HPメーカーnx6130の使用説明書/サービス説明書
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Main tenan ce and Ser vice Gu id e HP C om paq nx613 0 Noteboo k P C Doc ument P art Number: 3 9 6 3 2 6 -001 June 200 5 This guide is a troubleshooting reference used for maintaining and servicing the notebook.
© Copyright 2005 He wlett-P ackard Dev elopment Compan y , L.P . Microsoft and W indows are U.S. re gistered trademarks of Microsoft Corporation. Intel, Pentium, and Celeron are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries.
Maintenance and S ervi ce Guide iii Cont e nt s 1 Product Description 1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–2 1.2 Resetting the Notebook . . . . . . . . . . . . . . . . . . . . . . . 1–4 1.3 Power Management .
i v Maintenance and S ervi ce Guide Cont en ts 4 Illustrated Parts Catalog 4.1 Serial Number Location . . . . . . . . . . . . . . . . . . . . . . 4–1 4.2 Notebook Major Components . . . . . . . . . . . . . . . . . . 4–2 4.3 Miscellaneous Plastics Kit .
Cont en ts Maintenance and S ervi ce Guide v 6.7 External Memory Module . . . . . . . . . . . . . . . . . . . . 6–12 6.8 Mini PCI Communications Card . . . . . . . . . . . . . . . 6–14 6.9 Optical Drive . . . . . . . . . . . . . . . . . . . . . . .
v i Maintenance and S ervi ce Guide Cont en ts A Connector Pin Assignments B Power Cord Set Requirements C Screw Listing Index.
Maintenance and S ervi ce Guide 1–1 1 Pr oduc t D esc ription The HP Compaq nx6130 Notebook PC of fers adv anced modularity , Intel® Pentium® M and Celeron® M processors, and extensi ve multimedia support.
1–2 Maintenance and Serv ice Gui de Product D escr ipt ion 1.1 F e a t u r e s ■ The follo wing processors are a v ailable, v arying b y notebook model: ❏ Intel Pentium M 2.13-, 2.00-, 1.86-, 1.73-, 1.60-, or 1.30-GHz processor , ❏ Intel Celeron M 1.
Product D escr ipt ion Maintenance and S ervi ce Guide 1–3 ■ Integrated wireless support for Mini PCI IEEE 802.11b/g or 802.11a/b/g WLAN de vice ■ Support for one or two T ype II PC Card slots, .
1–4 Maintenance and Serv ice Gui de Product D escr ipt ion ■ Connectors: ❏ Audio-out (headphone) ❏ Audio-in (microphone) ❏ Uni versal Serial Bus (USB) v .
Product D escr ipt ion Maintenance and S ervi ce Guide 1–5 3. W ait approximately 5 minutes. 4. Replace the R TC battery and reassemble the notebook. 5. Connect A C power to the notebook. Do not reinsert an y battery packs at this time. 6. T urn on the notebook.
1–6 Maintenance and Serv ice Gui de Product D escr ipt ion 1 .4 Exter nal C om ponents The external components on the front of the notebook are sho wn belo w and described in T able 1-1.
Product D escr ipt ion Maintenance and S ervi ce Guide 1–7 6 Batter y light ■ Amber : A batter y pac k is charging. ■ Green: A batter y pack is close to full charge capacity . ■ Blinking amber : A batter y pac k that is the only a vailab l e po wer source has reached a low-battery condition.
1–8 Maintenance and Serv ice Gui de Product D escr ipt ion The external components on the right side of the notebook are sho wn belo w and described in T able 1-2.
Product D escr ipt ion Maintenance and S ervi ce Guide 1–9 Ta b l e 1 - 2 Right-Side Components Item Component Function 1A u d i o - o u t (headphone) jack Connects optional headphones or pow ered stereo speake rs. Also connects the audio function of an audio/v ideo de vice such as a tele vision or VCR.
1–10 Maintenance and Serv ice Gui de Product D escr ipt ion The external components on the left side of the notebook are sho wn belo w and described in T able 1-3. Left -Side Components Ta b l e 1 - 3 Left-Side Components Item Component Function 1 USB por ts (2) Connect USB 1.
Product D escr ipt ion Maintenance and S ervi ce Guide 1–11 3 Exhaust v ent Pro vides airflow to cool internal components. Ä T o pre vent ov erheating, do not obstruct vents . Do not allow a hard surf ace, such as a printer , or a soft surf ace, such as pillo ws , thick rugs, or clothing, to bloc k airflow .
1–12 Maintenance and Serv ice Gui de Product D escr ipt ion The external components on the rear panel of the notebook are sho wn belo w and described in T able 1-4.
Product D escr ipt ion Maintenance and S ervi ce Guide 1–13 T able 1-4 Rear P anel Components Item Component Function 1 Security cable slot Attaches an op tional security cable to the notebook. Ä Security solutions are designed to act as deterrents.
1–14 Maintenance and Serv ice Gui de Product D escr ipt ion The standard ke yboard components of the notebook are sho wn belo w and described in T able 1-5.
Product D escr ipt ion Maintenance and S ervi ce Guide 1–15 T able 1-5 Standar d Ke yboar d Components Item Component Function 1 f1 to f12 ke ys (12) P erform system and application tasks. When combined with the fn key , seve ra l ke ys and b uttons perf or m additional tasks as hotk eys .
1–16 Maintenance and Serv ice Gui de Product D escr ipt ion The notebook top components are sho wn belo w and described in T able 1-6. T op C omponents , P ar t 1 T able 1-6 T op Components, P ar t 1 Item Component Function 1 P ower/standb y b utton When the notebook is: ■ Off , press to turn on the notebook.
Product D escr ipt ion Maintenance and S ervi ce Guide 1–17 2 Displa y lid s witch ■ If the notebook is closed while on, tur ns off the displa y . ■ If the notebook is opened while in standby , turns on the notebook (resumes from standby). 3 Inf o Center b utton Launches Inf o Center .
1–18 Maintenance and Serv ice Gui de Product D escr ipt ion The notebook top components are continued belo w and described in T able 1-7. T op C omponents , P ar t 2.
Product D escr ipt ion Maintenance and S ervi ce Guide 1–19 T able 1-7 T op Components, P ar t 2 Item Component Function 1 V olume mute bu tton Mutes or restores system volume . 2 V olume down b utton Decreases system v olume. 3 V olume up button Increases system v olume.
1–20 Maintenance and Serv ice Gui de Product D escr ipt ion The external components on the bottom of the notebook are sho wn belo w and described in T able 1-8. Bot tom Component s Ta b l e 1 - 8 Bottom Components Item Component Function 1 Pr imary batter y bay Holds the primar y batter y pack.
Product D escr ipt ion Maintenance and S ervi ce Guide 1–21 4 Memor y module compar tment Mini PCI compar tment Contains 1 memor y sl ot that suppor ts a replaceable memory module.
1–2 2 Maintenance and Serv ice Gui de Product D escr ipt ion 1. 5 D e s i g n O v e r v i e w This section presents a design ov ervie w of key parts and features of the notebook. Refer to Chapter 4, “Illustrated Pa rts Catalog, ” to identify replacement parts, and Chapter 6, “Remo v al and Replacement Procedures, ” for disassembly steps.
Maintenance and S ervi ce Guide 2–1 2 T r oubl eshooting Å W ARN ING: Only author iz ed techni c ians tr ained by HP should r epair this equipmen t . All tr ouble shooting and r epair pr ocedur es ar e detailed to allo w onl y subass embly-/module-lev el r epair .
