StarTech.comメーカーC3000の使用説明書/サービス説明書
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HP BladeSystem c3000 Enclosure technology brief, 2nd edition Abstract .............................................................................................................................................. 3 Overview of HP BladeSystem c3000 Enclosure .
HP BladeSystem Power Sizer ....................................................................................................... 31 Summary .............................................................................................................
Abstract The HP BladeSystem c3000 Enclosur e is the next generation in an evolution of the entir e rack- mounted infrastru cture. The c3000 en closure is d esi gned for remote sites, small and medium-sized businesses, and data centers with special power and cooling constraints.
Figure 2. HP BladeSystem c3000 Enclosure – rear view The HP BladeSystem c3000 Enclosure has redundant signal paths between servers and interconnect modules.
Table 1. Components supported by HP Bl adeSystem c-Class enclosures Enclosure c3000 c7000 Model Rack (6U) or Tower Rack (10U) Blade orientation Horizontal (rack) Vertical (tower) Vertical Blades suppo.
the component. If a component is remove d from a bay, the Onboard Administrator deletes the information about that component. Identifying components To identify a component, the Onboard Administrator .
Figure 3. Management communications betwe en Onboard Administrator and other components in an HP BladeSystem c3000 Enclosure c3000 internal management interfaces The Onboard Administrator has several .
service port that allows users to temporarily conne ct a laptop PC to any of the linked enclosu re Onboard Administrators for loca l diagnostics and debugging. Updating firmware The Onboard Administrator manages firmware updat es for the enclosure’s management devices.
user credentials. Two -factor authentication allows even tighter security for the user management session to the Onboard Administrator. Rather than requiring separate logins to multiple resources (once to each enclosure and/or once to every server management processor), the Onboard A d ministrator allows secure , single point access.
configured, the Insight Display verifie s that there are no installation or configurat ion errors. The Installation Wizard turns off the enclosur e UID when the installation is complete.
Figure 6. HP BladeSystem c3000 Onboar d Administrator link module Enclosure link cabling The Onboard Administrator link module contains two enclosure li nk ports to allow any active Onboard Administrator module to access linked enclosures.
Enclosure-based DVD ROM The HP BladeSystem c3000 Enclosure has an optional CD/DVD ROM drive that installs in the front of the enclosure. The Insight Display and Onboard Admi nistrator allow system administrators to connect and disconnect the media device to one or multiple servers at a time.
Figure 7. Optional c3000 K VM Module – K VM menu screen Interconnect options and infrastructure A key component of the c3000 en closure is the I/ O infrastructur e—essentially, a NonStop signal midplane that provides the internal wiring between the server or st orage blades and the interconnect modules.
Figure 8. Diagram of the HP BladeSystem c3000 signal midplane By taking advantage of the similar four-wire differ ential transmit and receive mechanism, the NonStop signal midplane can support either network-semantic protocols (such as Ethernet, Fibre Channel, and InfiniBand) or memory-semantic protocol s (PCIe), using the same si gnal traces.
Figure 9. Logically overlaying physical lanes (r ight) onto sets of four traces (l eft) Each device bay connector has a 100-pin signal connector with 64 high-speed signal pins hard-wired from the device bay connector to the interconnect bay s.
Each interconnect module a lso prov ides external connectors that va ry based on the particular design. In the c3000 enclosur e, pairs of single-wid e inte rconnect modules installe d in adjacent horizontal bays provide redundant connectivity for dual-por t interfaces in each device bay.
a Smart Array controller to enable hardware-based RAID config urations. A mezzanine card is not required to connect a half-height server blade to a direct attach storage blade. However, a full-height serv er blade does require a mezzanine card to connect to the direct attach storage blade.
4x DDR single-port mezzanine ca rd will work equally well in Mezzanine 1, Mezzanine 2, or Mezzanine 3 connectors. Both types of mezzanine cards us e a 450-pin connec tor, enabling up to eight lanes of diff erential transmit and receive signals—in other words, up to two x1 connections, up to two x4 connections, or a single x8 connection.
Figure 10. HP BladeSystem c3000 interconnect bay numbering For interconnect bay mapping purp oses, it does not matter in whic h device bay a server blade is installed.
interconnects. It connects embedded Ethernet NICs to the internal facing ports on the Ethernet interconnect. Depending on the configuration requirements, additional mezzanine cards and interconnects c.
signal midplane are allocated to the adjacent devi ce bay. A four-port PCIe x8 mezzanine card installed in connect or 2 PCIe x8 can send x2 signals to interconnect bays 3 and 4. Figure 12 lists the available conf igu rations for half-height devices installed in device bay N (1–8).
