No-beep symptoms T able 5. No-beep symptoms Symptom or error FRU or action, in sequence No beep, power-on indicator on, L CD blank, and no POST . 1. Make sure that every connector is connected tightly and correctly . 2. DIMM. 3. System board. No beep, power -on indicator on, and L CD blank during POST .
2. If no error is detected, do not r eplace any FRUs. 3. If any error is detected, r eplace the FRU shown by the FRU code. Rerun the test t o verify that no more errors e xist.
Chapter 5. Status indicators This chapter presents the system status indicators that show the status of the computer . 5 6 © Copyright L enovo 2011 51.
T able 7. S tatus indicators Indicator Meaning 1 Wireless LAN status Green: The wir eless LAN featur e is on, and the r adio link is ready for use, or the data is being tr ansmitted. Blinking green: Data is being tr ansmitted (for some models). 2 Wireless status R Green: Wireless P AN ( Bluetooth wireless or Wireless USB) is oper ational.
Chapter 6. Fn key combinations The following table shows the function of each combination of Fn with a function k ey . T able 8. Fn key combinations Key combination Description Fn+F1 Reserved.
T able 8. Fn key combinations (continued) Key combination Description F or Windows 7: Switch a display output location • Computer display only (L CD) • Computer display and external monitor (same .
Chapter 7. FRU replacement notices External CRU statement t o customers: Some problems with your pr oduct can be r esolved with a replacement part you can install yourself, called a “Cust omer Replaceable Unit” or “CRU . ” Some CRUs ar e designated as Self-service CRUs and others are designated as Optional-service CRUs.
• T orque driver If you have a tor que driver , refer to the “T orque” column for each step. • Make sure that you use the correct scr ew. If you have a t orque scr ewdriver , tighten all screws rmly to the tor que shown in the table. Never use a screw that you removed.
MTM on rear label: TTTT -C T O S/N SSSSSSS Product ID on rear label: TTTT -MMM (Use this number when setting Serial Number) In the example, the Serial Number to be input is “1S TTTTMMMSSSSSSS”.
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Chapter 8. Removing and replacing a FRU External CRU statement t o customers: Some problems with your pr oduct can be r esolved with a replacement part you can install yourself, called a “Cust omer Replaceable Unit” or “CRU . ” Some CRUs ar e designated as Self-service CRUs and others are designated as Optional-service CRUs.
Before servicing ThinkP ad X220 T ablet and X220i T ablet models Removing the SIM card: Some models of the ThinkPad X220 T ablet and X220i T ablet you are servicing might have the SIM card that the customer has been installed. If the computer you are servicing has the SIM card, remove it before you start the servicing.
1010 Digitizer pen T able 9. Removal steps of digitizer pen 1020 Batter y pack Important notice for replacing a battery pack: Lenovo ThinkV antage T oolbo x (in Windows 7) has an automatic battery diagnostic that det ermines if the battery pack is defective.
T able 10. Removal steps of battery pack Slide the left batt ery latch to the unlocked position 1 , and then hold the right battery latch to the unlocked position until you r emove the battery 2 . 1 2 2 When installing: Install the battery pack along the slide rails of the slot.
T able 11. Removal st eps of hard disk drive and solid state drive Note: Loosen the screw 1 . 1 2 3 Step Screw (quantity) Color T or que 1 Hard disk drive screw , M3 × 3 mm, wafer -head, nylon-coat ed (1) Black 0.
T able 11. Removal steps of hard disk drive and solid state drive (continued) 5 HDD and HDD rubber rails: 6 6 SSD and SSD spacers: 6 6 When installing: Rubber r ails on the hard disk drive or spacers on the solid state drive must be attached to the replacement drive.
T able 12. Removal steps of DIMM Remove the DIMM slot cover as shown in the following gure. Note: Loosen the screws 1 . 2 1 1 Note: If only one DIMM is used on the comput er you ar e servicing, the card must be installed in SL O T -0 a , but not in SL OT -1 b .