2–2 Maintenance and Serv ice Gui de T r oublesh ooting Acce ssing Compute r Set up The information and settings in Computer Setup are accessed from the File, Security , T ools, and Adv anced menus. 1. Open Computer Setup by turning on or restarting the notebook.
T r oubleshooting Maintenance and S ervi ce Guide 2–3 4. T o confirm the restoration, press f10 . 5. Select File > Sa ve changes and exit , and then follo w the instructions on the screen. When the computer restarts, the factory settings are restored, and any identif ication information you hav e entered is sa ved.
2–4 Maintenance and Serv ice Gui de T r oublesh ooting Selec ting fr om t he Securit y Menu Ta b l e 2 - 2 Security Menu Select T o Do This Administrator pass word Enter , change , or delete an HP Administrator pass word. P ower-on pass word Enter , change , or delete a power-on pass word.
T r oubleshooting Maintenance and S ervi ce Guide 2–5 Selec ting fr om t he T ools Menu Ta b l e 2 - 3 To o l s M e n u Select T o Do This HDD Self T est options Run a quick or comprehensiv e self-test on any hard drive in the system. Batter y Inf or mation Vie w inf or matio n about an y batter y packs in the notebook.
2–6 Maintenance and Serv ice Gui de T r oublesh ooting Selec ting from th e Ad v an ced Menu Ta b l e 2 - 4 Adv anced Menu Select T o Do This Language (or press f2 ) Change the Computer Setup language. Boot options ■ Enable/Disable MultiBoot, which sets a startup sequence that can include most bootable devices and media in the system.
T r oubleshooting Maintenance and S ervi ce Guide 2–7 2.2 T roubl eshooting Flo wc har ts Ta b l e 2 - 5 T roubleshooting Flo wchar ts Overview Flowchart Description 2.1 “Flowchar t 2.1—Initial T roubleshooting” 2.2 “Flowchar t 2.2—No P owe r , P ar t 1” 2.
2–8 Maintenance and Serv ice Gui de T r oublesh ooting Flowchart Description 2.14 “Flowchar t 2.14—No OS Loading, Optical Drive” 2.15 “Flowchar t 2.15—No A udio , P ar t 1” 2.16 “Flowchar t 2.16—No A udio , P ar t 2” 2.17 “Flowchar t 2.
T r oubleshooting Maintenance and S ervi ce Guide 2–9 Flo wc h art 2. 1—Initi al T roubl eshooting Connecting to network or modem? Begin troubleshooting. Is there power? Is the OS loading? Is there video? (no boot) Is there sound? Beeps, LEDs, or error messages? Keyboard/ pointing device work- ing? Go to “Flowchart 2.
2–10 Maintenance and Serv ice Gui de T r oublesh ooting Flo wc h art 2.2—N o P o w er , P ar t 1 1. Reseat the power cables in the docking device and at the AC outlet. 2. Ensure the AC power source is active. 3. Ensure that the power strip is working.
T r oubleshooting Maintenance and S ervi ce Guide 2–11 Flo wc h art 2.3—No P o w er , P ar t 2 Continued from “Flowchart 2.2—No Po we r , Par t 1 . ” Visually check for debris in batter y socket and cl ean if necessary . Done N Y Po we r o n ? Check batter y by recharging it, moving it to another notebook, or replacing it.
2–12 Maintenance and Serv ice Gui de T r oublesh ooting Flo wc h art 2.4—N o P o w er , P ar t 3 Continued from “Flowchart 2.3—No Po we r , Par t 2 .” Reseat AC adapter in notebook and at po wer sou rc e. Internal or external AC adapter? Done Done Done Done Po we r o n ? Po we r o n ? Po we r o n ? Plug directly into AC outlet.
T r oubleshooting Maintenance and S ervi ce Guide 2–13 Flowc ha r t 2.5 —N o P o w er , P ar t 4 Y N Continued from “Flowchart 2.4—No Po we r , Par t 3 . ” Reseat loose components and boards and replace damaged items. Open notebook. Loose or damaged parts? Y Close notebook and retest.
2–14 Maintenance and Serv ice Gui de T r oublesh ooting Flo wc h art 2.6—N o Video, P ar t 1 A N Stand-alone or docking device? No video. Replace the following one at a time. T est after each replacement. 1. Cable between notebook and notebook display (if applicable) 2.
T r oubleshooting Maintenance and S ervi ce Guide 2–15 Flo wc h art 2.7—N o Video, P ar t 2 Y N Continued from “Flowchart 2.6—No Video, Part 1.
2–16 Maintenance and Serv ice Gui de T r oublesh ooting F lo wcha rt 2 . 8— No n f u nct io n i ng Do ck ing De v i c e (i f appl icable) Y N Reseat power cord in docking device and power outlet. N Check voltage setting on docking device. Reset monitor cable connector at docking device.
T r oubleshooting Maintenance and S ervi ce Guide 2–17 Flo wc h art 2.9—N o Opera ting S y stem (OS) Loadin g No OS loading from hard drive, go to “Flowchart 2.10—No OS Loading, Hard Drive, Part 1.” Reseat po wer cord in docking device and power outlet.
2–18 Maintenance and Serv ice Gui de T r oublesh ooting Flo wc h art 2. 1 0—N o OS Loadin g, H ard Driv e, Pa r t 1 Go to “Flowchart 2.17—Non- functioning Device.” Y Done N OS not loading from hard drive. Nonsystem disk message? Go to “Flowchart 2.
T r oubleshooting Maintenance and S ervi ce Guide 2–19 Flowc h ar t 2. 1 1—N o O S Lo a din g , H ard D rive, Pa r t 2 Load OS using Oper- ating System disc (if applicable). Continued from “Flowchart 2.10—No OS Loading, Hard Drive, Part 1.” Reseat hard drive.
2–20 Maintenance and Serv ice Gui de T r oublesh ooting Flo wc h art 2. 1 2—No OS Loa ding , Ha rd Dri v e, Pa r t 3 Y System files on hard drive? Continued from “Flowchart 2.11—No OS Loading, Hard Drive, Part 2.” Clean virus. Done N Install OS and reboot.
T r oubleshooting Maintenance and S ervi ce Guide 2–21 Flo wc h art 2. 1 3—No OS Loa ding , Disk et te Driv e Replace the following components individually , retesting after each replacement: ■ Diskette drive Done Y N Reseat diskette drive. OS not loading from diskette drive.
2–2 2 Maintenance and Serv ice Gui de T r oublesh ooting Flo wc h art 2. 1 4—N o OS Loading , O ptical Driv e Y Done N Bootable disc in drive? Disc in drive? No OS loading from CD-ROM or DVD-ROM drive. Install bootable disc and reboot notebook. Go to “Flowchart 2.
T r oubleshooting Maintenance and S ervi ce Guide 2–2 3 Flo wc h ar t 2. 1 5—N o Audio, P art 1 No audio. N Notebook in docking device (if applicable)? Internal audio? Audio? Done Undock Audio? Done T urn up audio internally or externally . Go to “Flowchart 2.
2–2 4 Maintenance and Serv ice Gui de T r oublesh ooting Flo wc h art 2. 1 6—No Au dio, P ar t 2 YN Continued from “Flowchart 2.15—No Audio, Part 1.” Reload audio drivers. Audio driver in OS configured? Audio? Y Y Y N N N Correct drivers for application? Connect to external speaker .
