Packard BellメーカーTK11BZの使用説明書/サービス説明書
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Packard Bell EasyNote TK11BZ/TK13BZ SERVICE GUIDE.
ii Revision History Refer to the following t able for the updates made to th is Packard Bell EasyNote TK1 1BZ/TK13BZ service guide. Service guide files and up dates are avail able on the ACER/CSD W ebsite. For more information, go to http://csd.acer .
iii The following t ypographical c onventions ar e used in this document: Book titles, directory names, file names, path names, and program/pro cess names are shown in italics .
iv.
v CHAPTER 1 Hardware Specifications Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-5 Operating System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-5 Platform . . . . . . . .
vi Hard Disk Drive (AVL components) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-29 Hard Disk Drive (AVL components) (Continued) . . . . . . . . . . . . . . . . . . . . . 1-30 Super-Multi Drive . . . . . . . . . . . . . . . . . . . .
vii CHAPTER 3 Machine Maintenance Procedures Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-5 General Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-5 Recommended Equipment .
viii Fan Installation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-35 Heatsink Removal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-36 Heatsink Installation . . . . . . . . . . . . . . . . . . .
ix CHAPTER 5 Jumper and Connector Locations Mainboard Jumper and Con nector Locations . . . . . . . . . . . . . . 5-3 USB Board Jumper and Conne ctor Locations . . . . . . . . . . . . . . . 5-5 Power Board Jumper and Connector Locations . . . . . . . .
x.
CHAPTER 1 Hardware Specifications.
1-2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-5 Operating System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-5 Platform . . . . . . . . . . . . . . . . . . . . . . . .
1-3 LCD Inverter (not available w ith this model) . . . . . . . . . . . . . . . . . . . . . . . . 1-32 Display Supported Resolution (LCD Suppor ted Resolution) . . . . . . . . . . . . 1-33 Display Supported Resolution (GPU Supported Resolu tion) . . .
1-4.
Hardware S pecifications and Configuration s 1-5 Hardware S pecificati ons and Configurations Features 0 The following is a summary of the comp uter ’ s many features: Operating System 0 Genuine.
1-6 Hardware S pecifications and Con fig urations Graphics 0 A TI Radeon™ HD 6310 Graphics with 256 MB of dedicate d system memory , supporting Unified Vi deo Decoder 3 (UVD3), OpenCL® 1.1, Open GL 3.1, OpenEXR High Dynamic-Range (HDR) technology , Shader Model 5.
Hardware S pecifications and Configuration s 1-7 WP AN: Bluetooth® 3.0 +H S LAN: Gigabit Ethernet, W ake-on-LAN ready Dimension and W eight 0 381 (W) x 253 (D) x 31/34.14 (H) mm (1 5 x 9.96 x 1.22/1.34 inches) 2.6 kg (5.72 lbs .) with 6-cell battery pack Power Adapter and Battery 0 ACPI 3.
1-8 Hardware S pecifications and Con fig urations Optional Items 0 1/2/4 GB DDR3 1066 MHz soDIMM module 4400 mAh 6-cell Li-ion battery pack 3-pin 65 W AC adapter W arranty 0 One-year I.
Hardware S pecifications and Configuration s 1-9 Environment 0 T emperature: Operating : 5° C to 35 ° C Non-oper a ting : -2 0° C to 65°C Humidity (non-co nden sing): Operating.
1-1 0 Hardware S pecifications and Configurations Notebook Tour 0 T op V iew 0 Figure 1-1. T op View T a ble 1-1. T op View # Icon Item Description 1 Webcam Web camera for video communicatio n (for selected models). 2 Microphone Internal microphone for re cording sound.
Hardware S pecifications and Configuration s 1-1 1 3 Display screen Also called Liquid-Cryst a l Display (LCD), disp lays computer output. 4 HDD Indicates when the hard disk drive is active. Communication indicator Indicates the computer’s wireless connectivity de vice status.
1-1 2 Hardware S pecifications and Configurations Closed Front V iew 0 Figure 1-2. Closed Front Vie w T a ble 1-2. Closed Front V iew # Icon Item Description 1 2-in-1 card reader Accepts Secure Digital (SD), MultiMediaCard (MMC). Note: Push to remove/inst all the card.
Hardware S pecifications and Configuration s 1-13 Rear Vi ew 0 Figure 1-3. Rear View T able 1-3. Rear View # Icon Item Description 1 Battery bay Houses the co mputer ’ s batte r y pack.
1-1 4 Hardware S pecifications and Configurations Left V iew 0 Figure 1-4. Lef t View T a ble 1-4. Lef t View # Icon Item Description 1 DC-in jack Connects to an AC adapter 2 External display (VGA) port Connects to a display device (e.g. exter nal monitor , LCD projector).
Hardware S pecifications and Configuration s 1-15 Right V i ew 0 Figure 1-5. Right View T a ble 1-5. Right Vi ew # Icon Item Description 1 USB 2.0 port s Connect to USB 2.0 devices (e.g. USB mouse, USB camera). 2 Optical drive Internal optical drive; accept s CDs or DVDs.
1-1 6 Hardware S pecifications and Configurations Base Vi ew 0 Figure 1-6. Base View T able 1-6. Base View # Icon Item Description 1 Battery bay Houses the computer's battery pack. 2 Battery r elease latch Relea ses the battery fo r removal. 3 Hard disk bay Houses the computer's hard disk (secure d with screws).
Hardware S pecifications and Configuration s 1-17 T ouchpad Basics 0 Figure 1-7. T ouchpad Move your finger across the T o uchpad (1) to move the cursor . Press the left (2) and right (3) butto ns located beneath the T ouchpad to perform selection an d execution fu nctions.
1-1 8 Hardware S pecifications and Configurations Using the Keyboard 0 The computer has a close-to-f ull-sized keyboard and an embedded numer ic keypad , separate cursor , lock, fu nction and sp ecial keys. Figure 1-8. Keyboard Lock Keys Lock Keys 0 The keyboard has three lock keys which can be toggled o n and off.
Hardware S pecifications and Configuration s 1-19 Windows Keys 0 The keyboard has two keys that perform Windows- s pecific functions. Windows Logo key Application key T a ble 1-10.
1-2 0 Hardware S pecifications and Configurations Hotkeys 0 The computer employs hotkeys or key combinations to access mo st of the co mputer's controls like screen brightness and volume output. Figure 1-9. Keyboard Hotkeys T o activate hotkeys, press and hold the <Fn> key be fore pressing the other key in the hockey combination.
Hardware S pecifications and Configuration s 1-21 <Fn> + <F10> Forward Performs a forward scan in multimedia applications. <Fn> + <F1 1> Brightness Down Decreases the scree n brightness. <Fn> + <F12> Brightness Up Increa se s the screen brightness.
1-2 2 Hardware S pecifications and Configurations System Block Diag ra m Figure 1-10. System Block Dia gram.
Hardware S pecifications and Configuration s 1-23 Specification Tables 0 Computer specif ications Item Metric Imperial Dimensions Length 26.0 cm 10.23 in Width 35.7 cm 14.05 in Height (front to rear) 3.0 to 3.6 cm 1.16 to 1.43 in Weight (equi pped with optical drive, flash drive, and battery) 2.
1-2 4 Hardware S pecifications and Configurations System Board Major Ch ips Processor Item Specification Core logic AMD Hudson M1 uFCBGA-605-ba ll VGA A TI Mobility Radeon™ HD 6 310M APU A TI Mobility Radeon™ HD 6 470M GPU LAN Atheros AR8151 for Giga LAN Controller USB 2.
