SonyメーカーHCD-DX30の使用説明書/サービス説明書
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HCD-DX30/RG40 US Model Canadian Model AEP Model HCD-RG40 E Model A ustr alian Model HCD-DX30 SERVICE MANUAL COMP ACT DISC DECK RECEIVER Sony Corporation Home Audio Compan y Shinagawa T ec Service Manual Production Group 9-873-149-01 2001E1600-1 © 2001.
2 HCD-DX30/RG40 Tape deck section Recording system 4-track 2-channel stereo Frequency response 40 – 13,000 Hz ( ± 3 dB), using Sony TYPE I cassette Tuner section FM stereo, FM/AM superheterodyne tuner FM tuner section Tuning range 87.5 – 108.0 MHz Antenna FM lead antenna Antenna terminals 75 ohm unbalanced Intermediate frequency 10.
3 HCD-DX30/RG40 This appliance is classified as a CLASS 1 LASER product. The CLASS 1 LASER PR ODUCT MARKING is located on the rear exterior . Laser component in this product is capable of emitting radiation exceeding the limit for Class 1.
4 HCD-DX30/RG40 SECTION 1 SER VICE NO TE.
5 HCD-DX30/RG40 This section is e xtracted from instruction manual. SECTION 2 GENERAL Main unit ql w; qj qh qk qg qd qf wa ws wd wf wg wh wj wk eg ef ed es e; wl 12 34 6 58 9 q ; q a q s 7 ea AUDIO ja.
6 HCD-DX30/RG40 Remote Control 5 6 7 8 9 0 qa qs 12 3 4 qd qf qg qh ql qk qj CD qj CLEAR 6 CLOCK/TIMER SELECT 2 CLOCK/TIMER SET 3 D.SKIP ql EFFECT ON/OFF qa ENTER qf GAME qk MD (VIDEO) 9 P FILE qd PRESET EQ qg SLEEP 1 SURROUND 0 TAPE A/B 8 TUNER/BAND qh VOL +/ – 7 BUTTON DESCRIPTIONS v / V / b / B qs M (fast forward)/TUNING + 5 .
7 HCD-DX30/RG40 SECTION 3 DISASSEMBL Y 3-1. CASE (T OP) Note : Disassemble the unit in the order as sho wn below . Note : Follo w the disassembly procedure in the numerical order gi ven.
8 HCD-DX30/RG40 3-2. CD DDOR 3-3. FR ONT P ANEL SECTION 2 Pull-out the disc tray. 1 Turn the pulley to the direction of arrow. pulley CD door Front panel side CD mechanism deck (CDM58B) 3 qd qs 5 CD m.
9 HCD-DX30/RG40 3-4. T APE MECHANISM DECK 3-5. P ANEL BO ARD 1 Six screws (+BVTP 2.6 × 8 ) 2 Tape mechanism deck 1 Volume knob 2 Vol knob ring 4 Connector 13p (CN712) Note: When attching the panel board, refer to "Service Note" on page 4. 6 Panel board 3 5 Cut the seven melted-connection points with a cutting plier.
10 HCD-DX30/RG40 3-6. KEY BO ARD 3-7. SUB TRANS BO ARD, TRANS BO ARD, SENSOR BO ARD AND VIDEO OUT BOARD Note: When attching the Key board, refer to "Service Note" on page 4. 2 Key board 1 Cut the six melted-connection points with a cutting plier.
11 HCD-DX30/RG40 3-8. MAIN BO ARD AND POWER BO ARD 3-9. B ASE UNIT 4 Three screws (+BVTT 3 × 6) 6 Two screws (+BVTT 3 × 6) 7 Heat sink 3 Two screws (+BVTP 3 × 16) 1 Two screws (+BVTT 3 × 6) 2 Main boar d 5 Po we r board Main board Base unit qa 9 Tw o screws (+PTPWH M2.