T r oubleshooting Maintenance and S ervi ce Guide 2–2 5 Flo wc h art 2. 1 7—N onfunc tioning De vice Done Any physical device detected? Y N Unplug the nonfunctioning device from the notebook and inspect cables and plugs for bent or broken pins or other damage.
2–2 6 Maintenance and Serv ice Gui de T r oublesh ooting Flo wc h art 2. 1 8—Nonfun c tioning K e yboar d Y N Keyboard operating properly? Keyboard not operating prop- erly . External device works? Replace system board. Replace system board. Connect notebook to good external key- board.
T r oubleshooting Maintenance and S ervi ce Guide 2–2 7 Flo wc h art 2. 1 9—Nonfunc tionin g P oin ting De vic e Y N Pointing device not operating properly . External device works? Replace system board. Replace system board. Connect notebook to good external pointing device.
2–2 8 Maintenance and Serv ice Gui de T r oublesh ooting Flo wc har t 2.20—No N et w ork/Modem Con nectio n Y Disconnect all power from the notebook and open. No network or modem connec- tion. N Done Digital line? Network or modem jack active? Replace jack or have jack acti- vated.
Maintenance and S ervi ce Guide 3–1 3 Soft w are Upd a te and Rec o v er y Soft w are Upd ates T o stay current with the newest technolog y and maintain optimal performance, install the latest versions of HP softw are on your computer as they become a vailable.
3–2 Maintenance and Serv ice Gui de So ftwar e Update and R ecov ery Accessin g Com pu ter Inf orma tion Before you access the updates for your computer , collect the follo wing information: ■ The product cate gory is Notebook. ■ The product family name and series number are printed on the display bezel.
Softw ar e Update and R ecov er y Maintenance and S ervi ce Guide 3–3 Soft w ar e Upd a tes and t he HP W eb Site Most software on the HP W eb site is packaged in compressed f iles called SoftP aq s. Some BIOS updates may be packaged in compressed f iles called RO M P a q s.
3–4 Maintenance and Serv ice Gui de So ftwar e Update and R ecov ery 3. At the do wnload area: a. Identify the BIOS update that is later than the BIOS version currently installed on your computer . Make a note of the date, name, or other identif ier .
Softw ar e Update and R ecov er y Maintenance and S ervi ce Guide 3–5 3. Double-click the f ile with an .ex e e xtension (for example, f ilename.ex e ). The BIOS installation begins. 4. Complete the installation by follo wing the instructions on the screen.
3–6 Maintenance and Serv ice Gui de So ftwar e Update and R ecov ery 3. Insert the correct R OMPaq diskette for the product being updated. The BIOS image f ile must to be located in the root directory of the diskette and must be in contiguous sectors.
Maintenance and S ervi ce Guide 4–1 4 I llus trated P ar ts C a talog This chapter provides an illustrated parts breakdo wn and a reference for spare part numbers. 4. 1 Seria l Number Loca tion When ordering parts or requesting information, provide the notebook serial number and model number located on the bottom of the notebook.
4–2 Maintenance and Serv ice Gui de Illustr ated P arts Catalog 4.2 Notebook Major C omp onents Noteboo k Major Components.
Illustr ated P arts Catalog Maintenance and S ervi ce Guide 4–3 Ta b l e 4 - 1 Spare P arts: Notebook Major Components Item Description Spare P art Number 1 Display assemb lies (include wireless antenna boards and cables) 15.0-inch, SXGA+WV A, TFT 15.
4–4 Maintenance and Serv ice Gui de Illustr ated P arts Catalog Noteboo k Major Components.
Illustr ated P arts Catalog Maintenance and S ervi ce Guide 4–5 Ta b l e 4 - 1 Spare P arts: Notebook Major Components (Continued) Item Description Spare P art Number Miscellaneous Plastics Kit 3782.
4–6 Maintenance and Serv ice Gui de Illustr ated P arts Catalog Noteboo k Major Components.
Illustr ated P arts Catalog Maintenance and S ervi ce Guide 4–7 Ta b l e 4 - 1 Spare P arts: Notebook Major Components (Continued) Item Description Spare P art Number 18 Mini PCI comm unications cards 802.11b/g WLAN card, f or us e in most of the world 802.
4–8 Maintenance and Serv ice Gui de Illustr ated P arts Catalog 4.3 Miscell an eous P l a stic s Kit T able 4-2 Miscellaneous Plastics Kit Spare P art Number 378236-001 Item Description 1 Memor y mo.
Illustr ated P arts Catalog Maintenance and S ervi ce Guide 4–9 4.4 Miscell an eous Ca bl e Kit Ta b l e 4 - 3 Miscellaneous Cable Kit Spare P art Number 395465-001 Item Description 1 Bluetooth boar.
4–10 Maintenance and Serv ice Gui de Illustr ated P arts Catalog 4.5 Mas s Storag e De vices Ta b l e 4 - 4 Mass Storage Devices Spare P art Number Information Item Description Spare Part Number 1 H.
Illustr ated P arts Catalog Maintenance and S ervi ce Guide 4–11 4.6 Miscell an eous (Not I llus trated) Ta b l e 4 - 5 Miscellaneous (Not Illustrated) Spare P art Information Description Spare P ar.
4–12 Maintenance and Serv ice Gui de Illustr ated P arts Catalog Screw Kit (includes the f ollowing screws; ref er to Appendix C, “Screw Listing, ” f or more inf or mation on specifications and usage 378235-001 ■ He x sock e t HM5.0×9.0 scre w loc k ■ Phillips PM2.
Illustr ated P arts Catalog Maintenance and S ervi ce Guide 4–13 4.7 Sequ enti al P ar t N umber Listin g Ta b l e 4 - 6 Sequential P art Number Listing Spare P art Number Description 239704-001 65 .
4–14 Maintenance and Serv ice Gui de Illustr ated P arts Catalog 373900-021 802.11a/b/g combination WLAN Mini PCI communications card, f or use in the Asia P acific region 373901-002 802.
Illustr ated P arts Catalog Maintenance and S ervi ce Guide 4–15 378237-001 Speaker 379799-001 Heat sink (i ncludes ther mal paste) 380089-001 Docking Station Mi scellaneous Plastics Kit 380107-001 .
4–16 Maintenance and Serv ice Gui de Illustr ated P arts Catalog 397243-001 K eyboard f or us e in the United States 397243-281 K eyboard f o r use in Thailand 397243-AB1 K eyboard f or use in T aiw.
Maintenance and S ervi ce Guide 5–1 5 Remo v al and Repl a cement Preliminaries This chapter provides essential information for proper and safe remov al and replacement service.
5–2 Maintenance and Serv ice Gui de Re mo val and R eplacemen t Pr eliminar ies 5 .2 Ser vice C onsid erations The follo wing sections include some of the considerations that you should keep in mind during disassembly and assembly procedures.
R emo val and R eplacement Pr eliminar ie s Maintenance and S ervi ce Guide 5–3 5 . 3 P r e v enti ng Damage to R emo v able Dri v es Remov able driv es are fragile components that must be handled with care.
5–4 Maintenance and Serv ice Gui de Re mo val and R eplacemen t Pr eliminar ies 5 .4 Pre v entin g Elec trosta tic D ama ge Many electronic components are sensiti ve to electrostatic dischar ge (ESD). Circuitry design and structure determine the degree of sensiti vity .
R emo val and R eplacement Pr eliminar ie s Maintenance and S ervi ce Guide 5–5 5 .5 P a c k agin g and T ranspor tin g Precautions Use the follo wing grounding precautions when packaging and transporting equipment: ■ T o av oid hand contact, transport products in static-safe containers, such as tubes, bags, or boxes.