Hardware S pecifications and Configuration s 1-25 Processor S pecifications CPU Fan T rue V alue T able (TJ100-CPU/UMA) CPU Fan T rue V alue T able (TJ100-CPU/SG) Item CPU Spe ed (GHz) Cores/ Threads Bus Speed Mf g Te c h (nm) Cache Size Package Vo l t a g e E-350 1.
1-2 6 Hardware S pecifications and Configurations System Memory Memory Combinations Vid eo In t e r f a c e Item Specific a tion Memory controller Built in at APU Memory size 512MB,1GB,2GB,4GB DDR3 RA.
Hardware S pecifications and Configuration s 1-27 BIOS Item Specification BIOS vendor Insyde BIOS V ersion 1.00 BIOS ROM type MX25L1606EM2I-12G , EN25F16-100HIP , W25Q16BVSSIG BIOS ROM size 2MB Featur.
1-2 8 Hardware S pecifications and Configurations LAN Interface Keyboard Item Specificat ion LAN Chipset AR8151 LAN connector type RJ45 LAN connector location JRJ45 at the left sid e Features Support .
Hardware S pecifications and Configuration s 1-29 Hard Disk Drive (A VL component s ) Item Specification V endor & Model Name HTS545016B9A30 0 MK1665GSX ST9160314AS WD1600BPVT -22ZEST0 HTS545025B9.
1-3 0 Hardware S pecifications and Configurations Hard Disk Drive (A VL component s) (Continued) Item Specification V endor & Model Name HTS545050B9A30 0 MK5065GSX ST9500325AS WD3200BPVT -22ZEST0 .
Hardware S pecifications and Configuration s 1-31 Super-Multi Drive Item Spec ification V endor & Model name HLDS Super-Multi Drive DL 8X G T32N LF / SONY Super-Multi Drive DL 8X AD-7585H LF / Pan.
1-3 2 Hardware S pecifications and Configurations LED 15.6” LCD Inverter (not av ai la bl e wi th thi s mode l) Item Specification V endor & Model name AUO/B156XW02 V6 (HW:0A) AUO/B156XW02 V2 (HW:4A) Samsung/L TN156A T02-A1 1 LG/LP156WH2-TLEA CMO/N156B6-L0B CPT/ CLAA156WB1 1A Screen Diagonal (mm) 394.
Hardware S pecifications and Configuration s 1-33 Display Supported Resolution (LCD Supporte d Resolution) Graphics Controller Display Supported Resolution (GPU Supported Resolution) Resolutio n 16 bi.
1-3 4 Hardware S pecifications and Configurations Bluetooth Interfa c e Bluetooth Module Camera Item Specif ications Chipset Atheros BU12/ Broad com BCM2070/ Broadcom Data thro ughput TX 1.2Mb i ts/sec RX 1.2Mbits/sec Protocol 3.0+HS Interface USB 2.0 Connector type SM06B-XSRK-ETB Supported protocol USB 1.
Hardware S pecifications and Configuration s 1-35 Mini Card 3G Card (not available in this model) Audio Codec and Amplifier Audio Interface Item Specificat ion Number supporte d 1 Features 1 mini card.
1-3 6 Hardware S pecifications and Configurations Wireless Module 802.1 1b/g/n Resolution Support 16/24bit PCM Compatibility HD audio Interface Sampling rate Sample rate up to 192Khz resolution VSR (V.
Hardware S pecifications and Configuration s 1-37 Battery VRAM USB Port HDMI Port Item Specif ication V endor & Model name SANYO AS2010D31 SIMPLO AS10 D71/75 SONY AS2010D41 SAMSUNG AS2010D61 P ANA.
1-3 8 Hardware S pecifications and Configurations AC Adapter System Power Manageme nt Card Reader Item Specification Input rating 65w Maximum input AC current 65w:3.42A at 100V Inrush curre nt 12t at 264V Efficiency Refer to EP A 5.0 Item Specification Mech.
Hardware S pecifications and Configuration s 1-39 System LED Indicator System DMA Specification Item Specification Lock N/A System state Blue color solid on: System on Blue color and amber col.
1-4 0 Hardware S pecifications and Configurations System Interrup t Specificat io n Hardware IRQ System Function IRQ0 High precision event timer IRQ1 S tandard PS/2 Keyboard IRQ2 Cascaded IRQ8 High pr.
Hardware S pecifications and Configuration s 1-41 System IO Address Map I/O addres s (h e x) System function (shipping con figuration) 000 - 00F DMA controller no.
1-4 2 Hardware S pecifications and Configurations System I/O Address S pecifications I/O addres s (h e x) System function (shipping configuration) 4D6 DMA2 extend register 4D7 - 4FF Unused C00 - C01 P.
CHAPTER 2 System Utilities.
2-2 BIOS Setup Utility . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-3 Navigating the BIOS Utility . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-3 BIOS . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
System Utilities 2-3 System Utilities BIOS Setup Utility 0 This utility is a hardware configuration program built into a computer’s BIOS (Basic Input/Output System). The utility is pre-configured and optimized so most users do not need to run it. If configuration problems occur , the setup utility may need to be run.
2-4 System Utilities BIOS 0 The following is a description of the tabs found on the Insyde H20 BIOS Setup Utility screen: NOTE: NOTE : The screens provided are for reference only . Actual values may differ b y model. Information 0 The Information t ab shows a summary of computer hardware information.
System Utilities 2-5 VGA BIOS V ersion VGA (video graphic s array) firmware version of system Serial Number Serial number of unit Asset T ag Number Asset tag number of system Product Name Product name of the syst em Manufact urer Name M anufacturer of system UUID Univers ally Unique Identifier T able 2-1.
2-6 System Utilities Main 0 The Main t ab allows the user to set system time and date, enable or disable boot optio n and enable or di sable recovery .
System Utilities 2-7 D2D Recovery Option to use D2D Recovery function Option: Enabled or Disabled SA T A Mode Option to set SA T A controller mode Option: AHCI or IDE T able 2-2.
2-8 System Utilities Security 0 The Security t ab shows p arameters that safeguard and protect the compute r from unauthorize d use. Figure 2-3. BIOS Security T able 2-3 describes the parameter s shown in Figure 2-3.
System Utilities 2-9 NOTE: NOTE : When prompted to enter p assword, three attempts ar e allowed before system halts. Resetting BIOS password may r equire computer be returned to deale r . Setting a Password 0 Perform the following to set user or supervisor passwords: 1.
2-10 System Utilities Removing a Password 0 Perform the following: 1. Use th e and keys to highlight Set Supervisor Password and press Enter . The Set Supervisor Password dialog box appears: Figure 2-5. Set Supervisor Password 2. T ype c urrent password in Enter Current Password field and press Enter .
System Utilities 2-1 1 5. Press F10 to save changes and ex it BIOS Setup Utility . If the verification is OK, the screen will show as follows. Figure 2-7. Setup Notice The password setting is comple te afte r the user presses Enter . If the password entered doe s not match the current passwor d , the screen shows the Setup Warning dialog.
2-12 System Utilities Boot 0 The Boot tab allows changes to th e order of b oot devices us ed to load the o perating syste m. Bootable devices includ e the: USB diskette drives Onboard hard disk drive DVD drive in the module bay Use and keys to select a device and press F5 or F6 to change the value.
System Utilities 2-13 Exit 0 The Exit tab allows users to save or discard changes and quit the BIOS Setup Utility . Figure 2-1 1. BIOS Exit T able 2-4 describes the parameter s in Figure 2-1 1. T able 2-4. Exit Parameters Parameter Description Exit Saving Changes Exit BIOS utility and save setup item changes to system.
