Intelメーカー5000の使用説明書/サービス説明書
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Intel ® 5000 Series Chipset Memory Controller Hub(MCH) Thermal/Mechanical Design Guide May 2006 Document Number: 313067-001.
2 Intel® 5000 Series Chipset Memory Controller Hub (MCH) Thermal Mechanical Design Guide INFORMA TION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL ® PRODUCTS .
Intel® 5000 Series Chipset Memory Controller Hub (MCH) Thermal Mechanical Design Guide 3 Contents 1I n t r o d u c t i o n ......... ............. ............... ............ ............... ............... ............ ............... .... 7 1.1 Design Flow .
4 Intel® 5000 Series Chipset Memory Controller Hub (MCH) Thermal Mechanical Design Guide A Thermal Solution Component Suppliers ........... ............. ............... ............ ............... .. 41 A.1 Tall Torsional Clip Heatsink Th erm al Solution .
Intel® 5000 Series Chipset Memory Controller Hub (MCH) Thermal Mechanical Design Guide 5 Tables 3-1 Intel® 5000P Chipset MCH Thermal Spe cifications ...... .. ........... .. ............... .. ........... 13 3-2 Intel® 5000V Chipset MCH Thermal Spe c ifications .
6 Intel® 5000 Series Chipset Memory Controller Hub (MCH) Thermal Mechanical Design Guide Revision Table §§ Revision Number Description Date -001 Initial release of the document.
Intel® 5000 Series Chipset Memory Controller Hub (MCH) Thermal Mechanical Design Guide 7 Introduction 1 Introduction As the complexity of computer systems increases, so do the power dissipation requirements. Care must be take n to ensure that the additional power is properly dissipated.
Introduction 8 Intel® 5000 Series Chipset Memory Controller Hub (MCH) Thermal Mechanical Design Guide 1.2 Definition of Terms BGA Ball grid array . A package type, defined by a resin-fiber substrate, onto which a die is m ounted, bonded and encapsulated in molding comp ound.
Intel® 5000 Series Chipset Memory Controller Hub (MCH) Thermal Mechanical Design Guide 9 Introduction T case_min Minimum IHS temperature allo wed. This temperature is measured at the geometric center of the top of IHS. TDP Thermal design power . Thermal solutions should be designed to dissipate this target power level.
Introduction 10 Intel® 5000 Series Chipset Memory Controller Hub (MCH) Thermal Mechanical Design Guide.
Intel® 631xESB/632xESB I/O Controller Hub Thermal Mechanical Design Guide 11 Packaging Technology 2 Packaging Technology Intel 5000 Series chipset consist of three individual components: the Mem ory Controller Hub (MCH), the Intel ® 6700PXH 64-bit P CI Hub (PXH) and the Intel ® 631xESB/632xESB I/O Controller Hub.
Packaging Technology 12 Intel® 631xESB/632xESB I/O Controller Hub Thermal Mechanical Design Guide Notes: 1. All dimensions are in millimeters. 2. All dimensions and toler ances conform to ANSI Y14.
Intel® 631xESB/632xESB I/O Controller Hub Thermal Mechanical Design Guide 13 Thermal Specifications 3 Thermal Specifications 3.1 Thermal Design Power (TDP) Analysis indicates that real applications are unlikely to cause the MCH component to consume maximum power dissipation for sustained time periods.
Thermal Specifications 14 Intel® 631xESB/632xESB I/O Controller Hub Thermal Mechanical Design Guide Note: These specifications are based on preliminar y silicon char acterization, however , they may be updated as further data becomes available. § Table 3-3.
Intel® 631xESB/632xESB I/O Controller Hub Thermal Mechanical Design Guide 15 Thermal Simulation 4 Thermal Simulation Intel provides thermal simulation models of the Intel 5000 Series chipset MCH and .
Thermal Simulation 16 Intel® 631xESB/632xESB I/O Controller Hub Thermal Mechanical Design Guide.
Intel® 631xESB/632xESB I/O Controller Hub Thermal Mechanical Design Guide 17 Thermal Metrology 5 Thermal Metrology The system designer must make temperatur e measurements to accurately determine the thermal performance of the system. Inte l has established guidelines for proper techniques to measure the MCH case temper atures.