5–6 Maintenance and Serv ice Gui de Re mo val and R eplacemen t Pr eliminar ies 5 .6 W orksta tion Precautions Use the follo wing grounding precautions at workstations: ■ Cov er the workstation with appro v ed static-shielding material (refer to T able 5-2, “Static-Shielding Materials” ).
R emo val and R eplacement Pr eliminar ie s Maintenance and S ervi ce Guide 5–7 ■ When standing, use foot straps and a grounded floor mat. Foot straps (heel, toe, or boot straps) can be used at standing workstations and are compatible with most types of shoes or boots.
5–8 Maintenance and Serv ice Gui de Re mo val and R eplacemen t Pr eliminar ies T able 5-1 shows ho w humidity affects the electrostatic v oltage le ve ls generated by dif ferent activities. T able 5-2 lists the shielding protection provided b y antistatic bags and floor mats.
Maintenance and S ervi ce Guide 6–1 6 Remo v al and Repl a cement Pr ocedure s This chapter provides remo v al and replacement procedures. There are 64 scre ws and scre w locks, in 11 dif ferent sizes, that must be remov ed, replaced, or loosened when servicing the notebook.
6–2 Maintenance and Serv ice Gui de Re mo val and R eplacemen t Pr ocedur es 6. 1 Serial N umber Report the notebook serial number to HP when requesting information or ordering spare parts. The serial number is located on the bottom of the notebook.
R emo v al and Replace ment Pr ocedure s Maintenance and S ervi ce Guide 6–3 6.4 Hard drive 2 loosened to remov e the hard drive co ver 1 loosened to remov e the hard drive 6 to disassemble the hard drive 6.5 Notebook f eet 0 6.6 Bluetooth board 0 6.
6–4 Maintenance and Serv ice Gui de Re mo val and R eplacemen t Pr ocedur es 6. 3 Preparing t he Notebook for Di sassem bl y Before you begin an y remo v al or installation procedures: 1.
R emo v al and Replace ment Pr ocedure s Maintenance and S ervi ce Guide 6–5 4. Remov e the battery pack b y follo wing these steps: a. T urn the notebook upside do wn with the rear panel to ward you. b . Slide and hold the battery pack lock latch 1 to the right.
6–6 Maintenance and Serv ice Gui de Re mo val and R eplacemen t Pr ocedur es 6.4 Hard Driv e 1. Prepare the notebook for disassembly (refer to Section 6.3 ). 2. Loosen the two PM2.0×4.0 scre ws 1 that secure the hard dri v e cov er to the notebook.
R emo v al and Replace ment Pr ocedure s Maintenance and S ervi ce Guide 6–7 5. Loosen the PM2.5×13.0 spring-loaded hard dri v e retention scre w 1 . 6. Grasp the mylar tab 2 on the hard dri v e and slide the hard dri v e to the right 3 to disconnect it from the system board.
6–8 Maintenance and Serv ice Gui de Re mo val and R eplacemen t Pr ocedur es 8. Remov e the two PM2.5×4.0 hard dri ve frame shoulder scre ws 1 from each side of the hard dri v e. 9. Remov e the two PM2.5×4.0 hard dri ve frame scre ws 2 from each side of the hard dri v e.
R emo v al and Replace ment Pr ocedure s Maintenance and S ervi ce Guide 6–9 6.5 Notebook F eet The notebook feet are adhesi v e-backed rubber pads. The feet are included in the Miscellaneous Plastics Kit, spare part number 378236-001.
6–10 Maintenance and Serv ice Gui de Re mo val and R eplacemen t Pr ocedur es 6.6 Bluetooth B oard 1. Prepare the notebook for disassembly (refer to Section 6.
R emo v al and Replace ment Pr ocedure s Maintenance and S ervi ce Guide 6–11 3. Slide the Bluetooth board out of the clip 1 in the hard dri ve compartment. 4. Disconnect the Bluetooth board cable 2 from the board. R emo v ing the Blueto oth Boar d Re v erse the abov e procedure to install a Bluetooth board.
6–12 Maintenance and Serv ice Gui de Re mo val and R eplacemen t Pr ocedur es 6.7 Ex ternal Memor y Module 1. Prepare the notebook for disassembly (refer to Section 6.3 ). 2. Position the notebook with the front to ward you. 3. Loosen the PM2.0×4.0 scre w 1 that secures the memory module/Mini PCI compartment cov er to the notebook.
R emo v al and Replace ment Pr ocedure s Maintenance and S ervi ce Guide 6–13 6. Spread the retaining tabs 1 on each side of the memory module socket to release the memory module board. (The edge of the module opposite the socket rises a way from the notebook.
6–14 Maintenance and Serv ice Gui de Re mo val and R eplacemen t Pr ocedur es 6.8 Mini PCI Communi ca tions Card 1. Prepare the notebook for disassembly ( Section 6.3 ). 2. Remov e the memory module/Mini PCI compartment co ver ( Section 6.7 ). 3. Position the notebook with the front to ward you.
R emo v al and Replace ment Pr ocedure s Maintenance and S ervi ce Guide 6–15 4. Disconnect the auxiliary and main antenna cables 1 from the Mini PCI communications card. ✎ Make note of which antenna cable is attached to which antenna clip on the Mini PCI communications card before disconnecting the cables.
6–16 Maintenance and Serv ice Gui de Re mo val and R eplacemen t Pr ocedur es 6.9 Optical Driv e 1. Prepare the notebook for disassembly ( Section 6.3 ). 2. Remov e the memory module/Mini PCI compartment co ver ( Section 6.7 ). 3. Position the notebook with the left side to ward you.
R emo v al and Replace ment Pr ocedure s Maintenance and S ervi ce Guide 6–17 4. Remov e the T8M2.0×9.0 scre w 1 that secures the optical dri v e to the notebook. 5. Insert a thin tool, such as an unbent paper clip 2 , into the media tray release hole and release the media tray .
6–18 Maintenance and Serv ice Gui de Re mo val and R eplacemen t Pr ocedur es 6. 1 0 K e yb oa rd 1. Prepare the notebook for disassembly ( Section 6.3 ). 2. Remov e the memory module/Mini PCI compartment co ver ( Section 6.7 ). 3. Remov e the tw o T8M2.
R emo v al and Replace ment Pr ocedure s Maintenance and S ervi ce Guide 6–19 4. T urn the notebook display-side up with the front to ward you. 5. Open the notebook as far as possible.
6–20 Maintenance and Serv ice Gui de Re mo val and R eplacemen t Pr ocedur es 7. Lift the rear edge of the ke yboard up and swing it to ward you until it rests on the palm rest.
R emo v al and Replace ment Pr ocedure s Maintenance and S ervi ce Guide 6–21 8. Release the zero insertion force (ZIF) connector 1 to which the ke yboard cable is attached and disconnect the ke yboard cable 2 . Disconnec ting the K e y boar d Cable 9.
6–2 2 Maintenance and Serv ice Gui de Re mo val and R eplacemen t Pr ocedur es 6. 1 1 S wit c h C o v er 1. Prepare the notebook for disassembly ( Section 6.3 ). 2. Remov e the ke yboard ( Section 6.10 ). 3. Close the notebook. 4. T urn the notebook upside do wn with the rear panel to ward you.