2-14 System Utilities BIOS Flash Utilities 0 BIOS Flash memory u pdates are required for the following conditions: New versions of system programs New features or options Restore a BIOS when it becomes corrupted. Use the Flash utility to update the system BIOS Flash ROM.
System Utilities 2-15 DOS Flash Utility 0 Perform the following to use the DOS Flash Utility : 1. Press F2 during boot to enter Setup Menu . 2. Select Boot Menu to modify boot priority order . Example: If using USB HDD to Update BIOS , move USB HDD to position 1.
2-16 System Utilities 4. Execute XEWX100.BAT to update BIOS. Flash process begins as shown in Figure 2-13. Figure 2-13. DOS Flash Process 5. Fla sh is complete when the message, Flash Programming Complete is shown. System will restart automatically when finished.
System Utilities 2-17 WinFlash Utility 0 Perform the following to use the WinFlash Utility: 1. Double-click WinFlash executable. 2. Click OK to begin update.
2-18 System Utilities Remove HDD/BIOS Password Utilities 0 CAUTION : ! If Power-on Password authentication is enabl e d, the BIOS password can only be cleared by initiating the Crisis Disk Recovery procedure. See Crisis Disk Recovery . This section provides details about re moving HDD/BIOS passwords.
System Utilities 2-19 4. Execute Unloc kHD.exe (Figure 2-19) to create a pass word unlock code. Use the format < UnlockHD [key code] > with the code noted in the Figu re 2-18. Example: UnlockHD 76943488 The command genera te s a password which can be used for unlockin g the HDD.
2-20 System Utilities Removing BIOS Passwords 0 (Hardware method) T o clear User or Supervisor p asswords, open the DIMM door and use a metal instrument to short the R582 point. Figure 2-20. CMOS Jumper (Software metho d) If wrong su pervisor pass word is entered thr ee times, t he message System will halt! is displayed on screen.
System Utilities 2-21 If user is unable to obt ain correct password then it must be removed . There are two methods to do this. Method 1: 0 If BIOS menu item Power on Password is set to Enabled , then Crisis Recovery disc must be us ed. Method 2: 0 If BIOS menu item Power on Password is set to Disabled .
2-22 System Utilities Cleaning BIOS Passwords 0 CAUTION : ! If Power-on Password authentication is enabl e d, the BIOS password can only be cleared by initiating the Crisis Disk Recovery procedure. See Crisis Disk Recovery . T o clean the User or Supervisor passwo rds, perform the following steps: 1.
System Utilities 2-23 Miscellaneous Tools 0 Using Boot Sequence Selector 0 The Boot Sequence Selector a llows the boot order to be changed without accessing the BIOS. T o use Boot Sequence Selector , perform the following steps: 1. Enter into DOS. 2. Execute BS.
2-24 System Utilities Using DMITools 0 The DMI (Desktop Management Interfa c e) T ool copies BIOS information to EEPROM (Electrically Erasable Program mable Read-Only Memory).
System Utilities 2-25 Using the LAN MAC EEPROM Utility 0 Perform the following steps to write MAC (Media Access Cont rol) information to EEPROM: Use the MAC.BA T utility to write the MAC.CFG file to the EEPROM under DOS mode. 1. Use a te xt edito r (Ex: Notep ad ) to open th e MAC.
2-26 System Utilities Crisis Disk Recovery 0 1. Plug in the USB flash disk. 2. Sele ct the Fast Format option and click Sta r t . Then click Next . Figure 2-27. USB Flash Crisis Disk 3. Click Format and then Exi t to complete the opera tion. Figure 2-28.
System Utilities 2-27 4. Copy the P5WE6x64.F D file to the USB flash disk root directory . Figure 2-29. USB Flash Crisis Disk NOTE: NOTE : Do not place any other *.fd file s to the USB flash disk root directory . 5. Plug in the USB Flash Disk without AC plug.
2-28 System Utilities.
CHAPTER 3 Machine Maintenance Procedures.
3-2 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-5 General Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-5 Recommended Equipment . . . . . . . . . . . . . . . .
3-3 LCD Module Installation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-40 DC-IN Cable Removal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-41 DC Cable Installation . . . . . . . . . . . . . . . . . . . . . . . .
3-4.
Machine Maintenance Procedure s 3-5 Machine Maintenance Procedures Introduction 0 This chapter cont ains gen eral information ab out th e computer , a list of tools needed to do the required main tenance and step by step pr ocedures on how to remo ve and inst all compon ent s from the computer .
3-6 Machine Maintenance Proced ures Maintenance Flowchart 0 The flowchart in Figure 3- 1 shows a graphi c repr esentation of the module removal and installation sequences. It shows information on what component s may need to be removed and installed du ring servicing.
Machine Maintenance Procedure s 3-7 Getting Started 0 Flowchart Figure 3-1 identifies sections for the removal and install s equence. Follow the o rder of the sequence to avoid damag e to any of the hardware component s. Do the following prior to st arting any maintenance pr oced ures: 1.
3-8 Machine Maintenance Proced ures Battery Pack Removal 0 1. Put computer on f lat surface, battery side u p. 2. Push battery lock/un lock latch (A) to unlock position . (Figure 3-3) 3. Push and hold battery release latch (B) to releas e position. (Figure 3-3) 4.
Machine Maintenance Procedure s 3-9 Dummy Card Removal 0 1. Push dummy card (A) in to releas e it from t he spring latch. (Figure 3-4) 2. Rem ove dummy card (A). (Figure 3-4) Figure 3-4. Dummy Card Dummy Card Installation 0 1. Inse rt dummy card (A). (Figure 3-4) 2.
3-1 0 Machine Maintenance Proced ures Keyboard Removal 0 Prerequisite: Battery Pack Removal 1. Rele ase seven (7) latches from the keyboard. (Figure 3-5) Figure 3-5. Keyboard Latches 2. T urn the keyboard over so that th e keys are face down on the palm rest (C).
Machine Maintenance Procedure s 3-1 1 CAUTION : ! Keyboard FPC (Flexible Printe d Circuit) can be damaged if removed while mainboard connector is locked. Keyboard Installation 0 1. Put the keyboard fac e down on the palm rest (C). ( Figure 3-6 ) 2. Con nect keyboard FPC (A) to mainboard connector ( B ).
3-1 2 Machine Maintenance Proced ures ODD (Optical Disk Drive) Module Removal 0 Prerequisite: Battery Pack Removal 1. Remove one (1) scre w (A) from lowe r cover . (Figure 3-7) Figure 3-7. ODD Module in Lower Cover 2. Remove ODD module (B) fr om ODD bay .
Machine Maintenance Procedure s 3-13 ODD Module Installation 0 1. Inst all ODD bezel (E) on OD D module.( Figure 3-8 ) 2. Inst all ODD bracket (D) on ODD module and secure two (2) screws (C). ( Figure 3- 8 ) 3. Insert ODD module (B) into ODD module bay .
3-1 4 Machine Maintenance Proced ures Base Door Removal 0 Prerequisite: Battery Pack Removal 1. L ocate base door (B) on lower cover . (Figure 3-9) 2. Remove two (2) scr ews (A). (Fig ure 3-9) 3. Rem ove door fr om lower cover . Figure 3-9. Base Door Base Door Installation 0 1.
Machine Maintenance Procedure s 3-15 DIMM (Dual In-line Memory Module) Module Removal 0 Prerequisite: Base Door Removal 1. Fin d DIMM (D) in the component bay . (Figure 3-10 ) Figure 3-10. Componen t Location 2. Push DIMM clips (A) outwar ds. (Figure 3-1 1) Figure 3-1 1.
