Texas InstrumentsメーカーTPS2330の使用説明書/サービス説明書
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April 2001 PMP P.
IMPORT ANT NOTICE T exas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue any product or service without notice, and advise customers to obtain the latest version of relevant information to verify , before placing orders, that information being relied on is current and complete.
How to Use This Manual iii Read This First Preface How to Use This Manual This document contains the following chapters: - Chapter 1 — Introduction - Ch.
iv.
Running Title — Attribute Reference v Contents 1 Introduction 1-1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 48-V T elecom Hot-Swap EVM 2-1 .
Running Title — Attribute Reference vi.
1-1 Introduction Fast development of telecommunications and networks has accelerated growth of products with hot-plug capability to ensure that systems are always on. Many hot-swap or hot-plug devices are already available in the worldwide market.
1-2 Introduction.
2-1 48-V T elecom Hot-Swap EVM Wi th the rapid growth of internet and telecommunications in general, more and more electronic systems are required to run continuously . Therefore, redundant systems or modules may be required to prevent the crashing of systems.
2-2 48-V T elecom Hot-Swap EVM.
3-1 Schematics of the EVM and the Interface Card The evaluation kit includes two .
3-2 Schematics of the EVM and the Interface Card Because the interface card was originally designed for universal application purposes, some of the components shown in the schematic above may not be on the board when shipped with this EVM kit. Refer to the bill of materials table for a complete component list.
3-3 Schematics of the EVM and the Interface Card Th e bills of materials (BOM) for both boards are shown in T ables 3 – 1 and 3 – 2, respectively .
3-4 Schematics of the EVM and the Interface Card C 4 and C8 on SL VP184 adjust the output turnon ramp-up rate and propagation delay time. Reducing the capacitance of C8 will increase the output ramp-up speed, and decreasing the value of C4 will reduce the output turnon delay time and increase the output ramp-up rate.
4-1 Layouts of the EVM and the Interface Card The following figures illustrate the placements of the components and the top-layer layouts for both the 48-V hot-swap EVM and the interface card respectively .
4-2 Layouts of the EVM and the Interface Card Figure 4 – 1. T op Layer of the Interface Card and Placement of the Components T op Layer T op Assembly.
4-3 Layouts of the EVM and the Interface Card Figure 4 – 2. T op Layer of the 48-V Hot-Swap EVM and Placement of Components T op Layer T op Assembly.
4-4 Layouts of the EVM and the Interface Card.
5-1 Setup of the EVM Fo r proper operation of the EVM, one 48-V power supply , and a voltage meter or an oscilloscope are required. Refer to the setup diagram in Figure 5 – 1 and follow these steps for hot plug testing: 1) V erify that the power-supply voltage is set at 48 V .
5-2 Setup of the EVM Figure 5 – 1. Evaluation Setup of the Hot-Swap Board EVM + – Power Supply 48–V , 1–A Supply Plug SL VP184 board into edge connector .
6-1 T est Points T wo test points are available on the interface card (SL VP155): TP1 – VIN1 (input voltage) TP5 – GND (ground) On the 481-V hot-swap EVM, there ar.
6-2 T est Points.
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