R emo v al and Replace ment Pr ocedure s Maintenance and S ervi ce Guide 6–2 3 6. T urn the notebook display-side up with front to ward you. 7. Open the notebook as far as possible.
6–2 4 Maintenance and Serv ice Gui de Re mo val and R eplacemen t Pr ocedur es 6. 1 2 LED Board 1. Prepare the notebook for disassembly ( Section 6.3 ). 2. Remov e the ke yboard ( Section 6.10 ). 3. Remov e the switch co ver ( Section 6.11 ). 4. T urn the notebook upside do wn with the rear panel to ward you.
R emo v al and Replace ment Pr ocedure s Maintenance and S ervi ce Guide 6–2 5 6. Remov e the four PM1.5×4.0 scre ws 1 that secure the LED board to the switch cov er . 7. Remov e the LED board 2 . R emo v ing the LED Boar d Re v erse the abov e procedure to install the LED board.
6–2 6 Maintenance and Serv ice Gui de Re mo val and R eplacemen t Pr ocedur es 6. 1 3 Fan 1. Prepare the notebook for disassembly ( Section 6.3 ). 2. Remov e the ke yboard ( Section 6.10 ). 3. Disconnect the fan cable 1 from the system board. 4. Loosen the 2 PM2.
R emo v al and Replace ment Pr ocedure s Maintenance and S ervi ce Guide 6–2 7 6. 1 4 Hea t Sink 1. Prepare the notebook for disassembly ( Section 6.
6–2 8 Maintenance and Serv ice Gui de Re mo val and R eplacemen t Pr ocedur es 4. Loosen the four PM2.0×8.0 shoulder scre ws 1 that secure the heat sink to the notebook. 5. Lift the right side of the heat sink 2 to disengage it from the processor .
R emo v al and Replace ment Pr ocedure s Maintenance and S ervi ce Guide 6–29 ✎ The thermal paste should be thoroughly cleaned from the surfaces of the heat sink 1 and processor 2 each time the heat sink is remov ed. Thermal paste should be reapplied to both surfaces before the heat sink is reinstalled.
6–30 Maintenance and Serv ice Gui de Re mo val and R eplacemen t Pr ocedur es 6. 1 5 P roces s or 1. Prepare the notebook for disassembly ( Section 6.3 ). 2. Remov e the ke yboard ( Section 6.10 ). 3. Remov e the f an ( Section 6.13 ). 4. Remov e the heat sink ( Section 6.
R emo v al and Replace ment Pr ocedure s Maintenance and S ervi ce Guide 6–31 5. Use a flat-bladed scre wdri v er to turn the processor locking scre w one-quarter turn counterclockwise 1 until you hear ac l i c k . 6. Lift the processor straight up and remov e it 2 .
6–3 2 Maintenance and Serv ice Gui de Re mo val and R eplacemen t Pr ocedur es 6. 1 6 Internal Memor y Module 1. Prepare the notebook for disassembly ( Section 6.
R emo v al and Replace ment Pr ocedure s Maintenance and S ervi ce Guide 6–33 3. Spread the retaining tabs 1 on each side of the memory module socket to release the memory module board. (The edge of the module opposite the socket rises a way from the notebook.
6–3 4 Maintenance and S ervi ce Guide Re mo val and R eplacemen t Pr ocedur es 6. 1 7 RT C B a t te r y ✎ The R TC battery is included in the Miscellaneous Plastics Kit, spare part number 378236-001. 1. Prepare the notebook for disassembly ( Section 6.
R emo v al and Replace ment Pr ocedure s Maintenance and S ervi ce Guide 6–35 6 . 1 8 Di spla y Assemb l y 1. Prepare the notebook for disassembly ( Section 6.3 ), and then remov e the following components: a. Memory module/Mini PCI compartment cov er ( Section 6.
6–3 6 Maintenance and S ervi ce Guide Re mo val and R eplacemen t Pr ocedur es 5. Disconnect the display cable 1 from the system board. 6. Remov e the wireless antenna cables from the Mini PCI compartment and the top cov er clips 2 . 7. Remov e the two T8M2.
R emo v al and Replace ment Pr ocedure s Maintenance and S ervi ce Guide 6–3 7 8. Swing the display assembly into a partially closed position. 9. Position the notebook with the rear panel to ward you. Ä CA UTION: Support the display as sembl y w hen r emo v ing the fo llo w ing sc r e ws .
6–3 8 Maintenance and S ervi ce Guide Re mo val and R eplacemen t Pr ocedur es 6. 1 9 T o p C ov e r 1. Prepare the notebook for disassembly ( Section 6.3 ), and then remov e the following components: a. Memory module/Mini PCI compartment cov er ( Section 6.
R emo v al and Replace ment Pr ocedure s Maintenance and S ervi ce Guide 6–3 9 3. Remov e the thirteen T8M2.0×9.0 scre ws that secure the top cov er to the notebook.
6–40 Maintenance and Serv ice Gui de Re mo val and R eplacemen t Pr ocedur es 4. T urn the notebook right-side up with the front to ward you. 5. Remov e the two T8M2.0×9.0 scre ws 1 that secure the top cov er to the notebook. 6. Disconnect the T ouchPad cable 2 from the system board.
R emo v al and Replace ment Pr ocedure s Maintenance and S ervi ce Guide 6–41 7. Lift up the rear edge of the top cov er 1 until it disengages from the base enclosure. 8. Swing the top cov er to ward you 2 until the left and right sides of the top cov er disengage from the base enclosure.
6–4 2 Maintenance and Serv ice Gui de Re mo val and R eplacemen t Pr ocedur es 6.2 0 S pe ak er 1. Prepare the notebook for disassembly ( Section 6.3 ), and then remov e the following components: a. Memory module/Mini PCI compartment cov er ( Section 6.
R emo v al and Replace ment Pr ocedure s Maintenance and S ervi ce Guide 6–43 3. Remov e the six T8M2.0×4.0 scre ws 1 that secure the speaker to the notebook. 4. Lift the speaker up 2 until it clears the system board. 5. Slide the speaker to ward you 3 and remov e it.
6–44 Maintenance and Serv ice Gui de Re mo val and R eplacemen t Pr ocedur es 6.2 1 Mod e m B o ar d 1. Prepare the notebook for disassembly ( Section 6.3 ), and then remov e the following components: a. Memory module/Mini PCI compartment cov er ( Section 6.
R emo v al and Replace ment Pr ocedure s Maintenance and S ervi ce Guide 6–45 2. Remov e the two PM2.0×3.0 scre ws 1 that secure the modem board to the notebook. 3. Lift the front edge of the modem board 2 to disconnect it from the system board. 4.
6–4 6 Maintenance and S ervi ce Guide Re mo val and R eplacemen t Pr ocedur es 6.2 2 Digital M edia B oard 1. Prepare the notebook for disassembly ( Section 6.3 ), and then remov e the following components: a. Memory module/Mini PCI compartment cov er ( Section 6.
R emo v al and Replace ment Pr ocedure s Maintenance and S ervi ce Guide 6–4 7 2. Release the ZIF connector to which the digital media board cable is attached and disconnect the digital media board cable 1 from the system board. 3. Remov e the digital media board 2 .
6–4 8 Maintenance and S ervi ce Guide Re mo val and R eplacemen t Pr ocedur es 6.2 3 US B/Audio B oard 1. Prepare the notebook for disassembly ( Section 6.3 ), and then remov e the following components: a. Memory module/Mini PCI compartment cov er ( Section 6.