3-1 6 Machine Maintenance Proced ures 3. Disco nnect DIMM out of mainboard connector (B). ( Figure 3-1 1 ) 4. Rep eat steps 2 and 3 for remaining modules. DIMM Module Installation 0 1. Con nect DIMM into mainboard connector (B). ( Figure 3-1 1 ) 2. Push down on DIMM until modul e clips (A) lock in position.
Machine Maintenance Procedure s 3-17 WLAN (Wireless Local Area Network) Board Removal 0 Prerequisite: Base Door Removal 1. Fin d WLAN board (B) in the comp onent bay . (Figure 3-10) 2. Disconnect main (B) and auxiliary (A) anten na cables from WLAN board.
3-1 8 Machine Maintenance Proced ures R T C Battery Removal 0 Prerequisite: Base Door Removal 1. Find RTC (Real T i me Clock) ba ttery (C) on mainboard. ( Figure 3-10 ) 2. Using p lastic tweezers, push the R TC battery in using th e gap in the mainboard connector (A) to release the battery .
Machine Maintenance Procedure s 3-19 HDD (Hard Disk Drive) Module Removal 0 Prerequisite: Base Door Removal 1. Find HDD module (A) in component bay . (Figure 3-14) 2. Remove one (1) s crew (A). (Figu re 3-1 4) Figure 3-14. HDD Module 3. Slide HDD module away from the mainboard con nector (B) to disconnect it.
3-2 0 Machine Maintenance Proced ures HDD Module Installation 0 1. Put HDD brackets onto HDD module. ( Figure 3- 15 ) 2. Inst all four (4) sc rews (C) to secure HDD brackets (D) to HDD module. ( Figure 3-15 ) 3. Put HDD module into component bay . ( Figure 3-14 ) 4.
Machine Maintenance Procedure s 3-21 Upper Cover Removal 0 Prerequisite: HDD (Hard Disk Drive) Module Removal 1. Remove fourteen (14) securing screws from the lower cover . (Figure 3-16) Figure 3-16. Lower Cover Screw Locat ion 2. Remove eight (8) securing screws (A) from the upper cover .
3-2 2 Machine Maintenance Proced ures 3. Grasp the lower cover by the ODD bay (B) and lift the upper cover up to release the latche s securing it to the lower cover . ( Figure 3-18) Figure 3-18. Lower Cover Removal 4. Continue lifting along the edges of the up per cover to release the la tches.
Machine Maintenance Procedure s 3-23 Upper Cover Installation 0 1. Align and install upper cover onto the lower cover . ( Figure 3-19 ) 2. Pr ess down on the edges of the upper cover to secure the latches. 3. Install and secure eight (8) screws (A) to upper cover .
3-2 4 Machine Maintenance Proced ures S peaker Removal 0 Prerequisite: Upper Cover Removal 1. Fin d speaker (A) on upper cover . (Figure 3-20) Figure 3-20. Upper Cover Co mp onent Location 2. Remove speaker ca ble (B) from c able guides (C). (Figure 3-21 ) 3.
Machine Maintenance Procedure s 3-25 S peaker Installation 0 1. Inst all speaker (A) on upper cover . ( F igure 3-20 ) 2. Inst all and secure two (2) screws (D). ( Figure 3-21 ) 3. Install speaker cable (B) into cable guid es (C). (Figur e 3- 21) 4. Inst all upper cover .
3-2 6 Machine Maintenance Proced ures Power Board Removal 0 Prerequisite: Upper Cover Removal 1. Find power boar d (B) on upper cover . ( Figure 3-20 ) 2. Remove power board FFC (Flat Flex Cable) ( A ) from upper cover . (Figure 3-22) 3. Remove one (1) scre w (B).
Machine Maintenance Procedure s 3-27 T ouchpad Removal 0 Prerequisite: Upper Cover Removal 1. Find touchpad (C) on upper cover . ( Figure 3-20 ) 2. Remove touchp ad FFC (A) from touchp ad. (Figure 3-23) 3. Disconnect and remove touchp ad FFC (A) from touchpad connector (B) .
3-2 8 Machine Maintenance Proced ures USB Board Removal 0 Prerequisite: Upper Cover Removal 1. Find USB (Universal Serial Bus) boar d (A ) on lower cover . (Figure 3-24) Figure 3-24. Component Location 2. Remove adhesive tap e securing the USB board FFC.
Machine Maintenance Procedure s 3-29 USB Board Installation 0 1. Install USB board (F) on lower cover . ( Figu re 3-24 ) 2. Install and secure scre w (D) to lower cover . ( Figure 3-25 ) 3. Connect USB board FFC (A) to module connector (B). ( Figure 3- 25 ) 4.
3-3 0 Machine Maintenance Proced ures ODD Board Removal 0 Prerequisite: Upper Cover Removal 1. Find O DD board (C) o n lower cover . ( Figure 3-24 ) 2. Disconnect ODD board FFC from main board connector (A). (Figure 3-26) Figure 3-26. ODD Board 3. Remove s crew (B) from lower cover .
Machine Maintenance Procedure s 3-31 Bluetooth Board Removal 0 Prerequisite: Upper Cover Removal 1. Find Bluetooth board (B) o n upp er cover . ( Figure 3-24 ) 2. Disconn ect Bluetooth ca ble (B) from B luetooth board conne ctor (A). (Fig ure 3-27) Figure 3-27.
3-3 2 Machine Maintenance Proced ures Mainboard Removal 0 Prerequisite: ODD Board Removal Bluetooth Board Removal USB Board Removal 1. Find mainboard (A) on lower cover . (Figure 3-28) Figure 3-28. Mainboard Location 2. Remove Bluetooth cable (B) from cable guides.
Machine Maintenance Procedure s 3-33 7. T o avoid damage, put a nonabrasive, protec tive cover over the LCD panel. (Figure 3-29) Figure 3-29. Mainboard 8. Lift the mainb oard from the lower cover and turn it over onto the LCD panel. (Figure 3-30) CAUTION : ! Do not remove the mainboard completely .
3-3 4 Machine Maintenance Proced ures 1 1. Disconnect Bluetooth cable from ma inbo ard connector (G). (Figure 3-28) Figure 3-31. Mainboard Mainboard Installation 0 1. Connect Bluetooth cable to mainboard conne ctor (G). (Figure 3-31) 2. Put computer with the LCD module flat on the surface.
Machine Maintenance Procedure s 3-35 Fan Removal 0 Prerequisite: Mainboard Remova l 1. Find fan (A) on mainboard. (Fig ure 3-32) Figure 3-32. Fan Location 2. Disconnect fan cable from mainboard connector ( B ). (Figure 3-32) 3. Remove adhesive tape (C) se curing the fa n to the he atsink.
3-3 6 Machine Maintenance Proced ures Heatsink Removal 0 Prerequisite: Fan Removal 1. Find heatsink (A) o n mainboard. ( Figu re 3-33) 2. Remove four (4 ) the r ma l scre ws (B) fro m he atsink . (Figu re 3-3 3) 3. Loosen two (2) captive screws (C) from heat sink.
Machine Maintenance Procedure s 3-37 Heatsink Inst allation 0 IMPORT ANT : + Apply suitable thermal gre a se and make sure all heat p a ds are in position before re placing module . CAUTION : ! Thermal grease can dam age mainboard. Use caution when applying.
3-3 8 Machine Maintenance Proced ures ID Size Quantit y Screw T ype B ICW50 CPU Thermal Screw 4.