T able 12. Removal steps of DIMM (continued) When installing: Insert the notched end of the DIMM into the socket. Pr ess the DIMM rmly, and pivot it until it snaps into place. Make sur e that it is rmly installed in the slot and does not move easily .
1060 Keyboard F or access, remove this FRU: • “1020 Battery pack” on page 61 T able 14. Removal steps of keyboard Remove the scr ews 1 . Step Icon Screw (quantity) Color T or que 1 M2 × 6 mm, wafer-head, nylon-coat ed (2) Black 0.
T able 14. Removal steps of k eyboard (continued) Lift the keyboar d a little in the direction shown by arr ow 5 , and then detach the connector 4 . 68 ThinkP ad X220 T ablet and X220i T ablet Hardwar.
T able 14. Removal steps of k eyboard (continued) When installing: 1. Attach the keyboar d connector rmly . 2. Make sur e that the keyboard edge is under the frame as shown in the following gure. Then press the keys to latch the k eyboard rmly in place.
1070 Palm rest F or access, remove these FRUs in or der: • “1020 Battery pack” on page 61 • “1060 Keyboard” on page 67 T able 15. Removal steps of palm rest Step Icon Screw (quantity) Color T or que 1 M2 × 6 mm, wafer-head, nylon-coated (5) Black 0.
T able 15. Removal steps of palm rest (continued) 2 3 4 4 5 5 5 Chapter 8 . Removing and r eplacing a FRU 71.
T able 15. Removal steps of palm rest (continued) When installing: When you attach the palm rest, do as follows: 1. Attach the touch pad connector rmly t o the system boar d. 2. Press the left and right top edges of the palm r est to t it into place.
T able 16. Removal steps of backup battery Chapter 8 . Removing and r eplacing a FRU 73.
T able 16. Removal steps of backup battery (continued) When installing: Make sure that the battery connector is attached rmly . 1090 PCI Express Mini Car d for wireless LAN/WiMAX F or access, remove these FRUs in or der: • “1020 Battery pack” on page 61 • “1060 Keyboard” on page 67 • “1070 Palm r est” on page 70 T able 17.
T able 17. Removal steps of PCI Express Mini C ard for wireless LAN/WiMAX (continued) Step Screw (quantity) Color T or que 2 M2 × 3.5 mm, wafer-head, nylon-coated (1) Silver 0.
T able 17. Removal steps of PCI Express Mini C ard for wireless LAN/WiMAX (continued) When installing • In models with a wireless LAN car d that has two antenna connectors, plug the gray cable int o the jack labeled MAIN or M on the card, and the black cable into the jack labeled AUX or A .
T able 18. Removal st eps of PCI Express Mini Card for wireless W AN In step 1 , unplug the jacks by using the removal tool ant enna RF connector (P/N: 08K7159) or pick the connect ors with your ngers and gently unplug them in the direction of the arr ow.
T able 18. Removal steps of PCI Express Mini Card for wireless W AN (continued) When installing: When you install the card, plug the red cable int o the jack labeled MAIN on the card, and the blue cable into the jack labeled AUX .
• “1020 Battery pack” on page 61 • “1060 Keyboard” on page 67 • “1070 Palm r est” on page 70 T able 19. Removal steps of Bluetooth daughter car d Step Screw (quantity) Color T or que 1 M2 × 3.5 mm, wafer-head, nylon-coated (1) Silver 0.
• “1070 Palm r est” on page 70 T able 20. Removal steps of keyboard bezel 1 2 2 1 1 Step Screw (quantity) Color T or que 1 M2 × 6 mm, wafer -head, nylon-coated (3) Black 0.181 Nm (1.85 kgfcm) 2 M2 × 3.5 mm, wafer-head, nylon-coated (2) Silver 0.
T able 20. Removal steps of keyboard bez el (continued) Step Screw (quantity) Color T or que 3 M2 × 2 mm, wafer -head, nylon-coated (4) Black 0.181 Nm (1.85 kgfcm) Rotate the L CD unit as shown in the following gur e. In st ep 5 , detach the claws.