R emo v al and Replace ment Pr ocedure s Maintenance and S ervi ce Guide 6–4 9 2. Position the notebook with the rear panel to ward you. 3. Disconnect the USB cable 1 and audio cable 2 from the system board. 4. Remov e the PM1.5×3.0 scre w 3 that secures the USB/audio board and shield to the base enclosure.
6–5 0 Maintenance and S ervi ce Guide Re mo val and R eplacemen t Pr ocedur es 6.24 S y s te m B o ard ✎ When replacing the system board, ensure that the follo wing components are remov ed from the defecti ve system board and installed on the replacement system board: ■ Memory modules ( Section 6.
R emo v al and Replace ment Pr ocedure s Maintenance and S ervi ce Guide 6–51 1. Prepare the notebook for disassembly ( Section 6.3 ), and then remov e the following components: a. Hard dri ve ( Section 6.4 ) b . Bluetooth board ( Section 6.6 ) c. Optical dri v e ( Section 6.
6–5 2 Maintenance and Serv ice Gui de Re mo val and R eplacemen t Pr ocedur es 3. Disconnect the serial connector cable 1 and the Bluetooth cable 2 from the system board. 4. Remov e the T8M2.0×4.0 scre w 3 that secures the system board to the base enclosure next to the RJ-11 connector .
R emo v al and Replace ment Pr ocedure s Maintenance and S ervi ce Guide 6–5 3 7. Use the optical dri ve connector to lift the system board up 1 until the po wer connector 2 is clear of the base enclosure. 8. Slide the system board to the left 3 at an angle and remov e it.
6–5 4 Maintenance and S ervi ce Guide Re mo val and R eplacemen t Pr ocedur es 9. If necessary , disconnect the RJ-11 connector module cable from the system board and remov e the RJ-11 connector module and cable. R emo v ing the RJ-11 C onnect or Module and Ca ble Re v erse the abov e procedures to install the system board.
R emo v al and Replace ment Pr ocedure s Maintenance and S ervi ce Guide 6–5 5 6.2 5 Serial C onnec tor Modul e 1. Prepare the notebook for disassembly ( Section 6.3 ), and then remov e the following components: a. Hard dri ve ( Section 6.4 ) b . Bluetooth board ( Section 6.
6–5 6 Maintenance and Serv ice Gui de Re mo val and R eplacemen t Pr ocedur es 3. Remov e the two HM5.0×9.0 scre w locks 1 on each side of the serial connector . 4. Lift the serial connector module and cable out of the base enclosure 2 . 5. Disconnect the serial connector module cable from the system board 3 .
Maintenance and S ervi ce Guide 7–1 7 Spec ifica tions This chapter provides physical and performance specif ications. Ta b l e 7 - 1 Notebook Dimensions Metric U .S. Height Width Depth 32.8 cm 26.7 cm 3.1 cm 12.91 10.51 1.22 W eight 2.66 kg 5.86 lbs Input P ower Operating v oltage Operating current 18.
7–2 Maintenance and Serv ice Gui de Spe cificat ion s Maximum altitude (unpressurized) Operating (14.7 to 10.1 psia) Nonoperating (14.7 to 4.4 psia) -15 m to 3,048 m -15 m to 12,192 m -50 ft to 10,000 ft -50 ft to 40,000 ft Shock Operating Nonoperating 125 g, 2 ms, half-sine 200 g, 2 ms, half-sine Random Vibration Operating Nonoperating 0.
Spe cificat ion s Maintenance and S ervi ce Guide 7–3 Ta b l e 7 - 2 15.0-inch, SXGA+WV A, TFT Displa y Dimensions Height Width Diagonal 30.0 cm 22.9 cm 38.1 cm 11.8 in 9.0 in 15.0 in Number of colors Up to 16.8 million Contrast ratio 300:1 Brightness 180 nits typical Pixel resolution Pitch Fo r m a t Configuration 0.
7–4 Maintenance and Serv ice Gui de Spe cificat ion s Ta b l e 7 - 3 15.0-inch, XGA, TFT Displa y Dimensions Height Width Diagonal 30.0 cm 22.9 cm 38.1 cm 11.8 in 9.0 in 15.0 in Number of colors Up to 16.8 million Contrast ratio 250:1 Brightness 150 nits typical Pixel resolution Pitch Fo r m a t Configuration 0.
Spe cificat ion s Maintenance and S ervi ce Guide 7–5 Ta b l e 7 - 4 14.1-inch, XGA, TFT Displa y Dimensions Height Width Diagonal 28.5 cm 21.3 cm 35.8 cm 11.2 in 8.4 in 14.1 in Number of colors Up to 16.8 million Contrast ratio 250:1 Brightness 150 nits typical Pixel resolution Pitch Fo r m a t Configuration 0.
7–6 Maintenance and Serv ice Gui de Spe cificat ion s Ta b l e 7 - 5 Har d Drives 80-GB* 60-GB* 60-GB* 40-GB* Dimensions Height Width We i g h t 9.5 mm 70 mm 99 g 9.
Spe cificat ion s Maintenance and S ervi ce Guide 7–7 Ta b l e 7 - 6 Primary 6-cell, Li-Ion Batter y P ack Dimensions Height Width Depth We i g h t 2.00 cm 5.30 cm 20.30 cm 0.34 kg 0.79 in 2.10 in 8.00 in 0.74 lb Energ y V oltage Amp-hour capacity W att-hour capacity 10.
7–8 Maintenance and Serv ice Gui de Spe cificat ion s Ta b l e 7 - 7 DV D - RO M D r i v e Applicable disc DV D - R O M ( DV D - 5 , DV D - 9 , DV D - 1 0 , DV D - 1 8 ) CD-R OM (Mode 1 and 2) CD Di.
Spe cificat ion s Maintenance and S ervi ce Guide 7–9 Ta b l e 7 - 8 D VD/CD-R W Combo Drive Applicable disc Read: D VD-R, D VD-R W , D VD-ROM (D VD-5, D VD-9, D VD-10, DV D - 1 8 ) , CD-ROM (Mode 1.
7–10 Maintenance and Serv ice Gui de Spe cificat ion s Disc thickness 1.2 mm (0.047 in) T rack pitch 0.74 µm Access time CD media D VD media Random Full strok e < 110 ms < 210 ms < 130 ms < 225 ms A udio output level Line-out, 0.
Spe cificat ion s Maintenance and S ervi ce Guide 7–11 Ta b l e 7 - 9 D VD±R W and CD-R W Combo Drive Applicable disc Read: DV D - R , DV D - R W, D VD-ROM (D VD-5, DV D - 9 , DV D - 1 0 , DV D - 1.
7–12 Maintenance and Serv ice Gui de Spe cificat ion s Disc thickness 1.2 mm (0.047 in) T rack pitch 0.74 µm Access time CD D VD Random Full strok e < 175 ms < 285 ms < 230 ms < 335 ms A udio output level Audio-out, 0.
Spe cificat ion s Maintenance and S ervi ce Guide 7–13 T able 7-10 System DMA Hard ware DMA System Function DMA0 Not applicable DMA1* Not applicable DMA2* Not applicable DMA3 SMC IrCC - F ast Infrar.
7–14 Maintenance and Serv ice Gui de Spe cificat ion s T able 7-11 System Interrupts IRQ System Function IRQ0 System timer IRQ1 Standard 101-/102-K ey or Microsoft Natural K eyboard IRQ2 Cascaded IR.