Machine Maintenance Procedure s 3-39 LCD (Liquid Crystal Display) Module Removal 0 Prerequisite: Mainboard Remova l 1. Remove four (4) screws (A) from LCD hing es. (Figure 3-36) Figure 3-36. LCD Hinge Screws 2. Remove the upper co ve r from the LCD module.
3-4 0 Machine Maintenance Proced ures CAUTION : ! Make sure all cables ar e moved away from the device to avoid dam age during removal. LCD Module Installation 0 1. Align LCD hinges with the hinge gu ides on the upper cover . ( Figure 3- 37 ) 2. Install and secure four (4) scr ews (A).
Machine Maintenance Procedure s 3-41 DC-IN Cable Removal 0 Prerequisite: Mainboard Remova l 1. Find DC-IN (Direct Current Input) ca ble (A) in lower cover . (Figure 3-38) Figure 3-38. DC-IN Cable Location 2. Remove DC-IN cable from cable guides (B). (Figure 3-39) Figure 3-39.
3-4 2 Machine Maintenance Proced ures DC Cable Installation 0 1. Install DC-IN cable to lower cover (A). ( Figure 3-38 ) 2. Install DC-IN cable into cable guides (B).
Machine Maintenance Procedure s 3-43 LCD Bezel Removal 0 Prerequisite: LCD (Liquid Crystal Display) Module Removal 1. Remove two screw caps. (Figure 3-40) 2. Remove two (2) screws (A) from the LCD module. (Figure 3-40) Figure 3-40. LCD Bezel 3. Lift the bottom of the be ze l up re lea sin g it fro m th e latc he s.
3-4 4 Machine Maintenance Proced ures 4. Continu e re lea sin g the lat ch es alon g th e side s of th e be ze l. (F igu re 3-42 ) Figure 3-42. LCD Bezel 5.
Machine Maintenance Procedure s 3-45 LCD Bezel Installation 0 1. Put LCD bezel on the LCD module. ( Figure 3-40 ) 2. Press along the edges of the LCD bezel to secure the latches on the LCD module. 3. Install and secure two (2) screws (A ) to the LC D bez el.
3-4 6 Machine Maintenance Proced ures Camera Module Removal 0 Prerequisite: LCD Bezel Removal 1. Find the camera module (A) in th e LCD mo dule. (Figure 3-44) Figure 3-44. Camera Module Location 2. Disconnect the camera cable (B) from the camera module connector (C).
Machine Maintenance Procedure s 3-47 Camera Module Installation 0 1. Put camera module (A) on the LCD module. ( Figure 3-44 ) 2. Connect the camera cable (B) to the came ra module connector (C).
3-4 8 Machine Maintenance Proced ures LCD Panel Removal 0 Prerequisite: LCD Bezel Removal 1. Remove the four (4) s ecuring scre ws (A) from th e LCD panel (B). (Fig ure 3-46) Figure 3-46. LCD Panel 2. Remove the L VDS cable (C) from the cable guides. (Figure 3-47) Figure 3-47.
Machine Maintenance Procedure s 3-49 LCD Panel Installation 0 1. Put LCD panel (B) on the LCD cover . ( Figure 3- 46 ) 2. Put L VDS cable (C) in the cable guides. ( Figure 3-47 ) 3. Install and secure fo ur (4) screws (A) to the LCD panel. ( F igure 3-46 ) 4.
3-5 0 Machine Maintenance Proced ures LCD Bracket Removal 0 Prerequisite: LCD Panel Removal 1. Remove the six (6) screws (A). (Figure 3-48) Figure 3-48. LCD Bracket 2. Remove LCD br ac ke t fro m th e LC D panel. LCD Bracket Installation 0 1. Put LCD brac ket on th e LCD panel.
Machine Maintenance Procedure s 3-51 L VDS Cable Removal 0 Prerequisite: LCD Panel Removal 1. Remove L VDS (Low-voltage Differential Signaling) cable (A) from the adhesive on th e rear of the LCD panel. (Figure 3-49) Figure 3-49. L VDS Cable 2. S tarting from the top, re move the clear mylar ta pe (B).
3-5 2 Machine Maintenance Proced ures L VDS Cable Installation 0 1. Put L VDS cable into the LCD pan e l connecto r (C) and secure the clear mylar ta pe (B). ( Figure 3-50 ) 2. Put L VDS cable (A) on the rear of the LCD panel. ( Fig ure 3-49 ) 3. Install LCD panel to LCD cover .
Machine Maintenance Procedure s 3-53 Microphone Set Removal 0 Prerequisite: LCD Panel Removal 1. Locate microphone set (A) in LCD cover . (Figure 3-51) Figure 3-51. Microphone Set 2. Remove adhesive tap e (B) securing the micropho ne cable. (Figure 3-51) 3.
3-5 4 Machine Maintenance Proced ures WLAN Antenna Removal 0 Prerequisite: LCD Panel Removal 1. Remove black (B) and white (A) WLAN ante nnas. (Figure 3-52) Figure 3-52. WLAN Antenna 2. Lift foil (C) from antenna cables. (Figure 3-52) 3. Remove antenna cables from cable guid e s.
CHAPTER 4 Troubleshooting.
4-2 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-3 General Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-3 Power On Issues . . . . . . . . . . . . . . . . . . .
T roub leshooting 4-3 T roubleshooting Introduction 0 This chapter contains inform at ion about trouble sho o tin g com m o n pr ob lem s as sociated with the noteboo k. General Information 0 The following procedu re s are a guide for troubl eshooting compute r problems.
4-4 T roub leshooting Power On Issues 0 If the system does not power on, perform the following: Figure 4-1. Power On Issue Computer Shuts Down Intermittently 0 If the system powers off at intervals, perform the following. 1. Makes sure the power cable is properly connected to the comp uter and the electrical outlet.
T roub leshooting 4-5 No Display Issues 0 If the Display does not wo rk, perfor m th e fo llo win g : Figure 4-2. No Display Issue No POST or V ideo 0 If the POST or video doe s not appear , perform the following: 1. Make s ure that intern al display is selec ted.
4-6 T roub leshooting 6. If the POST or video appears on the external display only , refer to LCD Failure . 7. Disconnect power and all exter nal devices incl uding port replicators or docking stations. Remove any m emory ca rds and CD/DVD disc s. 8. S tart the compute r .
T roub leshooting 4-7 LCD Failure 0 If the LCD fails, perform the follow ing: Figure 4-3. LCD Failure.
4-8 T roub leshooting Keyboard Failure 0 If the Keyboard fails, perform the following: Figure 4-4. Keyboard Failure.
T roub leshooting 4-9 T ouchpad Failure 0 If the T ouchpad fails, perform the following: Figure 4-5. T ouchp ad Failure.
4-10 T roub leshooting Internal S peaker Failure 0 If internal S peakers fail, perf orm the following: Figure 4-6. Internal Speaker Failure Sound Problems 0 Perform the following: 1. Boot the computer . 2. Navigate to Sta r t Control Panel System and Maintenance System Device Manager .
T roub leshooting 4-1 1 6. Navigate to Sta r t Control Panel Hardware and Sound Sound . Confirm that S peakers ar e se lec te d as th e de fa ult aud io de vice (g re en che ck ma rk ). NOTE: NOTE : If S peakers does not show , right-click on the Playback tab and selec t Show Disabled Devices (clear by default).
4-12 T roub leshooting Microphone Failure 0 If internal or external Microp hones fail, perform the following: Figure 4-7. Microphone Failure 1. Check that the microphone is enabled. Navigate to Sta rt Control Panel Hardware and Sound Sound and select the Recording tab.