T able 20. Removal steps of keyboard bez el (continued) When installing: Make sure that all the claws ar e attached rmly . 1130 L CD assembly F or access, remove these FRUs in or der: • “1010 D.
T able 21. Removal steps of L CD assembly (continued) Step Screw (quantity) Color T or que 2 M2.5 × 6 mm, wafer-head, nylon-coated (2) Black 0.392 Nm (4 kgfcm) Before st ep 3 , strip off the tapes securing the antenna cables, and release the cables from the cable guides of the frame.
T able 21. Removal steps of L CD assembly (continued) 7 When installing: • Make sure that you attach the connect ors rmly . • Make sur e that you route the cables correctly and you tape up the cables in the proper positions as shown in the following gure.
1140 DC-in connector , base cover , fan, digitizer pen case, and pen switch assembly F or access, remove these FRUs in or der: • “1010 Digitizer pen” on page 61 • “1020 Battery pack” on pa.
T able 22. Removal st eps of DC-in connector , base cover , fan, digitiz er pen case, and pen switch assembly (continued) 4 4 4 4 Step Screw (quantity) Color T or que 4 M2 × 3.5 mm, wafer -head, nylon-coated (4) Silver 0.181 Nm (1.85 kgfcm) 5 6 7 When installing: Make sur e that the wir eless switch is adjusted as shown by callout a .
T able 22. Removal st eps of DC-in connector , base cover , fan, digitiz er pen case, and pen switch assembly (continued) T urn the system boar d over , and then disconnect the DC-in connect or , the fan connector , and the pen switch connector from the system board.
T able 22. Removal st eps of DC-in connector , base cover , fan, digitiz er pen case, and pen switch assembly (continued) Step Screw (quantity) Color T or que 11 M2 × 3.5 mm, at-head, nylon-coated (1) Silver 0.181 Nm (1.85 kgfcm) When installing: • Before you attach the fan assembly to the computer , apply thermal gr ease, at an amount of 0.
8 Wireless car d label (only for Br azil) 9 Modem AMOM label 10 MEDEM label (only for PRC model) 11 Bluetooth label 12 China WW AN label 13 SIRIM label or POS TEL label 14 Non-encryption label (for no.
Note: Dr opping a system boar d fr om a height of as little as 6 inches so that it falls at on a har d bench can subject the acceler ometer t o as much as 6,000 G's of shock. • Be car eful not to drop the syst em board on a bench top that has a hard surface, such as metal, wood, or composite.
T able 23. Removal steps of system board and ExpressCard slot assembly (continued) b c a Note: The ExpressC ard slot assembly is attached to the system boar d. Step Screw (quantity) Color T orque 1 M2 × 3.5 mm, wafer-head, nylon-coated (2) Silver 0.181 Nm (1.
T able 23. Removal steps of system board and ExpressCard slot assembly (continued) T urn the system board over , and then r emove the Expr essCard slot assembly from the system board.
T able 24. Removal steps of speaker assembly Remove the speaker assembly from the base cover assembly . 1 2 3 Chapter 8 . Removing and r eplacing a FRU 93.
T able 24. Removal steps of speak er assembly (continued) Step Screw (quantity) Color T or que 2 M2 × 3mm, wafer-head, nylon-coated (1) Black 0.181 Nm (1.85 kgfcm) When installing: Route the speaker cables along the cable guides as shown in the following gure.
Removal steps of mSA T A solid stat e drive 1 Step Screw (quantity) Color T orque 1 M2 × 3 mm, at-head, nylon-coat ed (1) Black 0.181 Nm (1.85 kgfcm) 2 2010 L CD front bezel F or access, remove this FRU: • “1020 Battery pack” on page 61 Chapter 8 .
T able 25. Removal steps of L CD front bezel Step Screw cap Screw (quantity) Color T or que 1 M2.5 × 8 mm, wafer -head, nylon-coat ed (3) Black 0.392 Nm (4 kgfcm) 2 3 2 4 When installing: Attach the ngerprint reader connect or rmly .
