FujitsuメーカーIntel Xeon 5160の使用説明書/サービス説明書
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Reference Number: 313355-003 Dual-Core Intel ® Xeon ® Processor 5100 Series Datasheet August 2007.
2 Dual-Core Intel ® Xeon ® Processor 5100 Seri es Datasheet INFORMA TION IN THIS DOCUMENT IS PROVIDED IN CONNE CTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR O THERWISE, TO ANY INTELLECTUAL PROPER TY RIGHTS IS GRANTED BY THIS DOCUMENT .
Dual-Core Intel ® Xeon ® Processor 5100 Series Datasheet 3 Contents Features............. ........ ........... ........... ........ .......... ........... ........ ........... ........... ........ ........ 9 1 Introduction.......... ........... ....
4 Dual-Core Intel ® Xeon ® Processor 5100 Seri es Datasheet 6.2.2 O n-Demand Mod e ......... ........... .......... ......... .......... ......... .......... ........... .... 84 6.2.3 P ROCHOT# Signal ...... ......... .......... ........... ........
Dual-Core Intel ® Xeon ® Processor 5100 Series Datasheet 5 6-2 Dual-Core Intel® Xeon® Processor LV 5138 Nominal & Short-T erm Thermal Profile s .................. ............. .......... ........... .......... .. 77 6-3 Dual-Core Intel® Xeon® Processor LV 5148 and Dual-Core Intel® Xeon® P rocessor LV 5128 Th ermal Profile .
6 Dual-Core Intel ® Xeon ® Processor 5100 Seri es Datasheet 6-1 Dual-Core Intel® Xeon® Processor 5100 Series Thermal Specifications .................... 75 6-2 Dual-Core Intel ® Xeon ® Processor 5100 Series Thermal Profile Table ................
Dual-Core Intel ® Xeon ® Processor 5100 Series Datasheet 7 Revision History § Revision Description Date 001 Initial release June 2006 002 Updated Sections 2, 3, and 6 wi th SKUs for 5148/5138/5128 November 2006 003 Updated Sections 2, 3, and 6 wi th G-step information.
8 Dual-Core Intel ® Xeon ® Processor 5100 Seri es Datasheet.
Dual-Core Intel® Xeon® Processor 5100 Series Datasheet 9 Features Features • Dual-Core processing with Intel ® Core™ microarchitecture • FC-L GA6 package with 771 Lands • A vailable at up to 3.
Features 10 Dual-Core Intel® Xeon® Processor 5100 Series Datasheet.
Dual-Core Intel ® Xeon ® Processor 5100 Series Datasheet 11 Introduction 1 Introduction The Dual-Core Intel® Xeon® Processor 5 100 Series are 64-bit server/workstation processors utilizing two Intel microarchitect ure cores.
Introduction 12 Dual-Core Intel ® Xeon ® Processor 5100 Series Datasheet Monitor software enabling multiple, independent softw are environments inside a single platform. Further details on Intel Virtualization T echnology can be found at http:// developer .
Dual-Core Intel ® Xeon ® Processor 5100 Series Datasheet 13 Introduction • Dual-Core Intel ® Xeon ® Processor 5100 S eries – Intel 64-bit microprocessor intended for dual processor servers and workstations.
Introduction 14 Dual-Core Intel ® Xeon ® Processor 5100 Series Datasheet • Priority Agen t – The priority agent is the host bridge to the processor and is typically known as the chipset.
Dual-Core Intel ® Xeon ® Processor 5100 Series Datasheet 15 Introduction Note: Contact your Intel representativ e for th e latest revision of thes e documents.
Introduction 16 Dual-Core Intel ® Xeon ® Processor 5100 Series Datasheet.
Dual-Core Intel ® Xeon ® Processor 5100 Series Datasheet 17 Electrical Specifications 2 Electrical Specifications 2.1 Front Side Bus and GTLREF Most Dual-Core Intel ® Xe o n ® Processor 5100 Series FSB signals uses Assisted Gunning T ransceiver Logic (AGTL+) signaling technolo gy .