T roub leshooting 4-13 USB Failure 0 If the USB fails, perform the following: Figure 4-8. USB Failure.
4-14 T roub leshooting Wireless Failure 0 If the wireless fails, perform the following: Figure 4-9. Wireless Failure.
T roub leshooting 4-15 Bluetooth Failure 0 If the wireless fails, perform the following: Figure 4-10. Bluetooth Failure.
4-16 T roub leshooting Card Reader Failure 0 If the card reader fails , perform the following: Figure 4-1 1. Card Reader Failure.
T roub leshooting 4-17 Thermal Module Failure 0 If the thermal mo dule fails, perf orm the following: Figure 4-12. Thermal Module Failure.
4-18 T roub leshooting Cosmetic Failure 0 If there are any cos m etic def ects, perform the follo win g: Figure 4-13. Cosmetic Failure.
T roub leshooting 4-19 Other Functions Failure 0 1. Check if drives are functioning corr ectly . 2. Check if external mod ules are funct ioning correctly .
4-20 T roub leshooting Intermittent Problems 0 Intermittent system hang problems can be caused by a variety of re asons that have nothing to do with a hardware de f ect, such as: cosmic radiation, el ectrost atic discharge, or softwa re errors. FRU replacement sho uld be considered only when a recurring problem exist s.
T roub leshooting 4-21 Post Codes 0 The following a re the Insyde H2O™ Functio nality POST code tables. The compon ents of the POST code t able includes: SEC phase, PEI p hase, DXE phase, BDS phase, CSM fu nctions, S3 functions and ACPI functions. T a ble 4-2.
4-22 T roub leshooting SEC_GO_TO_SECST ARTUP SEC 09 Setup BIOS ROM cache SEC_GO_TO_PEICORE SEC 0A Enter Boot Firmware V olume * 3rd pa rty relate functions – Platfo rm dependence. T able 4-4. PEI Phase POST Code T able Functionality Name (Include PostCode.
T roub leshooting 4-23 PEI_RECOVERY_ST ART_FLASH PEI 88 St art F lash BIOS wit h Recovery image PEI_ENTER_DX EIPL PEI 89 Loading BIOS image to RAM PEI_FINDING_DXE_CORE PEI 8A Loading DXE core PEI_GO_TO_DXE_CORE PEI 8B Enter DXE core * 3rd pa rty relate functions – Platfo rm dependence.
4-24 T roub leshooting DXE_RELOCA TE_SMBASE DXE 56 Relocate SMM BASE DXE_FIRST_SMI DXE 57 SMI test DXE_VTD_INIT* DX E 58 VTD Initial DXE_BEFORE_CSM16_INIT DXE 59 Legacy BIOS Initialization DXE_AFTER_C.
T roub leshooting 4-25 BDS_ST ART_IDE_CONTROLLER BDS 1E ID E controller initialization BDS_ST ART_SA T A_CONTROLLER BDS 1F SA T A controller initialization BDS_ST ART_ISA_ACPI_CONTROLLER BDS 20 SIO co.
4-26 T roub leshooting T able 4-7. S3 Funct i ons POST Code T able Functionality Name (Includ e PostCode.h) Phase Post Code Description S3_RESTORE_MEMOR Y_CONTROLLER PEI C0 Memory initial for S3 resu.
T roub leshooting 4-27 T able 4-9. SMM Funct ions POST Code T able Functionality Name (Include PostCode.h) Phase Post Code Description SMM_IDENTIFY_FLASH_DEV ICE SMM 0xA0 Identify Flash device in SMM .
4-28 T roub leshooting.
CHAPTER 5 Jumper and Connector Locations.
5-2 Mainboard Jumper and C onnector Locations . . . . . . . . . . . . . . 5-3 USB Board Jumper and Co nnector Locations . . . . . . . . . . . . . . 5-5 Power Board Jumper and Connector Locations . . . . . . . . . . . . 5-6 Clearing Password Check a nd BIOS Recovery .
Jumper and Connector Locati ons 5-3 Jumper and Connector Locations Mainboard Jumper and Connector Locations 0 Figure 5-1. Mainboard T op T able 5-1. Mainboard T op Item Description Item Description JL.
5-4 Jumper and Conne ctor Locations Figure 5-2. Mainboard Bottom T able 5-2. Mainboard Bottom Item Descript ion Item Description PJP2 Connect of Battery JHP1 Connect to external hea dphone PJP1 DC-IN .
Jumper and Connector Locati ons 5-5 USB Board Jumper and Connector Locations 0 Figure 5-3. USB Board T a ble 5-3. USB Board Item Description JUSB1 / JUSB2 USB connector JP1 Connect to mainboard (w/ FF.
5-6 Jumper and Conne ctor Locations Power Board Jumper and Connector Locations 0 Figure 5-4. Power Board T op Figure 5-5. Power Board Bottom T able 5-4.
Jumper and Connector Locati ons 5-7 Clearing Password Check and BIOS Recovery 0 This section provides users with the stan dard o perating proc edures of clearing pa ssword and BIOS recovery for the Packard Bell EasyNote TK1 1BZ/TK13BZ.
5-8 Jumper and Conne ctor Locations Clear CMOS Jumper 0 Figure 5-6. CMOS Jumper BIOS Recovery by Crisis Disk 0 BIOS Recovery Boot Bloc k 0 BIOS Recovery Boot Block is a special block of BIOS. It is used to boot up the system with minimum BIOS initialization.
Jumper and Connector Locati ons 5-9 S teps for BIOS Recovery from U SB S torage 0 NOTE: NOTE : Prior to performing the re co very , prepare a Crisis USB key . The Crisis USB key is created by executing the Crisis Disk prog ram on another system with Windows 7 OS.
5-1 0 Jumper and Connector L ocations.
CHAPTER 6 FRU (Field Replaceable Unit) List.
6-2 Exploded Diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 -4 FRU List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-6 Screw List . . . . . . . . . . . . . . . . . . . . .
FRU (Field Repla ceable Unit) List 6-3 FRU (Field Replaceable Unit) List This chapter provides users with a FRU (Fie ld Replaceable Unit) listing in global configurations for the Packard Bell EasyNot e TK1 1BZ/TK13BZ. Refer to this c hapter whenever ordering for p arts to repa ir or for RMA (Return Merchand ise Authorization).
6-4 FRU (Fie ld Replaceable Unit) List Exploded Diagrams 0 Figure 6-1. Upper & Lower Cover Exploded Diagram T able 6-1. Upper & Lower Cover Exploded Diagram No. Description Acer Part No. No. Description Acer Part No. 1 Upper Cover 60.WVZ02.001 5 O DD Board 55.
FRU (Field Repla ceable Unit) List 6-5 Figure 6-2. LCD Assembly Exploded Diagram T able 6-2. LCD Assembly Exploded Diagram No. Description Acer Part No. No. Description Acer Part No. 1 L CD Bezel 60.BQ502.004 5 LCD Cover 60.BQ502.003 2 L ED Panel LK.15605.
6-6 FRU (Fie ld Replaceable Unit) List FRU List 0 T able 6-3. FRU List Category Description Acer Part No. ADAPTER Adapter DEL T A 65W 19V 1.7x5.5x1 1 Y ellow ADP-65JH DB A, L V 5 LED LF AP .06501.026 Adapter LITE-ON 65W 19V 1.7x5.5x1 1 Y ellow P A -1650-22AC L V5 LED LF AP .