Thermal Metrology 18 Intel® 631xESB/632xESB I/O Controller Hub Thermal Mechanical Design Guide Note: 1. Three axes set co nsists of (1ea. U-31CF), (1 ea. UX-6 -6), (1ea. USM6) and (1ea. UPN-1). More information available a t: http://www.narishige.co.
Intel® 631xESB/632xESB I/O Controller Hub Thermal Mechanical Design Guide 19 Thermal Metrology 5.1.4 Thermocouple Condit ioning and Preparation 1. Use a calibrated thermocouple as specified in Ta b l e 5 - 1 .
Thermal Metrology 20 Intel® 631xESB/632xESB I/O Controller Hub Thermal Mechanical Design Guide 5.1.5 Thermocouple Attachment to the IHS Caution: T o avoid the impact on the thermocouple during the SMT process, reflow must be performed before attaching the ther mocouple to the groov ed MCH IHS.
Intel® 631xESB/632xESB I/O Controller Hub Thermal Mechanical Design Guide 21 Thermal Metrology Figure 5-4. Securing T hermocouple Wires with Kanton* Tape Prior to At tach Figure 5-5.
Thermal Metrology 22 Intel® 631xESB/632xESB I/O Controller Hub Thermal Mechanical Design Guide Figure 5-6. Position Bead on the Groove Step Figure 5-7.
Intel® 631xESB/632xESB I/O Controller Hub Thermal Mechanical Design Guide 23 Thermal Metrology 5.1.6 Curing Process 1. Let the thermocouple attach sit in the open air for at least half an hour . Using any curing accelerator lik e Loctite 7452 Accelerator* for this step is not recommended.
Thermal Metrology 24 Intel® 631xESB/632xESB I/O Controller Hub Thermal Mechanical Design Guide 5.1.7 Thermocouple Wire Management Figure 5-10. Thermocoupl e Wire Management Groove Figure 5-11.
Intel® 631xESB/632xESB I/O Controller Hub Thermal Mechanical Design Guide 25 Thermal Metrology Note: Prior to installing the heatsink, be sure th at the thermocouple wires remain below the IHS top surface by running a flat blade on top of the IHS for example.
Thermal Metrology 26 Intel® 631xESB/632xESB I/O Controller Hub Thermal Mechanical Design Guide.
Intel® 631xESB/632xESB I/O Controller Hub Thermal Mechanical Design Guide 27 Reference Thermal Solution 6 Reference Thermal Solution Intel has developed two different reference th ermal solutions to meet the cooling n eeds of the Intel 5000 Series chipset MCH under operating en vironments and specifications defined in this document.
Reference Thermal Solution 28 Intel® 631xESB/632xESB I/O Controller Hub Thermal Mechanical Design Guide 6.3 Mechanical Design Envelope While each design may ha ve unique mechan ical volume and height.
Intel® 631xESB/632xESB I/O Controller Hub Thermal Mechanical Design Guide 29 Reference Thermal Solution 6.5 Tall Torsional Clip Heatsink Thermal Solution Assembly The reference thermal solution for the chipse t MCH is a passive extruded heatsink with thermal interface.
Reference Thermal Solution 30 Intel® 631xESB/632xESB I/O Controller Hub Thermal Mechanical Design Guide Note: All dimensions are in inches. 6.5.1 Heatsink Orientation Since this solution is based on a unidirectional heatsink, mean airflow direction must be aligned with the direction of the heatsink fins.
Intel® 631xESB/632xESB I/O Controller Hub Thermal Mechanical Design Guide 31 Reference Thermal Solution 6.5.2 Extruded Heatsink Profiles The reference thermal solution uses an extr uded heatsink for coo ling the chipset MCH. Figure 6-6 shows the heatsink profile.
Reference Thermal Solution 32 Intel® 631xESB/632xESB I/O Controller Hub Thermal Mechanical Design Guide 6.5.6 Clip Retention Anchors For Intel 5000 Series chipset-based platforms th at have very limited board space, a clip retention anchor has been developed to minimize the impact of clip retention on the board.
Intel® 631xESB/632xESB I/O Controller Hub Thermal Mechanical Design Guide 33 Reference Thermal Solution Notes: 1. It is recommended that the above tests be performe d on a sample size of at least twelve assemblies from three lots of material. 2. Addition al pass/fail criteri a may be added at the d iscretion of the user .
Reference Thermal Solution 34 Intel® 631xESB/632xESB I/O Controller Hub Thermal Mechanical Design Guide.
