Hitachi Koki USAメーカーBE-IR30 / 31の使用説明書/サービス説明書
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Please read this operation Guide carefully for proper operation, and keep it for future refernce. B E-IR30 / 31 Infrared B/W Camera Module Operation Guide.
Table of Contents BE-I R30 / 31 1 1. Intr oduction ・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・ 2 2. General ・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・ 2 3.
1. Introducti on BE-I R30 / 31 2 Thank you v ery much for your purchase of the Hitachi BE-IR30/31 Black and W hite Camera Module. Prior to using this camera , read this manual carefully. 2 . G e n e r a l The BE-IR30/31 is a monochrom e camera module featuring sensitiv ity in the near infrared spectrum using a 1/3- inch size CCD imaging dev ice.
4 . . . . Specif ications BE-I R30 / 31 3 2) Sensing area EIA : 6.00(H) × 4.96(V)mm CCIR : 6.00( H) × 4.96(V)mm 3) Signal format Conforming to EIA or CCIR. 4) Scanning system 2:1 interlaced 5) Hor. scanning frequency EIA : 15.734 kH z CCIR : 15.
4 . . . . Specif ications BE-I R30 / 31 4 21) St andard lens f3.8 (BE-IR30B/31B only) Focal distance f 3.8 mm F value 2.0 H 70.9 Picture angle V 52.
5. Notes to users BE-I R30 / 31 5 Power supply z Connect a 9V DC volt age (8. 5 t o 9. 5V) from an external regulat ed DC pow er supply . z Use a stable power supply w it hout ripple and noise.
5. Notes to users BE-I R30 / 31 6 Phenomena inherent to CCD imaging dev ice Following are phenomena inherent t o a CCD imaging dev ice , and not defect s . z Smear and blooming W hen strong light (lamp , fluorescent lamp , refl ected light , etc.) is shot , pale bands are displayed v ert ically above and below the light.
6. External view BE-I R30 / 31 7 BE-IR30B/31B.
6. External view BE-I R30 / 31 8 BE-IR30C/31C.
6. External view BE-I R30 / 31 9 Lens 19.2 ± 0.5 (C-mount) 1.4 ± 0.2 CCD Base plate Imaging face Lens-mount Extension of optical path due to the thicknes s of CCD glas s is considered.
8. Installation BE-I R30 / 31 10 W hen installing the camera in a housing or unit of equipment, secure with t wo M2 screws inserted into the 2. 5 mm diameters holes of the SENS board base plate. 1. Use the SENS board holds to install the camera. Avoid using only the Main board, due to risk of damage to the board connector.
9. Typical connection BE-I R30 / 31 11 BE-IR30 Image processor or Video monitor Regulated power supply (More then 300 mA) Note1 : • When more than one video monitor is connected in series , set the 75 Ω termination sw itch on the last unit to ON. Note2 : • Supply voltage range : 8.
9. Typical connection BE-I R30 / 31 12 BE-IR31 Image processor or Video monitor Regulated power supply (More then 300 mA) Note1 : • When more than one video monitor is connected in series , set the 75 Ω termination sw itch on the last unit to ON. Note2 : • Supply voltage range : 8.
10. External sync (BE-IR31) BE-I R30 / 31 13 Supply sync signals (HD and VD) for BE-IR31 operation. Refer to connection on page 12. z Horizontal and vertical drive signal inputs HD EIA: f(H) = 15.734 kHz ± 1 % VD EIA: f(V) = 59.94 Hz (f(V) = f( H) ÷ 262.
11. Function setting and changes BE-I R30 / 31 14 W hen changing the function settings , perform the w ork with thorough care. Be sure to use anti-static measures such as a grounding band. Also observ e safety precautions when soldering to avoid burn and fire hazards.
11. Function setting and changes BE-I R30 / 31 15 11-2 Gamma response The factory setting is gamma on. If necessary , the gamma response can be changed as follows.
11. Function setting and changes BE-I R30 / 31 16 11-3 Auto electronic shutter on / off Factory sett ing for auto elect ronic shut t er is off. If necessary , it can be set to on. Absent the R259 , R260 chip t o set t he aut o elect r onic shut t er to on.
11. Function setting and changes BE-I R30 / 31 17 11-4 Changes to fixed shutter mode The fixed shutter mode can be changed by replacing the chip parts indicat ed below .
11. Function setting and changes BE-I R30 / 31 18 11-5 BE-IR30 external sync The BE-IR30 factory sett ing is for internal sync. If required, this can be changed to external sync by changing chip part s. Change the following chip parts for external sync operat ion.
11. Function setting and changes BE-I R30 / 31 19 11-6 BE-IR31 internal sync The BE-IR31 factory sett ing is for external sync. If required, this can be changed to internal sync by changing chip part s. Change the following chip parts for internal sy nc operat ion.
11. Function setting and changes BE-I R30 / 31 20 11-7 HD and VD output (BE-IR30 only) The BE-IR30 can be provided with horizontal and vert ical drive outputs by changing chip parts.
12. Opt ions BE-I R30 / 31 21 LA-IR20 Mount adapter dimensions Remove c-mount attachment to use as cs-mount..
12. Options BE-I R30 / 31 22 BE-IR30A/31A and LA-IR 20 combined dimensions.
12. Options BE-I R30 / 31 23 BE-IR30C/31C and CS mount adapter (opti on) combined dimensions.
BE-I R30 / 31 24 Spectral sensitivity (t ypical example) 1 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 400 500 600 700 800 900 1000 Relative sensitivity W avelength( nm).
BE-I R30 / 31 25 Caution The s pecifications of this equipm ent are subj ect to change without notice for im provem ent. Prior to placing your order , be sur e to confirm that these spec ifications are the latest ones.
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