12 HCD-DX30/RG40 3-10. DRIVER BO ARD, MOT OR BO ARD AND ADDRESS SENSOR BO ARD 9 Pull-out the disc tray. 4 Two screws (+BVTP 2.6 × 8) q; Screw (+PTPWH 2.
13 HCD-DX30/RG40 SECTION 4 TEST MODE [MC Cold Reset] • The cold reset clears all data including preset data stored in the RAM to initial conditions. Execute this mode when returning the set to the customer . Procedur e: 1. Press three buttons x , ENTER , and ? / 1 simultaneously .
14 HCD-DX30/RG40 [MC T est Mode] • This mode is used to check operations of the respectiv e sections of Amplifier , TUNER, CD and T ape. Pr ocedure: 1. Press the ? / 1 button to turn on the set. 2 . Press the three b uttons of x , ENTER and DISC 3 simultaneously .
15 HCD-DX30/RG40 [Aging Mode] This mode can be used for operation check of CD section and tape deck section. • If an error occurred: The aging operation stops and display status. • If no error occurs: The aging operation continues repeatedly . 1. Operating method of Aging Mode T urn on the main power and select “ CD ” of the function.
16 HCD-DX30/RG40 2) Operation during aging mode In the aging mode, the program is ex ecuted in the following sequence. (1) The disc tray opens and closes. (2) The mec hanism accesses DISC 2 and mak es an attempt to read T OC. Howe ver , since there are no discs, a message “ CD2 NO DISC ” appears.
17 HCD-DX30/RG40 SECTION 5 ELECTRICAL ADJUSTMENTS FM T uned Level Adjustment Procedur e: 1. Supply a 98 MHz signal a t 28 dB from the ANTENN A terminal. 2. T une the set to 98 MHz. 3 . Adjust R V101 to the point (moment) when the TUNED indicator will change from going of f to going on.
18 HCD-DX30/RG40 Note : Clear RF signal waveform means that the shape “ ◊ ” can be clearly distinguished at the center of the wa veform. E-F Balance (1 T rack jump) Chec k Pr ocedure : 1. Connect oscilloscope to TP (TEO) and TP (VC). 2. Turned Po wer switch on.
19 HCD-DX30/RG40 SECTION 6 DIA GRAMS Note on Schematic Diagram: • All capacitors are in µ F unless otherwise noted. pF: µµ F 50 WV or less are not indicated except f or electrolytics and tantalums. • All resistors are in Ω and 1 / 4 W or less unless otherwise specified.
20 HCD-DX30/RG40 6-1. CIRCUIT BO ARD LOCA TION • W A VEFORMS 1 IC102 wf STOP MODE 4.1Vp-p 2 IC401 qd STOP MODE 3 IC401 qa STOP MODE 4.0Vp-p 3.0Vp-p 222ns (4.5MHz) 63ns (16.0MHz) 31 µ s (32.768kHz) 1 IC701 4 STOP MODE 5.3Vp-p 200ns (5MHz) – MAIN BO ARD –– P ANEL BOARD – 1 IC101 yj CD PLAY MODE 6.
21 21 HCD-DX30/RG40 6-2. BLOCK DIA GRAMS TUNER/CD SECTION : FM : CD • Signal Path • RCH is omitted : DIGITAL OUT FM 75 Ω G AM TM101 ANT IN 1 7 IF OUT 8 OSC OUT 5 VT FE101 EXCEPT US,CND,AEP MODEL.
22 22 HCD-DX30/RG40 MAIN SECTION : FM : CD • Signal Path • RCH is omitted : PB (DECK A) : PB (DECK B) : REC (DECK B) R-CH BIAS OSC Q223 A TUNER SECTION B CD SECTION R-CH L-CH LOUT L-CH JK301 L R D.
23 23 HCD-DX30/RG40 6-3. SCHEMA TIC DIA GRAM MAIN SECTION (1/4) • See page 20 f or W avef oms. • See page 42 for IC Bloc k Diagrams. IC B/D IC B/D (Page 25) (Page 24) DX30.