Electrical Specifications 18 Dual-Core Intel ® Xeon ® Processor 5100 Series Datasheet 2.3 Decoupling Guidelines Due to its large number of tr ansistors and high internal clock speeds, the Dual-Core Intel ® Xeo n ® Processor 5100 Series are capable of generating large average current swings between low and full power states.
Dual-Core Intel ® Xeon ® Processor 5100 Series Datasheet 19 Electrical Specifications The processor core frequency is configured du ring reset by using valu es stored internally during manufacturing. The stored v alue sets the highest bus fraction at which the particular processor can operate.
Electrical Specifications 20 Dual-Core Intel ® Xeon ® Processor 5100 Series Datasheet 2.4.2 PLL Power Supply An on-die PLL filter solution is imple mented on the Dual-Core Intel ® Xeo n ® Processor 5100 Series. The V CCPLL input is used for this configuration in Dual-Core Intel ® Xeo n ® Processor 5100 Series based platforms.
Dual-Core Intel ® Xeon ® Processor 5100 Series Datasheet 21 Electrical Specifications P ower source characteristics must be guar antee d to be stable whenever the supply to the voltage regulator is stable. Table 2-3. Voltage Identification Definition VID6 400 mV VID5 200 mV VID4 100 mV VID3 50 mV VID2 25 mV VID1 12.
Electrical Specifications 22 Dual-Core Intel ® Xeon ® Processor 5100 Series Datasheet Table 2-4. Voltage Identificat ion Definition Notes: 1. When the “111111” VID pattern is observed, th e voltage regulator output should be disabled. 2. Shading denotes the expected VID range of the Dual- Core Intel ® Xeo n ® Processor 5100 Series.
Dual-Core Intel ® Xeon ® Processor 5100 Series Datasheet 23 Electrical Specifications Note: The LL_ID[1:0] signals are used to select t he correct l oadline slope for the processor . Note: The MS_ID[1:0] signals are provided to indicate the Market Segment for the processor and may be used for future processor co mpatibi lity or for keying.
Electrical Specifications 24 Dual-Core Intel ® Xeon ® Processor 5100 Series Datasheet 2.7 Front Side Bus Signal Groups The FSB signals have been combined into groups by buffer type. AGTL+ input signals have differential input buffers, w hich use GTLREF_DA T A and GTLREF_ADD as reference levels.
Dual-Core Intel ® Xeon ® Processor 5100 Series Datasheet 25 Electrical Specifications Notes: 1. Refer to Se ction 5 for signal de scriptions. 2. These signals ma y be driven simu ltane ously by multiple agents ( Wired-OR). Ta b l e 2 - 9 outlines the signals which include on-die termination (R TT ).
Electrical Specifications 26 Dual-Core Intel ® Xeon ® Processor 5100 Series Datasheet accepting an input of the appropriate voltage. Similar considerations must be made for TCK, TMS , TDO , and TRST#. T wo copies of each signal may be required with each driving a different voltage level.
Dual-Core Intel ® Xeon ® Processor 5100 Series Datasheet 27 Electrical Specifications 2.10.2 Input Device Hysteresis The input buffers in both client and host models must use a Schmitt -triggered input design for improved noise immunit y . Use Figure 2-1 as a guide for input buffer design.
Electrical Specifications 28 Dual-Core Intel ® Xeon ® Processor 5100 Series Datasheet At conditions exceeding absolute maximum and minimum r atings, neither functionality nor long-term reliability can be expected.
Dual-Core Intel ® Xeon ® Processor 5100 Series Datasheet 29 Electrical Specifications 2.13 Processor DC Specifications The processor DC specificat ions in this section are defined at the processor core (pads) unless noted otherwise. See Section 4-1 for the Dual-Core Intel ® Xe o n ® Processor 5100 Series land listings and Section 5.
Electrical Specifications 30 Dual-Core Intel ® Xeon ® Processor 5100 Series Datasheet Notes: 1. Unless otherwise noted, all specifications in this ta ble apply to all pr ocessors and are based on e stimates and simulations, not empirical data. These specificat ions will be updated with characterized data from silicon measurements at a later date.