Spe cificat ion s Maintenance and S ervi ce Guide 7–15 IRQ11* Intel 82801FB/FBM USB Univ ersal Host Controller - 2659 Intel 82801FB/FBM USB Univ er sal Host Controller - 265A Broadcom NetXtreme Giga.
7–16 Maintenance and Serv ice Gui de Spe cificat ion s I/O Address (he x) System Function (shipping configuration) 054 - 059 U nused 060 K eyboard controller 061 System speak er 062 MS A CPI-Complia.
Spe cificat ion s Maintenance and S ervi ce Guide 7–17 I/O Address (he x) System Function (shipping configuration) 100 - 10F SMC IrCC - F ast Infrared P or t 110 - 1EF Unused 1F0 - 1F7 Pr imar y IDE.
7–18 Maintenance and Serv ice Gui de Spe cificat ion s T able 7-13 System Memory Map Size Memory Address System Function 640 KB 00000000 - 0009FFFF Base memor y 128 KB 000A0000 - 000BFFFF Video memo.
Maintenance and S ervi ce Guide A–1 A Co nnec tor P in As signm en ts Ta b l e A - 1 A udio-Out (Headphone) Pin Signal Pin Signal 1 A udio out, left channel 3 Ground 2 A udio out, right channel.
A–2 Maintenance and Serv ice Gui de Connec tor P in Assignments Ta b l e A - 2 A udio-In (Micr ophone) Pin Signal Pin Signal 1 A udio signal in 3 Ground 2 A udio signal in Ta b l e A - 3 Universal S.
Connec tor P in Assignments Maintenance and S ervi ce Guide A–3 Ta b l e A - 4 Serial Pin Signal Pin Signal 1 Carrier detect 6 Data set ready 2 Receive data 7 Ready to send 3 T ransmit data 8 Clear .
A–4 Maintenance and Serv ice Gui de Connec tor P in Assignments Ta b l e A - 5 P arallel P or t Pin Signal Pin Signal 1 Strobe 14 Auto linef eed 2 Data bit 0 15 Error 3 Data bit 1 16 Initialize prin.
Connec tor P in Assignments Maintenance and S ervi ce Guide A–5 Ta b l e A - 6 7-Pin S-Video-Out Pin Signal Pin Signal 1 C (chrominance) 5 Composite video 2 Ground 6 Unused 3 Y (luminance) 7 Ground .
A–6 Maintenance and Serv ice Gui de Connec tor P in Assignments Ta b l e A - 7 External Monitor Pin Signal Pin Signal 1 Red analog 9 +5 VDC 2 Green analog 10 Ground 3 Blue analog 11 Monitor detect 4.
Connec tor P in Assignments Maintenance and S ervi ce Guide A–7 Ta b l e A - 8 RJ-11 (Modem) Pin Signal Pin Signal 1 Unused 4 Unused 2T i p 5U n u s e d 3 Ring 6 Unused.
A–8 Maintenance and Serv ice Gui de Connec tor P in Assignments Ta b l e A - 9 RJ-45 (Netw ork) Pin Signal Pin Signal 1 T ransmit + 5 Unused 2 T ransmit – 6 Receiv e – 3 Receive + 7 Unused 4 Unu.
Maintenance and S ervi ce Guide B–1 B P o w er Cord S et R eq uirements 3-Con duc tor P o w er Cord Set The wide range input feature of the notebook permits it to operate from any line v oltage from 100 to 120 or 220 to 240 volts A C.
B–2 Maintenance and Se rvi ce Guide P o w er Cor d Set R equirements Gen eral R equiremen ts The requirements listed belo w are applicable to all countries. ■ The length of the po wer cord set must be at least 1.5 m (5.0 ft) and a maximum of 2.0 m (6.
P ow er Cor d Set Requir ement s Maintenance and S ervi ce Guide B–3 Coun tr y-Spec ific Requirements 3-Conductor P ower Cor d Set Requirements Country/Region Accredited Agency Applicable Note Numbe.
B–4 Maintenance and Se rvi ce Guide P o w er Cor d Set R equirements Ko r e a E K 4 The Netherlands KEMA 1 Norwa y NEMK O 1 P eople’ s Repub lic of China CCC 5 Sweden SEMK O 1 Switzerland SEV 1 T aiwan BSMI 4 United Kingdom BSI 1 United States UL 2 ✎ NOTES: 1.
Maintenance and S ervi ce Guide C–1 C Sc r e w Li sting This appendix provides specif ication and reference information for the scre ws and scre w locks used in the notebook. All scre ws and scre w locks listed in this appendix are a v ailable in the Scre w Kit, spare part number 378235-001.
C–2 Maintenance and S ervi ce Guide Scr e w Listi ng Phillips P M2 . 0×4. 0 Scr ew L ocati ons Ta b l e C - 1 Phillips PM2.0×4.0 Screw Color Qty . Length Thread Head Width Black 3 4.
Scr ew L isti ng Maintenance and S ervi ce Guide C–3 Philli ps P M2 .5×13 . 0 Scr ew L ocat ion Ta b l e C - 2 Phillips PM2.5×13.0 Spring-Loaded Har d Drive Retention Screw Color Qty .
C–4 Maintenance and S ervi ce Guide Scr e w Listi ng Phillips P M2 . 5×4. 0 Shoulder Sc r e w , Phillips P M2 .5×4. 0 Scr ew , and Phillips P M1. 5×3 . 5 Sc r ew L ocati ons Ta b l e C - 3 Phillips PM2.5×4.0 Shoulder Screw , Phillips PM2.5×4.0 Screw , and Phillips PM1.
Scr ew L isti ng Maintenance and S ervi ce Guide C–5 T orx T8M2 . 0×9 . 0 Sc r ew L ocatio n Ta b l e C - 4 T orx T8M2.0×9.0 Screw Color Qty . Length Thread Head Width Black 24 9.0 mm 2.0 mm 4.0 mm Where used: One screw that secures the optical dr iv e to the notebook (documented in Section 6.
C–6 Maintenance and S ervi ce Guide Scr e w Listi ng T orx T8M2 . 0×9 . 0 Sc r ew L ocatio ns Ta b l e C - 4 T orx T8M2.0×9.0 Screw (Continued) Color Qty . Length Thread Head Width Black 24 9.0 mm 2.0 mm 4.0 mm Where used: 2 screws that secure the k eyboard to the notebook (documented in Section 6.
Scr ew L isti ng Maintenance and S ervi ce Guide C–7 T orx T8M2 . 0×9 . 0 Sc r ew L ocatio ns Ta b l e C - 4 T orx T8M2.0×9.0 Screw (Continued) Color Qty . Length Thread Head Width Black 24 9.0 mm 2.0 mm 4.0 mm Where used: 2 screws that secure the displa y asse mbly to the notebook (documented in Section 6.
C–8 Maintenance and S ervi ce Guide Scr e w Listi ng T orx T8M2 . 0×9 . 0 Sc r ew L ocatio ns Ta b l e C - 4 T orx T8M2.0×9.0 Screw (Continued) Color Qty . Length Thread Head Width Black 24 9.0 mm 2.0 mm 4.0 mm Where used: 4 screws that secure the displa y asse mbly to the notebook (documented in Section 6.
Scr ew L isti ng Maintenance and S ervi ce Guide C–9 T orx T8M2 . 0×9 . 0 Sc r ew L ocatio ns Ta b l e C - 4 T orx T8M2.0×9.0 Screw (Continued) Color Qty . Length Thread Head Width Black 24 9.0 mm 2.0 mm 4.0 mm Where used: 13 screws that secure the top co v er to the notebook (documented in Section 6.