24 24 HCD-DX30/RG40 6-4. SCHEMA TIC DIA GRAM MAIN SECTION (2/4) • See page 43 for IC Bloc k Diagrams . IC B/D (P age 23) (P age 25) (P age 26).
25 25 HCD-DX30/RG40 6-5. SCHEMA TIC DIA GRAM MAIN SECTION (3/4) (P age 24) (P age 23) (P age 26) (P age 31).
26 26 HCD-DX30/RG40 6-6. SCHEMA TIC DIA GRAM MAIN SECTION (4/4) • See page 20 for Wa vef oms. • See page 40 f or IC Pin Function Descr iption. (Page 25) (Page 29) (Page 31) (Page 37) (Page 33) (Pa.
27 27 HCD-DX30/RG40 6-7. PRINTED WIRING BO ARD MAIN SECTION • See page 20 f or Circuit Boards Location. IC102 IC101 IC681 IC301 IC661 IC401 IC201 IC684 IC682 IC683 IC103 TM101 MAIN BOARD AEP ,UK AEP.
28 28 HCD-DX30/RG40 6-8. PRINTED WIRING BO ARD BD SECTION IC101 IC102 IC103 (Page 27) A CN102 TP (VC) TP (RF) TP(TE0) TP(FE0) TP(FE1) TP(D GND) TP(AGC CON) TP (XPCK) 18 19 2 1 M Ref.
29 29 HCD-DX30/RG40 6-9. SCHEMA TIC DIA GRAM BD SECTION • See page 20 for Wa v efoms. • See page 43, 44 f or IC Block Diagrams . IC B/D IC B/D IC B/D CN102 (Page 26) A (4/4).
30 30 HCD-DX30/RG40 6-10. PRINTED WIRING BO ARD PO WER AMP SECTION • See page 20 for Circuit Boards Location. IC501 _ + PO WER AMP BOARD SENSOR BO ARD 11 (11) 1-681-442- 11 (11) 1-681-448- TO TRANS .
31 31 HCD-DX30/RG40 6-11. SCHEMA TIC DIA GRAM PO WER AMP SECTION CN915 (Page 39) F CN402 (3/4) (Page 25) CN403 (4/4) (Page 26) C544 1000 25V D5SBA204101 CN506 2 : C502,552 470p : RG40 1000p : DX30 2 2.
32 32 HCD-DX30/RG40 6-12. PRINTED WIRING BO ARD P ANEL SECTION • See page 20 f or Circuit Boards Location. IC701 IC702 SENS701 E E E E E E P ANEL BO ARD DX30 DX30 DX30 DX30 J701,702 E VIDEO OUT VIDE.
33 33 HCD-DX30/RG40 6-13. SCHEMA TIC DIA GRAM P ANEL SECTION • See page 20 f or Wa v efoms. • See page 41 f or IC Pin Function Description. 4 .9 0 3 .
34 34 HCD-DX30/RG40 6-14. PRINTED WIRING BO ARD KEY SECTION • See page 20 for Circuit Boards Location. E E E E KEY BO ARD G TO P ANEL BOARD CN712 (P age 32) 1-681-447- 11 (11) S704-721,726-738 13 12 A B C D E 34567 DX30 Ref.
35 35 HCD-DX30/RG40 6-15. SCHEMA TIC DIA GRAM KEY SECTION (P age 33).
36 36 HCD-DX30/RG40 6-16. PRINTED WIRING BO ARD DRIVER SECTION • See page 20 f or Circuit Boards Location. 12 A B C D E F G 3456 IC711 IC701 14 14 14 14 14 14 (Page 27) E CN1 4.
37 37 HCD-DX30/RG40 6-17. SCHEMA TIC DIA GRAM DRIVER SECTION • See page 43 f or IC Block Diagrams . CN1 (Page 26) (4/4) E IC B/D AC E K.
38 38 HCD-DX30/RG40 6-18. PRINTED WIRING BO ARD TRANS SECTION • See page 20 for Circuit Boards Location. IC901 TRANS BO ARD VO L T AG E SELECT OR SP ,E,AR,E51 EXCEPT SP ,E,AR,E51 SP ,E,AR,E51,AUS AE.