Dual-Core Intel ® Xeon ® Processor 5100 Series Datasheet 31 Electrical Specifications 14. I CC_TDC is the sustained (DC equivalent) cur rent that the processor is capa ble of drawing indefinitely and should be used for th e voltage regulat or temper ature assessment.
Electrical Specifications 32 Dual-Core Intel ® Xeon ® Processor 5100 Series Datasheet 2. Not 100% tested. Specified by design characterization. Notes: 1. Processor or V oltage Regulator thermal p rotection circ uitry should n ot trip for load currents greater than I CC_TDC .
Dual-Core Intel ® Xeon ® Processor 5100 Series Datasheet 33 Electrical Specifications 4. The load line s specify volt age limits a t the die mea sured at the VC C_DIE_SENS E and VSS_DIE _SENSE lands and the VCC_DIE_SE NSE2 and VSS_DIE_S ENSE2 lands.
Electrical Specifications 34 Dual-Core Intel ® Xeon ® Processor 5100 Series Datasheet Figure 2-6. Dual-Core Intel® Xeon® Proces sor LV 5148/513 8/5128 V CC Static and Transient Tolerance Load Lines Notes: 1. The V CC_MIN and V CC_MAX loadlines represent static and transient limits.
Dual-Core Intel ® Xeon ® Processor 5100 Series Datasheet 35 Electrical Specifications Notes: 1. Unless otherwise noted, all specifications in this table apply to all processor frequencies. 2. The V TT referred to in these specificat ions refers to instantaneous V TT .
Electrical Specifications 36 Dual-Core Intel ® Xeon ® Processor 5100 Series Datasheet Notes: 1. VOS is the measured ov ershoot v oltage. 2. TOS is the measured time duration above VID.
Dual-Core Intel ® Xeon ® Processor 5100 Series Datasheet 37 Mechanical Specifications 3 Mechanical Specifications The Dual-Core Intel ® Xe o n ® Processor 5100 Series is packaged in a Fli p Chip Land Grid Array (FC-L GA6) package that interfaces to the baseboard via a LGA771 sock et.
Mechanical Specifications 38 Dual-Core Intel ® Xeon ® Processor 5100 Series Datasheet Note: Guidelines on potential IHS flatne ss v ariation with socket load p late actuation and installation of the cooling solution is available in the processor Thermal/Me ch anical Design Guidelines.
Dual-Core Intel ® Xeon ® Processor 5100 Series Datasheet 39 Mechanical Specifications Figure 3-3. Processor Package Drawing (Sheet 2 of 3).
Mechanical Specifications 40 Dual-Core Intel ® Xeon ® Processor 5100 Series Datasheet Figure 3-4. Processor Packag e Drawin g (Sheet 3 of 3).
Dual-Core Intel ® Xeon ® Processor 5100 Series Datasheet 41 Mechanical Specifications 3.2 Processor Component Keepout Zones The processor may contain components on the substrate that define component keepout zone requirements. A thermal and mech anical solution design must not intrude into the required keepout zones.
Mechanical Specifications 42 Dual-Core Intel ® Xeon ® Processor 5100 Series Datasheet 9. Refer to the Dual-Core In tel ® Xeo n ® Processor 5100 Series Thermal/Mechanical Design Guidelines or Dual-.
Dual-Core Intel ® Xeon ® Processor 5100 Series Datasheet 43 Mechanical Specifications 3.7 Processor Materials The Dual-Core Intel ® Xe o n ® Processor 5100 Series is assembled from several components. The basic material properties are descri bed in Ta b l e 3 - 3 .
Mechanical Specifications 44 Dual-Core Intel ® Xeon ® Processor 5100 Series Datasheet § Figure 3-6. Processor Land Coordinates, Bottom View V TT / Clocks 1 2 3 4 5 6 7 8 9 1 01 11 2 1 31 41 5 1 61 .
Dual-Core Intel ® Xeon ® Processor 5100 Series Datasheet 45 4 Land Listing 4.1 Dual-Core Intel ® Xeon ® Processor 5100 Series Pin Assignments This section provides sorted land list in Ta b l e 4 - 1 and Ta b l e 4 - 2 . Ta b l e 4 - 1 is a listing of all processor lands ordered alphabetically by land name.