FRU (Field Repla ceable Unit) List 6-7 POWER BOARD 55.WVZ02.001 USB BOARD 55.WVZ02.002 ODD BOARD 55.WVZ02.003 LITEON WIRELESS LAN A T HERIS HB97 2X2 BGN (HM) W N6603AH NI.23600.0 73 FOXCONN WIRELESS LAN A THEROS HB97 2X2 BGN (HM) NI.23600.0 72 FOXCONN WIRELSS LAN A THEROS HB95BG (HM) T77H121.
6-8 FRU (Fie ld Replaceable Unit) List POWER CORD EU 3 PIN 27.T A VV5.002 POWER CORD AUS 3 PIN 27.T A VV5.003 POWER CORD UK 3 PIN 27.T A VV5.004 POWER CORD CH INA 3 PIN 27.T A VV5.0 05 POWER CORD SWISS 3 PIN 27.T A VV5.006 POWER CORD IT ALIAN 3 P IN 27.
FRU (Field Repla ceable Unit) List 6-9 DVD RW DR IVE ODD SUPER-MUL TI DRI VE MODULE 6M.R4G02.003 ODD BRACKET 33.R4F02.002 ODD BEZEL-SM 42.R4F02.00 2 ODD SONY Super-Multi DRIVE 12.7mm T ray DL 8X AD-7585H LF W/O bezel SA T A (HF + Windows 7) KU.0080E.027 ODD P ANASONIC Super-Multi DRIVE 12.
6-1 0 FRU (Field Rep la ceable Unit) List HDD WD 2.5" 5400rpm 250GB WD2500BPVT -22ZEST0,ML 320S-AF , 4K drive SA T A 8MB LF F/W:01.01A01 4K drive KH.25008.029 HDD HGST 2.5" 5400rpm 320GB HTS545032B9A300 Pa nther B SA T A LF F/W:C60F Disk imbalanc e criteria = 0.
FRU (Field Repla ceable Unit) List 6- 1 1 KEYBOARD Keyboard GA TEWA Y AC7T_G10B AC7T Internal 17 S tandard 103KS Black US International T exture KB.I170G .197 Keyboard GA TEWA Y AC7T_G10B AC7T Internal 17 S tandard 103KS Blac k Greek T exture KB.I170G .
6-1 2 FRU (Field Rep la ceable Unit) List Keyboard GA TEWA Y AC7T_G10B AC7T Internal 17 S tandard 104KS Black Hung arian T exture KB.I170G .182 Keyboard GA TEWA Y AC7T_G10B AC7T Internal 17 S tandard 104KS Black Nor w egian T exture KB.I170G .187 Keyboard GA TEWA Y AC7T_G10B AC7T Internal 17 S tandard 104KS Black Por t uguese T exture KB.
FRU (Field Repla ceable Unit) List 6-13 LCD ASSY LED LCD MODULE 15.6"W WXGA GLARE W/ANTENNA*2, CCD 1.3M, BLACK - PB 6M.BQ502.003 ANTENNA WLAN-MA IN 50.R4F0 2.005 ANTENNA WLAN-AUX 50.R4F02.006 LED CABLE FOR W/CMOS 50.R4F02.009 LED COVER-BLACK PB 60 .
6-1 4 FRU (Field Rep la ceable Unit) List LED LCD AUO 15.6"W WXGA Glar e B156XW02 V2 LF 200nit 8ms 500:1 (pow er saving) LK.15605.010 LED LCD SAMSUNG 15.6"W WXGA Glare L TN156A T02-A1 1 LF 220nit 8ms 500:1 LK.15606.012 LED LCD LPL 15.6"W WXGA Glare LP156WH2-T LEA LF 22 0n it 16 m s 500: 1 (co l or engine) LK.
FRU (Field Repla ceable Unit) List 6-15 LED COVER-RED PB 60.BQ702.002 LCD BEZEL FOR W/CMOS PB 60.BQ502.004 LED BRACKET R&L 33.R4F 02.004 CAMERA 1.3M 5 7. WW1 02 .0 01 LED LCD AUO 15.6"W WXGA Glar e B156XW02 V2 LF 200nit 8ms 500:1 (pow er saving) LK.
6-1 6 FRU (Field Rep la ceable Unit) List ANTENNA WLAN-MA IN 50.R4F0 2.005 ANTENNA WLAN-AUX 50.R4F02.006 LED CABLE FOR W/CMOS 50.R4F02.009 LED COVER-BLACK G W 60.WSG02.0 02 LCD BEZEL FOR W/CM OS GW 60. WSG 02.003 LED BRACKET R&L 33.R4F 02.004 CAMERA 1.
FRU (Field Repla ceable Unit) List 6-17 LED LCD AUO 15.6"W WXGA Glar e B156XW02 V2 LF 200nit 8ms 500:1 (pow er saving) LK.15605.010 LED LCD SAMSUNG 15.6"W WXGA Glare L TN156A T02-A1 1 LF 220nit 8ms 500:1 LK.15606.012 LED LCD LPL 15.6"W WXGA Glare LP156WH2-T LEA LF 22 0n it 16 m s 500: 1 (co l or engine) LK.
6-1 8 FRU (Field Rep la ceable Unit) List LED COVER-RED GW 60.WSX02.002 LCD BEZEL FOR W/CM OS GW 60. WSG 02.003 LED BRACKET R&L 33.R4F 02.004 CAMERA 1.3M 5 7. WW1 02 .0 01 LED LCD AUO 15.6"W WXGA Glar e B156XW02 V2 LF 200nit 8ms 500:1 (pow er saving) LK.
FRU (Field Repla ceable Unit) List 6-19 Mainboard eME644G AMD LF SEM O UR_XT VRAM 512MB (AS5253G/ENTK1 1/ENTK13/NV51B) MB.NCY02.001 MEMOR Y Memory SAMSUNG SO-DIMM DDRIII 1333 1GB M471B2873FHS- C H9 LF 128*8 46nm KN.1GB0B.035 Memory KINGSTON SO -DIMM DDRIII 1333 1GB ACR128X6 4D3S1333C9 LF 128*8 0.
6-2 0 FRU (Field Rep la ceable Unit) List THERMAL MODULE-DIS W/O F AN 60.RDS02.001 F AN 2 3.RD502.001 SPEAKER MIC SET - DIS & UMA FOR AS5336, AS5736Z, ENTK36, ENTK37, NV51M 23.R5202.001 SPEAKER L 23.R4F02.003 MISCELLANEOUS LCD SCREW P AD 47.R4F02.
FRU (Field Repla ceable Unit) List 6-21 Screw List 0 T a ble 6-4. Screw List Category Descriptio n Acer Part No. SCREW 2.5D 5L K 5.5D ZK NL + CR3 86.R4F02.001 SCREW 2.45D 8. 0L K 5.5D 0. 8T ZK NL 8 6.R4F02.002 SCREW 2.5D 6L K 5.5D NI NL 86.R4F02.003 SCREW 1.
6-2 2 FRU (Field Rep la ceable Unit) List.
CHAPTER 7 Model Definition and Configuration.
7-2 Packard Bell EasyNote TK11BZ/TK13BZ . . . . . . . . . . . . . . . . . . 7-3.
Model Definition a nd Configuration 7-3 Model Definition and Configuration Packard Bell EasyNote TK11BZ/TK13BZ 0 T a ble 7-1. RO, Description Model RO Country Acer Part No Description ENTK1 1BZ-E 352G32Mnkk EMEA Holland LX.BSG02.00 1 ENTK1 1BZ-E352G32Mnkk W7HP64BSNL1 UMACkk_3 1*2G/320/6L2.