2020 Micro-P rocessor card F or access, remove these FRUs in or der: • “1020 Battery pack” on page 61 • “2010 L CD front bez el” on page 95 T able 26. Removal st eps of Micro-P rocessor card Step Screw (quantity) Color T orque 1 M2 × 3.5 mm, wafer -head, nylon-coated (2) Silver 0.
T able 26. Removal steps of Micro-Processor card (continued) When installing: Make sure that connectors 2 and 3 ar e attached rmly . 2030 Hinge F or access, remove these FRUs in or der: • “1010.
T able 27. Removal steps of the hinge 1 1 Step Screw (quantity) Color T or que 1 M2.5 × 6 mm, wafer-head, nylon-coated (2) Black 0.392 Nm (4 kgfcm) Detach the hinge from the L CD rear cover , and gently pull the cables out thr ough the guide hole in the hinge.
• “2010 L CD front bez el” on page 95 • “2020 Micr o-Processor car d” on page 97 • “2030 Hinge” on page 98 T able 28. Removal steps of L CD panel and L CD cable 2 2 2 1 1 1 1 1 1 Step Screw cap Screw (quantity) Color T or que 1 M2.5 × 8 mm, wafer -head, nylon-coat ed (6) Black 0.
T able 28. Removal steps of L CD panel and L CD cable (continued) In step 3 , detach the claws. Then remove the L CD panel. 3 3 3 3 3 3 3 3 3 3 When installing: • Make sure that all the claws ar e attached rmly . • When attaching the L CD panel to the cover , gently press the left and right edges covered with metal.
T able 28. Removal steps of L CD panel and L CD cable (continued) T urn the L CD panel over , and then remove the L CD cable from the L CD panel. 6 7 10 11 8 9 4 5 When installing: Make sure that the L CD cable connect ors are attached rmly .
T able 29. Removal steps of Integrat ed camera 1 3 2 Step Screw (quantity) Color T or que 1 M2 × 3.5 mm, wafer-head, nylon-coated (1) Silver 0.181 Nm (1.
T able 30. Removal steps of L CD rear cover and wireless antenna cables 1 Step Screw (quantity) Color T or que 1 M2 × 3.5 mm, wafer-head, nylon-coated (1) Silver 0.
T able 30. Removal steps of L CD rear cover and wireless antenna cables (continued) In step 3 , r elease the ant enna cables fr om the cable guides of the r ear cover . 3 3 3 3 4 When installing: Place the antenna assembly as shown in the following gure.
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Chapter 9. Locations This chapter pr esents the locations of ThinkP ad X220 T ablet and X220i T ablet features and har dware components. © Copyright L enovo 2011 107.
F ront view 1 Integr ated camer a 2 Built-in micr ophone 3 Security keyhole 4 T ablet digitizer pen 5 Hard disk drive (HDD) or solid state drive (SSD) 6 Combo audio jack 7 Ethernet connector 8 Always .
Rear view 1 Status indicators Note: F or the description of each indicator , see Chapter 5 “Status indicat ors” on page 51. 2 ExpressC ard slot 3 Wireless r adio switch 4 USB connector 5 DisplayP .
Bottom view 1 Battery pack latch 2 Battery pack 3 Docking connector 4 DIMM slots 5 Built-in speakers 1 2 3 1 4 5 110 ThinkP ad X220 T ablet and X220i T ablet Har dware Maintenance Manual.
T op view (ThinkP ad X220 Ultr aBase) 1 Docking connector 2 ac power connector 3 Ethernet connector 4 DisplayP ort connect or 5 External monitor connector 6 Headphone jack 7 Microphone jack 8 USB conn.
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Chapter 10. Parts list This section contains following lists of the service parts. • “Overall” on page 114 • “L CD FRUs” on page 122 • “Keyboar d” on page 125 • “Miscellaneous pa.
Overall 1 2 3 6 7 11 10 12 13 15 16 18 19 20 21 22 23 24 25 26 28 27 14 17 4 5 8 9 114 ThinkP ad X220 T ablet and X220i T ablet Har dware Maintenance Manual.