Land Listing 46 Dual-Core Intel ® Xeon ® Processor 5100 Series Datasheet BSEL2 G30 Power/Other Output D00# B4 Sourc e Sync Input/Output D01# C5 Source Sync Input/Output D02# A4 Source Sync Input/Out.
Dual-Core Intel ® Xeon ® Processor 5100 Series Datasheet 47 Land Listing DSTBN3# A16 Source Sync Input/Output DSTBP0# B9 Source Sync Input/Output DSTBP1# E12 Source Sync Input/Output DSTBP2# G19 Sou.
Land Listing 48 Dual-Core Intel ® Xeon ® Processor 5100 Series Datasheet RS0# B3 Common Clk Input RS1# F5 Common Clk Input RS2# A3 Common Clk Input RSP# H4 Common Clk Input SKTOCC # AE8 P ower/Other.
Dual-Core Intel ® Xeon ® Processor 5100 Series Datasheet 49 Land Listing VCC AG 30 Power/O ther VCC AG 8 Power/Other VCC AG 9 Power/Other VCC AH 11 Power/Other VCC AH 12 Power/Other VCC AH 14 Power/.
Land Listing 50 Dual-Core Intel ® Xeon ® Processor 5100 Series Datasheet VCC AN8 Power/Other VCC AN9 Power/Other VCC J10 Power/ Other VCC J11 Power/ Other VCC J12 Power/ Other VCC J13 Power/ Other V.
Dual-Core Intel ® Xeon ® Processor 5100 Series Datasheet 51 Land Listing VCC W 8 Power/Other VCC Y23 P o wer/Other VCC Y24 P o wer/Other VCC Y25 P o wer/Other VCC Y26 P o wer/Other VCC Y27 P o wer/O.
Land Listing 52 Dual-Core Intel ® Xeon ® Processor 5100 Series Datasheet VSS AF29 Pow er/Other VSS AF3 Power/Other VSS AF30 Pow er/Other VSS AF6 Power/Other VSS AF7 Power/Other VSS AG10 Power/Oth er.
Dual-Core Intel ® Xeon ® Processor 5100 Series Datasheet 53 Land Listing VSS AN23 Power/Other VSS AN24 Power/Other VSS B1 Power/Other VSS B11 Power /Other VSS B14 Power /Other VSS B17 Power /Other V.
Land Listing 54 Dual-Core Intel ® Xeon ® Processor 5100 Series Datasheet VSS L28 Power/Other VSS L29 Power/Other VSS L3 Power/Oth er VSS L30 Power/Other VSS L6 Power/Oth er VSS L7 Power/Oth er VSS M.
Dual-Core Intel ® Xeon ® Processor 5100 Series Datasheet 55 Land Listing 4.1.2 Land Listing by Land Number Table 4-2. Land Listin g by Land Number (Sheet 1 of 20) Pin No.
Land Listing 56 Dual-Core Intel ® Xeon ® Processor 5100 Series Datasheet AD25 VCC P ower/Other AD26 VCC P ower/Other AD27 VCC P ower/Other AD28 VCC P ower/Other AD29 VCC P ower/Other AD3 BINIT# Comm.
Dual-Core Intel ® Xeon ® Processor 5100 Series Datasheet 57 Land Listing AG17 VSS Power/Other AG18 VCC Power/Other AG19 VCC Power/Other AG2 BPM3# Common Clk Input/Output AG20 VSS Power/Other AG21 VC.
Land Listing 58 Dual-Core Intel ® Xeon ® Processor 5100 Series Datasheet AJ8 VCC Pow er/Other AJ9 VCC Pow er/Other AK1 RESERVED AK10 VSS Power/O ther AK11 VCC Power/Other AK12 VCC Power/Other AK13 V.
Dual-Core Intel ® Xeon ® Processor 5100 Series Datasheet 59 Land Listing AM26 VCC Power/Other AM27 VSS Power/Other AM28 VSS Power/Other AM29 VCC Power/Other AM3 V ID2 Power/Other Output AM30 VCC Pow.