7-4 Model Definition and Configuration ENTK1 1BZ-E 353G50Mnkk Hungary LX.BSG0C.001 AMDE350B NLED15.6WXGAG UMA ENTK1 1BZ-E 353G50Mnkk Russia LX.BSG01.001 AMDE 350B NLED15.6WXGAG UMA ENTK1 1BZ-E 353G50Mnkk Russia LX.BSG02.002 AMDE 350B NLED15.6WXGAG UMA ENTK13BZ- E 352G32Mnrr Holland LX.
Model Definition a nd Configuration 7-5 T able 7-5. Wireless, Bluetooth, NB Chip set Model Country Acer Part No Wireless LAN Bluetooth NB Chip set ENTK1 1BZ-E 352G32Mnkk Holland LX.BSG02.001 3rd WiFi 2x2 BGN NA M D A 5 0 M F C H ENTK1 1BZ-E 352G50Mnkk Russia LX.
7-6 Model Definition and Configuration.
CHAPTER 8 Test Compatible Components.
8-2 Microsoft® Windows® 7 Environment Te st . . . . . . . . . . . . . . . . 8-4.
T est Compatible Co mponents 8-3 Test Compatible Components This computer ’s compatibility is tested and verified by Acer’s in ternal testing department. All of its system functions are tested under Windows ® 7 environment. Refer to the fo llowing lists for compone nts, adapter cards, and peripher als which have passed these tests.
8-4 T est Compatible Compone nts Microsoft ® Windows ® 7 Environment Test 0 T a ble 8-1. T est Compatible Component s V endor Ty p e Description Part No. Accessory 10001061 TSS Power DVD 10 Softwar e POWER DVD 10 , V10.0.231 8.52 LZ.23800.071 10001061 TSS Power DVD 9 Software POWER DVD 9, V9.
T est Compatible Co mponents 8-5 60001921 SANYO 6CELL2.2 Batte ry SANYO AS10D Li-Ion 3S2P SANYO 6 cell 4400mAh Main COMMON ID:AS10D31 BT .00603.1 1 1 60002162 SIMPLO 6CELL2.2 Battery SIMPLO AS10D Li-Ion 3S2P P ANASONIC 6 cell 4400mAh Main COMMON ID:AS10D71 BT .
8-6 T est Compatible Compone nts HDD 60001922 T OSHIBA DIGI N250GB5.4K S HDD TOSHIBA 2.5" 5400rpm 250GB MK2565GSX, Capricorn BS, 320G/P SA T A 8MB LF F/W:GJ002J KH.25004.0 05 60001922 T OSHIBA DIGI N320GB5.4K S HDD TOSHIBA 2.5" 5400rpm 320GB Capricorn BS,MK3265GSX SA T A 8MB LF F/W:GJ002J KH.
T est Compatible Co mponents 8-7 60002005 HGST SG N250GB5.4KS HDD HGST 2.5" 5400rpm 250GB HTS545025B9A300 Panther B SA T A LF F/W:C60F Disk imbalance criteria = 0.014g-cm KH.25007.0 16 60002005 HGST SG N320GB5.4KS HDD HGST 2.5" 5400rpm 320GB HTS545032B9A300 Panther B SA T A LF F/W:C60F Disk imbalance criteria = 0.
8-8 T est Compatible Compone nts Keyboard 60004864 DARFON AC7T_G10B Keyboard GA TEW A Y AC7T_G10B AC7T Internal 17 S tandard Black NONE Y2010 G TW_PB Legend T exture KB.I170G .142 LAN 10017383 Athero s AR8151L Atheros AR8151 L NI.22400.048 LCD 10001038 CMO NLED15.
T est Compatible Co mponents 8-9 60002045 HYNIX SO2GBIII13 Memory HYNIX SO-DIMM DDRIII 1333 2GB HMT325S6BF R8C-H9 LF 256*8 46nm KN.2GB0G .018 60002215 SAMSUNG SO1GBIII13 Memory SAMSUNG SO-DIMM DDRIII 1333 1GB M471B2873FHS-CH9 LF 128 *8 46nm KN.1GB0B.035 60002215 SAMSUNG SO2GBIII10 Memory NONE SO-DIMM DDRIII 1066 2GB dummy 1066 LF KN.
8-1 0 T est Compatib le Comp onents 10001070 PHILIPS NBDCB4XS ODD PLDS BD COMBO 12.7mm T ray DL 4X DS-6E2SH LF W/O bezel SA T A (HF + Win7 + 3D) KO.0040F .006 10001070 PHILIPS NSM8XS ODD PLD S Super-Multi DRIVE 12.7mm T ray DL 8X DS-8A5SH LF+HF W/O bezel SA T A With TI + Rohm Solution (HF + Windows 7) KU.
T est Compatible Co mponents 8-1 1 610105 HLDS NSM8XS ODD HLDS Super-Multi DRIVE 12.7mm T ray DL 8X G T32N (R5-2) LF W/O be zel SA T A with Renesas solution + PCC LD (HF + Windows 7) KU.0080D .055 SB Chip set 9999995 ONE TIME VENDER N N KI.22800.0 1 1 Sof tware 10000981 MISC NIS Antivirus application NIS SR.
8-1 2 T est Compatib le Comp onents 23707801 FOXCONN TW 3rd WiFi 2x2 BGN Foxco nn Wireless LAN At heros HB97 2x2 BGN (HM) NI.23600.072 23707801 FOXCONN TW 3rd WiFi 2x2 BGN Foxco nn Wireless LAN Broadcomm 43225 2x2 BGN (HM) T7 7H103.00 NI.23600.066 23707801 FOXCONN TW 3rd WiFi BG Foxconn Wireless LAN Atheros HB95BG (HM) T77H121.
CHAPTER 9 Online Support Information.
9-2 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-3.
Online Support In formation 9-3 Online Support Information Introduction 0 This section describes online tech nical support services available to he lp users repair their Acer Systems. For distributors, dealers, ASP or TPM, refer the tech nical queries to a local Acer branch office.
9-4 Online Support Inform ation.
デバイスPackard Bell TK11BZの購入後に(又は購入する前であっても)重要なポイントは、説明書をよく読むことです。その単純な理由はいくつかあります:
Packard Bell TK11BZをまだ購入していないなら、この製品の基本情報を理解する良い機会です。まずは上にある説明書の最初のページをご覧ください。そこにはPackard Bell TK11BZの技術情報の概要が記載されているはずです。デバイスがあなたのニーズを満たすかどうかは、ここで確認しましょう。Packard Bell TK11BZの取扱説明書の次のページをよく読むことにより、製品の全機能やその取り扱いに関する情報を知ることができます。Packard Bell TK11BZで得られた情報は、きっとあなたの購入の決断を手助けしてくれることでしょう。
Packard Bell TK11BZを既にお持ちだが、まだ読んでいない場合は、上記の理由によりそれを行うべきです。そうすることにより機能を適切に使用しているか、又はPackard Bell TK11BZの不適切な取り扱いによりその寿命を短くする危険を犯していないかどうかを知ることができます。
ですが、ユーザガイドが果たす重要な役割の一つは、Packard Bell TK11BZに関する問題の解決を支援することです。そこにはほとんどの場合、トラブルシューティング、すなわちPackard Bell TK11BZデバイスで最もよく起こりうる故障・不良とそれらの対処法についてのアドバイスを見つけることができるはずです。たとえ問題を解決できなかった場合でも、説明書にはカスタマー・サービスセンター又は最寄りのサービスセンターへの問い合わせ先等、次の対処法についての指示があるはずです。