T able 31. P arts list—Overall No. FRU FRU no. CRU ID 1 L CD unit (see “L CD FRUs” on page 122 .) 2 Digitizer pen case assembly 04W1477 N 3 Backup batt ery 02K7078 N 4 1-GB DDR3-1333 SDRAM SO-DI.
T able 31. Parts list—Overall (continued) No. FRU FRU no. CRU ID 5 System board assembly with Intel Cor e i7-2620M pr ocessor , AMT , non- TPM, non-AES • 4294-2Ax 04W2132 N 5 System board assembly.
T able 31. Parts list—Overall (continued) No. FRU FRU no. CRU ID 7 ThinkP ad b/g/n Wir eless (1x1 BGN) • 4294-28x, 29x 60Y3247 ** 7 ThinkP ad b/g/n Wir eless (1x1 BGN) • 4294-28x, 29x 60Y3249 **.
T able 31. Parts list—Overall (continued) No. FRU FRU no. CRU ID 8 Battery pack, 6 cell, 52+ • 4294-22x, 23x, 24x, 26x, 27x, 28x, 29x, 2Ax, 2Dx, 2Ex • 4296-22x, 23x, 24x, 25x, 26x, 27x, 28x, 29x.
T able 31. Parts list—Overall (continued) No. FRU FRU no. CRU ID 10 SA T A hard disk drive, 160 GB, 7,200 rpm • 4294-CT O • 4296-CT O • 4297-CT O • 4298-CT O • 4299-CT O 42T1169 ** 10 SA T.
T able 31. Parts list—Overall (continued) No. FRU FRU no. CRU ID 12 SA T A solid stat e drive, 160 GB • 4294-23x, 2Ax • 4296-29x, 2Dx, 2Fx, 2Jx, 2Lx, 34x, 35x, 38x • 4298-28x, 29x, 2Cx, 2Fx, 2.
T able 31. Parts list—Overall (continued) No. FRU FRU no. CRU ID 17 Base cover assembly • 4294-CT O • 4296-CT O , 2Bx, 2Cx • 4297-CT O • 4298-CT O , 26x, 27x • 4299-CT O , 26x, 27x 04W2077 N 18 Bluet ooth daughter card (BDC-2.
T able 31. Parts list—Overall (continued) No. FRU FRU no. CRU ID 28 Fingerprint r eader • 4294-22x, 23x, 24x, 26x, 27x, 28x, 29x, 2Ax, 2Bx, 2Dx, 2Ex • 4296-22x, 24x, 25x, 26x, 27x, 28x, 29x, 2Ax.
• 12.5-in. HD LED backlight L CD (T able 32 “P arts list—12.5-in. HD LED backlight L CD for multi-touch panel L CD or outdoor L CD” on page 124) 1 2 3 4 5 6 7 8 9 10 Chapter 10 .
T able 32. Parts list—12.5-in. HD LED backlight L CD for multi-touch panel L CD or outdoor L CD No. FRU FRU no. CRU ID 1 L CD panel, 12.5-in. WXGA, LED backlight for multi-touch panel • 4294–23x.
T able 32. P arts list—12.5-in. HD LED backlight L CD for multi-t ouch panel L CD or outdoor L CD (continued) No. FRU FRU no. CRU ID 9 L CD button bezel with ngerprint reader • 4294-22x, 23x, 2.
T able 33. Parts list—K eyboard (continued) Language P/N CRU ID German 45N2223 45N2083 45N2153 Greek (U.S. English and Gr eek layout) 45N2224 45N2084 45N2154 Hungarian 45N2226 45N2086 45N2156 Icelan.
Miscellaneous parts T able 34. Parts list—Miscellaneous parts FRU P/N CRU ID Screw kit: • M2 × 3 mm, (2) • M2 × 3.5, mm (31) • M2 × 5 mm, (10) • M2 × 2 mm, (1) • M2 × 3.5 mm, (3) • M2 × 3 mm, (8) • M2.5 × 6 mm , (9) • M3 × 3.