Land Listing 60 Dual-Core Intel ® Xeon ® Processor 5100 Series Datasheet C20 DBI3# So urce Sync Input/Output C21 D58# Source Sync Input/Output C22 VSS Power/Other C23 RESERV ED C24 VSS Power/Other C.
Dual-Core Intel ® Xeon ® Processor 5100 Series Datasheet 61 Land Listing F11 D23# Source S ync Input/Output F12 D24# Source S ync Input/Output F13 VSS Power/Other F14 D28# Source S ync Input/Output .
Land Listing 62 Dual-Core Intel ® Xeon ® Processor 5100 Series Datasheet H3 VSS Power/Other H30 BSEL1 Power/Other Output H4 RSP# Common Clk Inpu t H5 BR1# Common Clk Input H6 VSS Power/Other H7 VSS .
Dual-Core Intel ® Xeon ® Processor 5100 Series Datasheet 63 Land Listing M30 VCC Power/Other M4 A07# Source Sync Input/Output M5 A03# Source Sync Input/Output M6 REQ2# Source Sync Input/Output M7 V .
Land Listing 64 Dual-Core Intel ® Xeon ® Processor 5100 Series Datasheet § U30 VCC Po wer/Other U4 A13# Source Sync Input /Output U5 A12# Source Sync Input /Output U6 A10# Source Sync Input /Output.
Dual-Core Intel ® Xeon ® Processor 5100 Series Datasheet 65 Signal Definitions 5 Signal Definitions 5.1 Signal Definitions Table 5-1. Signal Definitions (Sheet 1 of 7) Name Type Description Notes A[35:3]# I/O A [35:3]# (Address) define a 2 36 -byte physical memory address space.
Signal Definitions 66 Dual-Core Intel ® Xeon ® Processor 5100 Series Datasheet BINIT# I/O BINIT# (Bus Initialization) may be obse rved and driven by all processor FSB agents and if used, must c onnect the approp riate pins of all s uch agents.
Dual-Core Intel ® Xeon ® Processor 5100 Series Datasheet 67 Signal Definitions D[63:0]# I/O D[63:0]# (Data) are the data signals. These signals provide a 64-bit data path between the processor FSB agents, and must connect the app ropriate pins on all such agents.
Signal Definitions 68 Dual-Core Intel ® Xeon ® Processor 5100 Series Datasheet DSTBN[3:0]# I/O Data strobe used to latch in D[63:0]#. 3 DSTBP[3:0]# I/O Data strobe used to latch in D[63:0]#. 3 FERR#/PBE# O FERR#/PBE# (floating-po int e rror/pending break ev ent) is a multipl exed signal and its meaning is qualified by STPCLK#.
Dual-Core Intel ® Xeon ® Processor 5100 Series Datasheet 69 Signal Definitions INIT# I INIT# (Initialization), when asserted, re sets integer register s inside all processo rs without affecting their internal caches or fl oating-point re gisters.
Signal Definitions 70 Dual-Core Intel ® Xeon ® Processor 5100 Series Datasheet REQ[4:0]# I/O REQ[4:0]# (Req uest Command) must connec t the appropriate pins of all processor FSB agents. T hey are asserted by the curren t bus owner to define the cu rrently active transact ion type.
Dual-Core Intel ® Xeon ® Processor 5100 Series Datasheet 71 Signal Definitions Notes: 1. For this pr ocessor land on the Dua l-Core Intel ® Xe on ® Proce ssor 5100 Se ries , the maximu m number of symme tric agen ts is one. Maximum number of priority agents is z ero.
Signal Definitions 72 Dual-Core Intel ® Xeon ® Processor 5100 Series Datasheet.
Dual-Core Intel ® Xeon ® Processor 5100 Series Datasheet 73 Thermal Specifications 6 Thermal Specifications 6.1 Package Thermal Specifications The Dual-Core Intel® Xeon® Processor 5100 Series requires a thermal solution to maintain temperatures within its oper ating limits.
Thermal Specifications 74 Dual-Core Intel ® Xeon ® Processor 5100 Series Datasheet applications. Refer to the Dual-Core Intel ® Xeo n ® Processor 5100 Series Thermal/ Mechanical Design Guidelines for de tails on system thermal solution design, thermal profiles and environmental considerations.