C–10 Maintenance and S ervi ce Guide Scr e w Listi ng T orx T8M2 . 0×9 . 0 Sc r ew L ocatio ns Ta b l e C - 4 T orx T8M2.0×9.0 Screw (Continued) Color Qty . Length Thread Head Width Black 24 9.0 mm 2.0 mm 4.0 mm Where used: 2 screws that secure the top co v e r to the notebook (documented in Section 6.
Scr ew L isti ng Maintenance and S ervi ce Guide C–11 T orx T8M2 . 0×2 .0 S cr ew L o cati ons Ta b l e C - 5 T orx T8M2.0×2.0 Screw Color Qty . Length Thread Head Width Black 2 2.0 mm 2.0 mm 6.0 mm Where used: 2 screws that secure the s witch co v er to the notebook (documented in Section 6.
C–12 Maintenance and S ervi ce Guide Scr e w Listi ng Phillips P M1. 5×4. 0 Sc r e w L ocati ons Ta b l e C - 6 Phillips PM1.5×4.0 Screw Color Qty . Length Thread Head Width Silv er 4 4.0 mm 1.5 mm 4.0 mm Where used: 4 screws that secure the LED board to the s witch cov er (documented in Section 6.
Scr ew L isti ng Maintenance and S ervi ce Guide C–13 Phill ips P M2 . 0×7 . 0 Scr e w Locations Ta b l e C - 7 Phillips PM2.0×7.0 Screw Color Qty . Length Thread Head Width Silv er 2 7.0 mm 2.0 mm 4.5 mm Where used: 2 screws that secure the f an to the notebook (screws are captured on the f an assembly b y an O clip; documented in Section 6.
C–14 Maintenance and S ervi ce Guide Scr e w Listi ng Phillips P M2 .0×8. 0 Shoulder Sc r e w L ocati ons Ta b l e C - 8 Phillips PM2.0×8.0 Shoulder Screw Color Qty .
Scr ew L isti ng Maintenance and S ervi ce Guide C–15 Philli ps P M2 .0×3 .0 Sc r e w Locations Ta b l e C - 9 Phillips PM2.0×3.0 Screw Color Qty . Length Thread Head Width Black 2 3.0 mm 2.0 mm 4.0 mm Where used: 2 screws that secure the modem boar d to the notebook (documented in Section 6.
C–16 Maintenance and S ervi ce Guide Scr e w Listi ng T or x T8M2 .0×4. 0 Sc r e w L ocations T able C-10 T orx T8M2.0×4.0 Screw Color Qty . Length Thread Head Width Black 8 4.0 mm 2.0 mm 4.0 mm Where used: 6 screws that secure the speak er to the notebook (documented in Section 6.
Scr ew L isti ng Maintenance and S ervi ce Guide C–17 T or x T8M2 .0×4. 0 Sc r e w L ocation T able C-10 T orx T8M2.0×4.0 Screw (Continued) Color Qty . Length Thread Head Width Black 8 4.0 mm 2.0 mm 4.0 mm Where used: One screw that secures the USB/audio board the notebook (documented in Section 6.
C–18 Maintenance and S ervi ce Guide Scr e w Listi ng T or x T8M2 .0×4. 0 Sc r e w L ocation T able C-10 T orx T8M2.0×4.0 Screw (Continued) Color Qty . Length Thread Head Width Black 8 4.0 mm 2.0 mm 4.0 mm Where used: One screw that secures the system board the notebook (documented in Section 6.
Scr ew L isti ng Maintenance and S ervi ce Guide C–19 He x Soc k et HM5 . 0×9 .0 S cr ew L ock L ocations T able C-11 Hex Soc ket HM5.0×9.0 Screw Lock Color Qty . Length Thread Head Width Silv er 6 9.0 mm 2.5 mm 5.0 mm Where used: 1 T wo screw loc ks that secure the system board to the notebook (documented in Section 6.
C–20 Maintenance and S ervi ce Guide Scr e w Listi ng He x Soc k et HM5 . 0×9 .0 S cr ew L ock L ocations T able C-11 Hex Soc ket HM5.0×9.0 Screw Loc k (Continued) Color Qty . Length Thread Head Width Silv er 6 9.0 mm 2.5 mm 5.0 mm Where used: 2 screw loc ks that secure the ser ial connector board to the system board (documented in Section 6.
Maintenance and S ervi ce Guide Inde x–1 In de x 1394 port 1–11 6-in-1 Digital Media Slot 1–7 6-in-1 Digital Media Slot light 1–7 A AC adapter, spare part numbers 4–11 , 4–13 arrow keys 1.
Inde x–2 Mainten ance and Servi ce Guide Inde x Computer Setup Advanced Menu 2–6 File Menu 2–3 overview 2–1 Security Menu 2–4 Tools Menu 2–5 Computer Setup defaults 2–2 connector pin ass.
Inde x Maintenance and S ervi ce Guide Inde x–3 DVD-ROM drive OS loading problems 2–17 precautions 5–3 removal 6–16 spare part number 4–7 , 4–10 , 4–15 , 6–16 specifications 7–8 E el.
Inde x–4 Mainten ance and Servi ce Guide Inde x heat sink removal 6–27 spare part number 4–3 , 4–15 , 6–27 I I/O address specifications 7–15 Info Center button 1–17 infrared port 1–6 i.
Inde x Maintenance and S ervi ce Guide Inde x–5 modem cable illustrated 4–9 removal 6–54 modem jack location 1–11 pin assignments A–7 modem, troubleshooting 2–28 monitor port location 1–.
Inde x–6 Mainten ance and Servi ce Guide Inde x RJ-11 connector module and cable illustrated 4–9 removal 6–54 RJ-11 jack location 1–11 pin assignments A–7 RJ-45 jack location 1–11 pin assi.
Inde x Maintenance and S ervi ce Guide Inde x–7 top cover removal 6–38 spare part number 4–3 , 4–15 , 6–38 TouchPad 1–19 TouchPad buttons 1–19 TouchPad scroll zone 1–19 transporting pr.
デバイスHP nx6130の購入後に(又は購入する前であっても)重要なポイントは、説明書をよく読むことです。その単純な理由はいくつかあります:
HP nx6130をまだ購入していないなら、この製品の基本情報を理解する良い機会です。まずは上にある説明書の最初のページをご覧ください。そこにはHP nx6130の技術情報の概要が記載されているはずです。デバイスがあなたのニーズを満たすかどうかは、ここで確認しましょう。HP nx6130の取扱説明書の次のページをよく読むことにより、製品の全機能やその取り扱いに関する情報を知ることができます。HP nx6130で得られた情報は、きっとあなたの購入の決断を手助けしてくれることでしょう。
HP nx6130を既にお持ちだが、まだ読んでいない場合は、上記の理由によりそれを行うべきです。そうすることにより機能を適切に使用しているか、又はHP nx6130の不適切な取り扱いによりその寿命を短くする危険を犯していないかどうかを知ることができます。
ですが、ユーザガイドが果たす重要な役割の一つは、HP nx6130に関する問題の解決を支援することです。そこにはほとんどの場合、トラブルシューティング、すなわちHP nx6130デバイスで最もよく起こりうる故障・不良とそれらの対処法についてのアドバイスを見つけることができるはずです。たとえ問題を解決できなかった場合でも、説明書にはカスタマー・サービスセンター又は最寄りのサービスセンターへの問い合わせ先等、次の対処法についての指示があるはずです。