AC adapters T able 35. Parts list—AC adapters FRU P/N CRU ID 2-pin (65 W , 20 V) adapter (models C T O, xxE, xxF , xxJ, xxL, xxP , xxS, xxY , xxU) 42T5282 2-pin (65 W , 20 V) adapter (models C T O, .
T able 37. P arts list—3-pin power cords (continued) Country or region FRU no. CRU ID Israel • models -C TO , xxG 42T5062 42T5147 Italy • models -C TO , xxG 42T5047 42T5132 Kor ea • models -C TO , xxK 42T5077 42T5162 Switzerland • models -C TO , xxG 42T5044 42T5129 T aiwan • models -C TO , xxV 42T5071 42T5156 U.
T able 39. P arts list—Windows XP P rofessional Generic (32 bit) recovery DVDs Language P/N CRU ID Brazilian P ortuguese 03W7476 Czech 03W7479 Danish 03W7480 Dutch 03W7490 Finnish 03W7481 F rench 03.
• 4297-C T O • 4298-C T O • 4299-C T O T able 41. Parts list—Windows Vista Business (32 bit) recovery DVDs Language P/N CRU ID English 03W8398 Japanese 03W8397 * Windows Vista Home Basic (32 bit) DVDs • 4294-C T O • 4296-C T O • 4297-C T O • 4298-C T O • 4299-C T O T able 42.
T able 44. P arts list—Windows 7 Ultimate (32 bit) recovery DVDs Language P/N CRU ID English 04X0003 * Windows 7 Pr ofessional (64 bit) DVDs Windows 7 Pr ofessional (64 bit) is pr einstalled as the .
T able 45. P arts list—Windows 7 Professional (64 bit) recovery DVDs (continued) Language P/N CRU ID T r aditional Chinese 04X0007 T r aditional Chinese (Hong Kong S.
Windows 7 Home P remium (32 bit) DVDs Windows 7 Home Pr emium (32 bit) is pr einstalled as the operating syst em in the following models: • 4294-C T O • 4296-C T O • 4297-C T O • 4298-C T O • 4299-C T O T able 48.
T able 49. P arts list—Windows 7 Home P remium (64 bit) recovery DVDs (continued) Language P/N CRU ID Simplied Chinese 04X0048 Slovakian 04X0063 Spanish 04X0064 T r aditional Chinese 04X0049 T r aditional Chinese (Hong Kong S.A.R.) 04X0055 T urkish 04X0066 US English 04X0068 US English (Disabled) 04X0067 Common ser vice tools T able 50.
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138 ThinkP ad X220 T ablet and X220i T ablet Har dware Maintenance Manual.
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Part Number: 0A60175_01 Printed in China (1P) P/N: 0A60175_01 *0A60175_01*.
デバイスIBM X220の購入後に(又は購入する前であっても)重要なポイントは、説明書をよく読むことです。その単純な理由はいくつかあります:
IBM X220をまだ購入していないなら、この製品の基本情報を理解する良い機会です。まずは上にある説明書の最初のページをご覧ください。そこにはIBM X220の技術情報の概要が記載されているはずです。デバイスがあなたのニーズを満たすかどうかは、ここで確認しましょう。IBM X220の取扱説明書の次のページをよく読むことにより、製品の全機能やその取り扱いに関する情報を知ることができます。IBM X220で得られた情報は、きっとあなたの購入の決断を手助けしてくれることでしょう。
IBM X220を既にお持ちだが、まだ読んでいない場合は、上記の理由によりそれを行うべきです。そうすることにより機能を適切に使用しているか、又はIBM X220の不適切な取り扱いによりその寿命を短くする危険を犯していないかどうかを知ることができます。
ですが、ユーザガイドが果たす重要な役割の一つは、IBM X220に関する問題の解決を支援することです。そこにはほとんどの場合、トラブルシューティング、すなわちIBM X220デバイスで最もよく起こりうる故障・不良とそれらの対処法についてのアドバイスを見つけることができるはずです。たとえ問題を解決できなかった場合でも、説明書にはカスタマー・サービスセンター又は最寄りのサービスセンターへの問い合わせ先等、次の対処法についての指示があるはずです。