Dual-Core Intel ® Xeon ® Processor 5100 Series Datasheet 75 Thermal Specifications The upper point of the thermal profile cons ists of the Thermal Design P ower (TDP) defined in Ta b l e 6 - 8 and the associated T CASE value.
Thermal Specifications 76 Dual-Core Intel ® Xeon ® Processor 5100 Series Datasheet Notes: 1. Please refer to Ta b l e 6 - 2 for discrete points that constitute the thermal profile. 2. Refer to the Dual-Core In tel ® Xeo n ® Processor 5100 Series Thermal/Mechanical Design Guidelines for system and environmental implementation details.
Dual-Core Intel ® Xeon ® Processor 5100 Series Datasheet 77 Thermal Specifications Notes: 1. These values are specified at V CC_MAX for all processor frequencies. S ystems must be designed to ensure the process or is not to be subject ed to any static V CC and I CC combination wherein V CC exceeds V CC_MAX at specified I CC .
Thermal Specifications 78 Dual-Core Intel ® Xeon ® Processor 5100 Series Datasheet Notes: 1. These values are spec ified at V CC_MA X for all processor frequencies. Syst ems must be designed to en sure the processor is not to be subjected to any static V CC and I CC combination wherein V CC exceeds V CC_MAX at specified I CC .
Dual-Core Intel ® Xeon ® Processor 5100 Series Datasheet 79 Thermal Specifications Notes: 1. Please refer to Ta b l e 6 - 7 for discrete points that constitute the thermal profile. 2. Refer to th e Dual-Core Intel ® Xe on ® Processor 5100 Series Thermal/Mechanical Design Guidelines for system and environme ntal implementation details.
Thermal Specifications 80 Dual-Core Intel ® Xeon ® Processor 5100 Series Datasheet 5. FMB, or Flexib le Motherboard, guidelines pr ovide a design target for mee ting all plan ned processo r frequency requiremen ts 6. These values only apply to the B-step of the Du al-Core Intel® X eon® Processor 5160.
Dual-Core Intel ® Xeon ® Processor 5100 Series Datasheet 81 Thermal Specifications 6.1.2 Thermal Metrology The minimum and maximum case temper atures (T CASE ) are specified in Ta b l e 6 - 2 , Ta b.
Thermal Specifications 82 Dual-Core Intel ® Xeon ® Processor 5100 Series Datasheet Note: Figure is not to scale and is for reference only . 6.2 Processor Thermal Features 6.
Dual-Core Intel ® Xeon ® Processor 5100 Series Datasheet 83 Thermal Specifications When the Thermal Monitor is enabled, and a high temperature situation exists (that is, TCC is activ e), the clocks will be modulated by alternately turning the clocks off and on at a duty cycle specific to the processor (t ypically 30 - 50%).
Thermal Specifications 84 Dual-Core Intel ® Xeon ® Processor 5100 Series Datasheet The second operating po int consists of both a lower oper ating frequency and voltage. The lowest operating frequency is determined by the lowest supported bus r atio (1/6 for the Dual-Core Intel ® Xe o n ® Processor 5100 Series ).
Dual-Core Intel ® Xeon ® Processor 5100 Series Datasheet 85 Thermal Specifications If bit 4 of the IA32_CLOCK_MODULA TION MS R is set to a ‘1’ , the processor will immediately reduce its power consumption via modulation (starting and stopping) of the internal core clock, independent of t he processor temperature.
Thermal Specifications 86 Dual-Core Intel ® Xeon ® Processor 5100 Series Datasheet 6.2.5 THERMTRIP# Signal Regardless of whether or not Thermal Monitor or Thermal Monitor 2 is enabled, in the event .
Dual-Core Intel ® Xeon ® Processor 5100 Series Datasheet 87 Thermal Specifications 6.3.1.1 Key Difference with Lega cy Diode-Based Thermal Management F an speed control solutions utilize a TControl v alue stored in the processor IA32_TEMPERA TURE_T ARGET MSR.