39 39 HCD-DX30/RG40 6-19. SCHEMA TIC DIA GRAM TRANS SECTION (P age 31).
40 40 HCD-DX30/RG40 6-20. IC PIN FUNCTION DESCRIPTION • MAIN BO ARD IC401 M30622MCA-B23FP (MASTER CONTR OL) Pin No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 3.
41 HCD-DX30/RG40 Pin No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 I/O — — O I I I I I — — I I — — I — — I — — — O O O O O O O O O — — O — O O Description Power supply .
42 HCD-DX30/RG40 6-21. IC BLOCK DIAGRAMS IC101 B A1450 (MAIN BO ARD) IC102 LC72130 (MAIN BO ARD) 1 2 3 4 5 6 7 8 9 10 11 12 16 17 18 19 20 21 22 23 24 15 14 13 AM OSC AM MIX AM IF FM IF FM DET AM DET .
43 HCD-DX30/RG40 IC201 T A8189N (MAIN BO ARD) IC701 B A6956AN (DRIVER BO ARD) IC101 CXD2587Q (BD BO ARD) CH2/A CH2/B NF VCC CG NF ALC METAL OUT PRE OUT TAPE A /TAPE B REC OUT REC IN CH1/A CH1/B NF GND.
44 HCD-DX30/RG40 IC102 B A5974P (BD BO ARD) IC103 CXA2568M-T (BD BO ARD) LEVEL SHIFT INTERFACE INTERFACE INTERFACE 1 2 3 4 5 6 7 8 9 10 11 12 13 14 20 21 22 23 24 25 26 27 28 19 18 17 16 15 F R R F F .
SECTION 7 EXPLODED VIEWS NOTE: • -XX, -X mean standardized parts, so they may hav e some differences from the original one. • Items marked “*” are not stocked since they are seldom required for routine service. Some delay should be anticipated when ordering these items.
46 HCD-DX30/RG40 7-2. FR ONT P ANEL SECTION Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks 51 68 52 53 54 55 56 57 57 58 59 67 60 60 61 62 63 * 69 70 * 69 69 69 69 64 65 66 FLD1 * For service only (Be sure to refer to "Service note" on page 4.
47 HCD-DX30/RG40 7-3. MAIN BO ARD SECTION Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks The components identified by mark 0 or dotted line with mark 0 are critical for saf ety . Replace only with par t n umber specified. Les composants identifi é s par une marque 0 sont critiques pour la s é curit é .
48 HCD-DX30/RG40 7-4. CD MECHANISM DECK SECTION Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks The components identified by mark 0 or dotted line with mark 0 are critical for saf ety . Replace only with part number specified.
Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks 49 SECTION 8 ELECTRICAL P ARTS LIST NOTE: • Due to standardization, replacements in the parts list may be different from the parts specified in the diagrams or the components used on the set.
Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks 50 HCD-DX30/RG40 DRIVER KEY BD R111 1-216-121-11 RES-CHIP 1M 5% 1/10W R113 1-216-121-11 RES-CHIP 1M 5% 1/10W R114 1-216-073-.
Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks 51 HCD-DX30/RG40 KEY MAIN S709 1-762-875-21 SWITCH, KEYBOARD( v ) S710 1-762-875-21 SWITCH, KEYBOARD( V ) S711 1-762-875-21 .
Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks 52 HCD-DX30/RG40 MAIN C179 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V (RG40:AEP) C180 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V (RG40:AEP) C181 1-126-961-11 ELECT 2.2uF 20.00% 50V (RG40:AEP) C182 1-162-924-11 CERAMIC CHIP 56PF 5.
Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks 53 HCD-DX30/RG40 MAIN C350 1-165-128-11 CERAMIC CHIP 0.22uF 16V C351 1-162-964-11 CERAMIC CHIP 0.001uF 10% 50V (RG40) C351 1-162-962-11 CERAMIC CHIP 470PF 10% 50V (DX30) C352 1-162-964-11 CERAMIC CHIP 0.
Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks 54 HCD-DX30/RG40 MAIN D374 8-719-988-61 DIODE 1SS355TE-17 D383 8-719-988-61 DIODE 1SS355TE-17 D601 8-719-988-61 DIODE 1SS355.
Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks 55 HCD-DX30/RG40 MAIN JR603 1-216-864-11 MET AL CHIP 0 5% 1/16W (DX30,RG40:AEP) JR606 1-216-864-11 MET AL CHIP 0 5% 1/16W (D.
Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks 56 HCD-DX30/RG40 MAIN R112 1-216-829-11 MET AL CHIP 4.7K 5% 1/16W R113 1-216-829-11 MET AL CHIP 4.
Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks 57 HCD-DX30/RG40 MAIN R263 1-216-833-11 MET AL CHIP 10K 5% 1/16W R264 1-216-833-11 MET AL CHIP 10K 5% 1/16W R265 1-218-917-1.
Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks 58 HCD-DX30/RG40 R619 1-216-809-11 MET AL CHIP 100 5% 1/16W R620 1-216-813-11 MET AL CHIP 220 5% 1/16W R621 1-216-813-11 MET.
Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks 59 HCD-DX30/RG40 A-4476-797-A P ANEL BOARD, COMPLETE (DX30:AR,AUS,E,E51,MX,SP) ********************** A-4725-721-A P ANEL BO.
Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks 60 HCD-DX30/RG40 < FERRITE BEAD > FB701 1-412-473-41 INDUCTOR 0UH < FLUORESCENT INDICA TOR > FLD1 1-518-729-11 I.
Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks 61 HCD-DX30/RG40 A-4725-717-A POWER AMP BOARD, COMPLETE (DX30:KR) *************************** A-4725-997-A POWER AMP BOARD, .
Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks 62 HCD-DX30/RG40 0 R508 1-217-156-00 METAL 0.22 20% 5W (DX30) R509 1-260-076-11 CARBON 10 5% 1/2W 0 R510 1-217-151-00 METAL 0.
Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks 63 HCD-DX30/RG40 1-681-444-11 TRANS BOARD ************ 1-533-217-11 HOLDER, FUSE < CAP ACITOR > C911 1-128-553-11 ELECT 220uF 20.00% 63V C912 1-126-964-11 ELECT 10uF 20.
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デバイスSony HCD-DX30の購入後に（又は購入する前であっても）重要なポイントは、説明書をよく読むことです。その単純な理由はいくつかあります：
Sony HCD-DX30をまだ購入していないなら、この製品の基本情報を理解する良い機会です。まずは上にある説明書の最初のページをご覧ください。そこにはSony HCD-DX30の技術情報の概要が記載されているはずです。デバイスがあなたのニーズを満たすかどうかは、ここで確認しましょう。Sony HCD-DX30の取扱説明書の次のページをよく読むことにより、製品の全機能やその取り扱いに関する情報を知ることができます。Sony HCD-DX30で得られた情報は、きっとあなたの購入の決断を手助けしてくれることでしょう。
Sony HCD-DX30を既にお持ちだが、まだ読んでいない場合は、上記の理由によりそれを行うべきです。そうすることにより機能を適切に使用しているか、又はSony HCD-DX30の不適切な取り扱いによりその寿命を短くする危険を犯していないかどうかを知ることができます。
ですが、ユーザガイドが果たす重要な役割の一つは、Sony HCD-DX30に関する問題の解決を支援することです。そこにはほとんどの場合、トラブルシューティング、すなわちSony HCD-DX30デバイスで最もよく起こりうる故障・不良とそれらの対処法についてのアドバイスを見つけることができるはずです。たとえ問題を解決できなかった場合でも、説明書にはカスタマー・サービスセンター又は最寄りのサービスセンターへの問い合わせ先等、次の対処法についての指示があるはずです。