Intel® 631xESB/632xESB I/O Controller Hub Thermal Mechanical Design Guide 35 Reference Thermal Solution 2 7 Reference Thermal Solution 2 Intel has developed two different reference th ermal solutions to meet the cooling n eeds of the Intel 5000 Series chipset MCH under operating en vironments and specifications defined in this document.
Reference Thermal Solution 2 36 Intel® 631xESB/632xESB I/O Controller Hub Thermal Mechanical Design Guide 7.3 Mechanical Design Envelope While each design may ha ve unique mechan ical volume and heig.
Intel® 631xESB/632xESB I/O Controller Hub Thermal Mechanical Design Guide 37 Reference Thermal Solution 2 7.5 Short Torsional Clip He atsink Thermal Solution Assembly The reference thermal solution for the chipse t MCH is a passive extruded heatsink with thermal interface.
Reference Thermal Solution 2 38 Intel® 631xESB/632xESB I/O Controller Hub Thermal Mechanical Design Guide Note: NOTE: All dimensions are in inches. 7.5.1 Heatsink Orientation Since this solution is based on a unidirectional heatsink, mean airflow direction must be aligned with the direction of the heatsink fins.
Intel® 631xESB/632xESB I/O Controller Hub Thermal Mechanical Design Guide 39 Reference Thermal Solution 2 7.5.2 Extruded Heatsink Profiles The reference thermal solution uses an extr uded heatsink for coo ling the chipset MCH. Figure 7-6 shows the heatsink profile.
Reference Thermal Solution 2 40 Intel® 631xESB/632xESB I/O Controller Hub Thermal Mechanical Design Guide.
Intel® 631xESB/632xESB I/O Controller Hub Thermal Mechanical Design Guide 41 Thermal Solution Component Suppliers A Thermal Solution Component Suppliers A.1 Tall Torsional Clip Heatsink Thermal Solution Note: The enabled components may not be currently av ailable from all suppliers.
Thermal Solution Component Suppliers 42 Intel® 631xESB/632xESB I/O Controller Hub Thermal Mechanical Design Guide A.2 Short Torsional Clip Heatsink Thermal Solution Note: The enabled components may not be curre ntly av ailable from all suppliers. Contact the supplier directly to verify ti me of component av ailability .
Intel® 631xESB/632xESB I/O Controller Hub Thermal Mechanical Design Guide 43 Mechanical Drawings B Mechanical Drawings Ta b l e B - 1 lists the mechanical dr awings included in this appendix.
Mechanical Drawings 44 Intel® 631xESB/632xESB I/O Controller Hub Thermal Mechanical Design Guide Figure B- 1 . Tall Tors ional Clip He atsink Assem bly Drawing.
Intel® 631xESB/632xESB I/O Controller Hub Thermal Mechanical Design Guide 45 Mechanical Drawings Figure B-2. Tall Torsional Clip Heatsink Drawing (Sheet 1 of 2).
Mechanical Drawings 46 Intel® 631xESB/632xESB I/O Controller Hub Thermal Mechanical Design Guide Figure B-3 . Tall Torsion al Clip Heats i nk Drawing (S heet 2 of 2).
Intel® 631xESB/632xESB I/O Controller Hub Thermal Mechanical Design Guide 47 Mechanical Drawings Figure B-4. Tall Torsional Clip Heatsink Clip Drawing.
Mechanical Drawings 48 Intel® 631xESB/632xESB I/O Controller Hub Thermal Mechanical Design Guide Figure B-5 . Short Tors ional Clip Heat sink Assembl y D rawing.
Intel® 631xESB/632xESB I/O Controller Hub Thermal Mechanical Design Guide 49 Mechanical Drawings Figure B-6. Short Torsional Clip Heatsink Drawing(Sheet 1 of 2).
Mechanical Drawings 50 Intel® 631xESB/632xESB I/O Controller Hub Thermal Mechanical Design Guide Figure B-7 . Short Torsion al Clip Heatsi n k Drawing(She et 2 of 2).
Intel® 631xESB/632xESB I/O Controller Hub Thermal Mechanical Design Guide 51 Mechanical Drawings Figure B-8. Short To rsional Clip Heatsink Clip Drawing.
Mechanical Drawings 52 Intel® 631xESB/632xESB I/O Controller Hub Thermal Mechanical Design Guide §.
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