Figure 13. HP BladeSystem c3000 dev ice bay crosslinks as i ndicated by the arrows Interconnect bay crosslinks Interconnect bay crosslinks are wired between adjac ent interconnect bay pairs as indic ated by the arrows in the c3000 enclo sure rear view (Figure 1 4).
HP Thermal Logic technologies include many elements and capabilities: • Active Cool fans • Parallel Redundant Scalable Enclosure Cooling (PARSEC) design • Instant power and thermal monitoring .
Figure 15. Ducted fan cross-section and ducte d fan blade compared to traditional server fan HP PARSEC architecture The c3000 enclosure u ses PARSEC architect ure— parallel, redundant, sc alable, enclosure-based cooling.
Figure 16. HP BladeSystem c3000 self-sea ling enclosure Redundant and scalable BladeSystem c3000 enclos ures ship with four insta lled fans that provide redundancy and support up to four half-height devices in device bays 1, 2, 5, and 6, or two full-height server blades in device bays 1 and 2.
Figure 17. The c3000 enclosure fan bay an d de vice bay population guidelines Thermal Logic for the server blade Precise ducting on HP server blades manages airflow and temperature based on the unique thermal requirements of all the crit ical components.
Figure 18. Processor heat sink using fully du cted design (left) and a traditional heat sink in a 1U rack-mount server (right) Instant Thermal Monitoring provides a real-time vi ew of heat, power, and cooling data.
Figure 19. HP BladeSystem c3000 Encl osure supports up to six power supplies High efficiency HP c3000 power supplie s provide gr eater than 90 percent efficiency in AC to DC conversion. These power supplie s use the ProLiant univ ersal form factor so they can also be used in other ProLiant servers.
Figure 20. Remote site solution includes a c3000 enclo sure with UPS and local KVM in a small 14U rack NOTE The rack-mountable HP R5500 UPS (5000VA/4500W) supports four power supplies in the power supply redundant (N+1) power mode.
Figure 21. Redundant HP BladeSystem c3000 power supplies c onnected to an HP R5500 UPS Connecting to PDUs with AC redundancy to each rack In an N+N AC redundancy configuration, the tota l power available in the power pool equals the amount from the A or B side, whichever contains fe wer power supplies.
NOTE In redundant environments using Dynamic P ower Saver mode, a minimum of two power supplies are always active. The maximum load for any power supply is 50 percent. Once the 50 percent load is reached, another two power supplies are activated to ensure redundancy at all times.
type, application utilization, and ambient temperatur e. The BladeSystem Power Sizer is available at the following URL: http://www.hp.com/go/blad esystem/powercalculator .
Appendix. Fan, power supply, and device bay population guidelines Figure A-1. Fan population guidelines for HP BladeSystem c 3000 Enclosure. For co rrect operation, fans a nd server blades must be installed in the correct fan bays .
Figure A-2. Power supply population guidelines for HP BladeSystem c3000 Enclosure Table A-1. Power supply placement for HP BladeSystem c3000 Enclosure Number of power supplies Power supply bays used 2 1 and 4 4 1, 2, 4, and 5 6 All power supply bays filled Table A-2.
Figure A-3. Full-height server blade device bay numbering for HP BladeSystem c3000 Enclosure. Full--height servers should be populated from bottom to top (rack) or left to right (tower) when viewing from the front of the enclosure. With four fans, only the bottom or left two de vice bays can be used; with six fans, all device bays can be used.
CAUTION To prevent improper cooling or thermal damage, do not operate the server blade or the enclosure unless all device bays are populated with either a component or a blank. Figure A-5. The c3000 enclosure is divided by sheet metal panels into two full-height zones.
37 CAUTION If a full-height server blade is installed in devi ce bay 1/5 and half-height server blades are installed in devic e bays 2 or 6, removing the full-height server blade leaves server blades installed in device bays 2 and 6 unsupported. This might cause damage to the server blades and the enclosure connectors.
For more information For additional information, refer to the resources listed below. Resource description Web address General HP BladeSystem information http://www.hp.com/go/bladesystem/ HP BladeSystem c-Class documentation http://h71028.www7.hp.com/ente rprise/cache/3 16735-0-0-0- 121.
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