Thermal Specifications 88 Dual-Core Intel ® Xeon ® Processor 5100 Series Datasheet 6.3.1.2 Pro cessor Thermal Data Sample Rate and Filtering The DT S provides an improv ed capability to monitor device hot spots, which inherently leads to more varying temper ature readings over sh ort time intervals.
Dual-Core Intel ® Xeon ® Processor 5100 Series Datasheet 89 Thermal Specifications 6.3.2.3 PECI Fault Handling Requirements PECI is largely a fault tolerant interface, including noise immunit y and error checking improvements over other compar able industry standard interfaces.
Thermal Specifications 90 Dual-Core Intel ® Xeon ® Processor 5100 Series Datasheet.
Dual-Core Intel ® Xeon ® Processor 5100 Series Datasheet 91 Features 7 Features 7.1 Power-On Configuration Options Several configur ation options can be conf igured by hardware. The Dual-Core Intel ® Xe o n ® Processor 5100 Series samples its hardware configuration at reset, on the active-to-inactive tr ansition of RESET#.
Features 92 Dual-Core Intel ® Xeon ® Processor 5100 Series Datasheet 7.2.1 Normal State This is the normal operating state for the processor . 7.2.2 HALT or Extended HALT State The Extended HAL T state (C1E) is enabled via the BIOS. The Extended HALT state must be enabled for the process or to remain within its specifications.
Dual-Core Intel ® Xeon ® Processor 5100 Series Datasheet 93 Features Note: 1. The specification is at T c ase = 50 o C and nominal Vcc. The V ID setting represen ts the maximum expected VID when runnin g in HAL T state.
Features 94 Dual-Core Intel ® Xeon ® Processor 5100 Series Datasheet 7.2.3 Stop-Grant State When the STPCLK# pin is asserted, the Stop-Grant state of the processor is entered 20 bus clocks after the response phase of th e processor issued Stop Gr ant Acknowledge special bus cycle.
Dual-Core Intel ® Xeon ® Processor 5100 Series Datasheet 95 Features While in the Stop-Grant state, SMI#, INIT#, BINIT# and LINT[1:0] will be latched by the processor , and only serviced when the pr ocessor returns to the Normal state. Only one occurrence of each ev ent will be recognized upon return to the Normal state.
Features 96 Dual-Core Intel ® Xeon ® Processor 5100 Series Datasheet Enhance d Intel SpeedS tep ® T echnology creates processor performance states (P- states) or voltage/frequency oper ating points. P-states are lower power capability states within the Normal state as shown in Figure 7-1 .
Dual-Core Intel ® Xeon ® Processor 5100 Series Datasheet 97 Boxed Processor Specifications 8 Boxed Processor Specifications 8.1 Introduction Intel box ed processors are intended for system integr ators who build systems from components av ailable through distribution channels.
Boxed Processor Specifications 98 Dual-Core Intel ® Xeon ® Processor 5100 Series Datasheet Notes: 1. The heat sinks repres ented in these images are for reference only , and may not represent the final box ed processor heat sink s. 2. The screws, springs, and stand offs will be captiv e to the heat si nk.
Dual-Core Intel ® Xeon ® Processor 5100 Series Datasheet 99 Boxed Processor Specifications 8.2 Mechanical Specifications This section documents the mechanical specifications of the box ed processor . 8.2.1 Boxed Processor Heat Sink Dimensions (CEK) The boxed processor will be shipped with an unattached thermal solution.
Boxed Processor Specifications 100 Dual-Core Intel ® Xeon ® Processor 5100 Series Datasheet Figure 8-4. Top Si de Board Keepout Zones (Part 1).
Dual-Core Intel ® Xeon ® Processor 5100 Series Datasheet 101 Boxed Processor Specifications Figure 8-5. Top Side Board Keepout Zones (Part 2).
Boxed Processor Specifications 102 Dual-Core Intel ® Xeon ® Processor 5100 Series Datasheet Figure 8-6. Bottom Side Board Keepout Zones.
Dual-Core Intel ® Xeon ® Processor 5100 Series Datasheet 103 Boxed Processor Specifications Figure 8-7. Board Moun ting-Hole Keepout Zones.
Boxed Processor Specifications 104 Dual-Core Intel ® Xeon ® Processor 5100 Series Datasheet Figure 8-8. Volumetric Height Keep-Ins.
Dual-Core Intel ® Xeon ® Processor 5100 Series Datasheet 105 Boxed Processor Specifications Figure 8-9. 4-Pin F an Cable Connec tor (For Active CEK Heat Sink).
Boxed Processor Specifications 106 Dual-Core Intel ® Xeon ® Processor 5100 Series Datasheet Figure 8-10. 4-Pi n Base Board Fan Header (F or Active CEK Heat Sink).
Dual-Core Intel ® Xeon ® Processor 5100 Series Datasheet 107 Boxed Processor Specifications 8.2.2 Boxed Processo r Heat Sink Weight 8.2.2.1 Thermal Solution Weight The 1U passive/3U+ active combination heat sink solution and the 2U passive heat sink solution will not exceed a mass of 1050 grams.
Boxed Processor Specifications 108 Dual-Core Intel ® Xeon ® Processor 5100 Series Datasheet The fan power header on the baseboard must be positioned to allow the fan heat sink power cable to reach it. The fan power head er identification and location must be documented in the suppliers platform documentation, or on the baseboard itself .
Dual-Core Intel ® Xeon ® Processor 5100 Series Datasheet 109 Boxed Processor Specifications 8.3.2.1 1U Passive/3U+ Active Combinat ion Hea t Sink Solution (1U Rack Passive) In the 1U configuration it is assumed that a chassis duct will be implemented to pro vide a minimum airflow of 15 cf m at 0.
Boxed Processor Specifications 110 Dual-Core Intel ® Xeon ® Processor 5100 Series Datasheet The other items listed in Figure 8-3 that are required to compete this solution will be shipped with either the chassis or boards.
Dual-Core Intel ® Xeon ® Processor 5100 Series Datasheet 111 Debug Tools Specifications 9 Debug Tools Specifications Please refer to the Debug Port Design Guide for UP/DP Systems and the appropriate platform design guidelines for information regarding debug tool specifications.
Debug Tools Specifications 112 Dual-Core Intel ® Xeon ® Processor 5100 Series Datasheet 9.3.1 Mechanical Considerations The LAI is installed between the processor so cket and the pro cessor . The LAI plugs into the socket, while the processor plugs into a socket on th e LAI.
デバイスFujitsu Intel Xeon 5160の購入後に(又は購入する前であっても)重要なポイントは、説明書をよく読むことです。その単純な理由はいくつかあります:
Fujitsu Intel Xeon 5160をまだ購入していないなら、この製品の基本情報を理解する良い機会です。まずは上にある説明書の最初のページをご覧ください。そこにはFujitsu Intel Xeon 5160の技術情報の概要が記載されているはずです。デバイスがあなたのニーズを満たすかどうかは、ここで確認しましょう。Fujitsu Intel Xeon 5160の取扱説明書の次のページをよく読むことにより、製品の全機能やその取り扱いに関する情報を知ることができます。Fujitsu Intel Xeon 5160で得られた情報は、きっとあなたの購入の決断を手助けしてくれることでしょう。
Fujitsu Intel Xeon 5160を既にお持ちだが、まだ読んでいない場合は、上記の理由によりそれを行うべきです。そうすることにより機能を適切に使用しているか、又はFujitsu Intel Xeon 5160の不適切な取り扱いによりその寿命を短くする危険を犯していないかどうかを知ることができます。
ですが、ユーザガイドが果たす重要な役割の一つは、Fujitsu Intel Xeon 5160に関する問題の解決を支援することです。そこにはほとんどの場合、トラブルシューティング、すなわちFujitsu Intel Xeon 5160デバイスで最もよく起こりうる故障・不良とそれらの対処法についてのアドバイスを見つけることができるはずです。たとえ問題を解決できなかった場合でも、説明書にはカスタマー・サービスセンター又は最寄りのサービスセンターへの問い合わせ先等、次の対処法についての指示があるはずです。