Intelメーカー200の使用説明書/サービス説明書
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318548 -001 Intel ® Celeron ® Processor 200 Δ Sequence Thermal and Mechanical Design Guidelines — Supporting the Intel ® Celeron ® processor 220 Δ October 2007.
2 Thermal and Mechanical Design Guidelines INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNE CTION WITH INTEL® PRODUCTS . NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT.
Thermal and Mechanical Design Guidelines 3 Contents 1 Introduc tion ..................................................................................................... 7 1.1 Document Goal s and Sc ope ................................................
4 Thermal and Mechanical Design Guidelines Appendix A Heatsink Clip Lo ad Metr ology ............................................................................ 43 A.1 Overview .........................................................................
Thermal and Mechanical Design Guidelines 5 Tables Table 1. Micro-FCBGA Packag e M echanical Specifications ..................................... 12 Table 2. Thermal Specifi cations for Intel ® Celeron ® Processor 200 Sequ ence .......... 19 Table 3.
6 Thermal and Mechanical Design Guidelines Revision History Revision Number Description Revision Date -001 • Initial Re lease October 2007 §.
Introduction Thermal and Mechanical Design Guidelines 7 1 Introduction 1.1 Document Goals and Scope 1.1.1 Importance of Thermal Management The objective of thermal management is to ensure that the temperatures of all components in a system are maintained withi n their functional temperature range.
Introduction 8 Thermal and Mechanical Design Guidelines 1.1.3 Document Scope This design guide supports the foll owing processors: • Intel ® Celeron ® Processor 200 sequence applies to the Intel ® Celeron ® processor 220. In this document the Intel Celeron Processo r 200 sequence w ill be refe rred to as “the processor”.
Introduction Thermal and Mechanical Design Guidelines 9 1.2 Reference Documents Material and concepts availabl e in the following documents may be benefi cial when reading this docu ment. Document Document No./Location Intel ® Celeron ® Processor 200 Sequence Datasheet http://developer.
Introduction 10 Thermal and Mechanical Design Guidelines Term Description (T S – T A ) / Total Package Power. Note: Heat source must be specified for Ψ measurements. TIM Thermal Interface Material: The thermally conductive compound between the heatsink and the processor die surface.
Processor Thermal/Mechanical Information Thermal and Mechanical Design Guidelines 11 2 Processor Thermal/Mechanical Information 2.1 Mechanical Requirements 2.1.1 Processor Package The Intel Celeron processor 200 sequence is avail able in a 479-pi n Micro-FCBGA package, as shown in Figure 1 to Figure 3.
Processor Thermal/Mechanical Information 12 Thermal and Mechanical Design Guidelines Table 1. Micro-FCBGA Package Mechanical Specifications Symbol Parameter Min Max Unit Figure B1 Package substrate wi dth 34.95 35.05 mm Figure 2 B2 Package substrate length 34.
Processor Thermal/Mechanical Information Thermal and Mechanical Design Guidelines 13 Figure 1. Micro-FCBGA Processor Package Drawing – Isometric View.
Processor Thermal/Mechanical Information 14 Thermal and Mechanical Design Guidelines Figure 2. Micro-FCBGA Processor Package Drawing (Sheet 1 of 2) NOTE: All dimensions in millimeters. Values shown are for reference only. See Table 1 for specific details.
Processor Thermal/Mechanical Information Thermal and Mechanical Design Guidelines 15 Figure 3. Micro-FCBGA Processor Package Drawing (Sheet 2 of 2) NOTE: All dimensions in millimeters. Values shown are for reference only. See Table 1 for specific details.
Processor Thermal/Mechanical Information 16 Thermal and Mechanical Design Guidelines 2.1.2 Heatsink Attach 2.1.2.1 General Guidelines The micro-FCBGA package may have capacitors placed i n the area surrounding the processor die.
Processor Thermal/Mechanical Information Thermal and Mechanical Design Guidelines 17 depen ding on clip stiffness, the initial pr eload at b eginning o f life of the p roduct may be significantly hi gher than the minimum preload that must be met throughout the li fe of the product.
Processor Thermal/Mechanical Information 18 Thermal and Mechanical Design Guidelines Figure 4. Vertical Lock-Down Alignment Feature Figure 5. Various Types of Solder Crack 2.2 Thermal Requirements The pro cessor r equires a thermal so lution to maint ain temper atures with in operat ing limits.
Processor Thermal/Mechanical Information Thermal and Mechanical Design Guidelines 19 2.2.1 Processor Junction Temperature Table 2. Thermal Specifications for Intel ® Celeron ® Processor 200 Sequence Symbol Processor Number Core Frequency and Voltage Cache Thermal Design Power (W) Notes TDP 220 1.
Processor Thermal/Mechanical Information 20 Thermal and Mechanical Design Guidelines air, T A , and the local air veloci ty over the surface. The higher the air veloci ty over the surface, and the cooler the air, the more effici ent is the resulting cool ing.
Processor Thermal/Mechanical Information Thermal and Mechanical Design Guidelines 21 2.3.2 Heatsink Mass With the need to push air cooling to better performance, heatsi nk solutions tend to grow larg er (incr ease in fin surface) resultin g in increa sed mas s.
Processor Thermal/Mechanical Information 22 Thermal and Mechanical Design Guidelines 2.4 System Thermal Solution Considerations 2.4.1 Chassis Thermal Design Capabilities The reference thermal solution.
Processor Thermal/Mechanical Information Thermal and Mechanical Design Guidelines 23 By analyzing airflo w condition in an μ ATX chassis, a case study in Figure 6 shows that a chassis layout is criti cal to components cooling in the system.
Processor Thermal/Mechanical Information 24 Thermal and Mechanical Design Guidelines Figure 7. Case Study #2: Relocate System Fan to CAG Venting for A irflow Improvement Figure 8.
Processor Thermal/Mechanical Information Thermal and Mechanical Design Guidelines 25 Figure 9. Case Study #4: A “Top Mount Fa n” PSU is located next to Processor in μ ATX Chassis for System Therma l Performance Improvement 2.
Processor Thermal/Mechanical Information 26 Thermal and Mechanical Design Guidelines.
Thermal Metrology Thermal and Mechanical Design Guidelines 27 3 Thermal Metrology This se ction disc usses g uidelines for test ing ther mal solutions , including measuring processor temperatures. In all cases, the thermal engi neer must measure power dissipation and temperature to vali date a thermal solution.
Thermal Metrology 28 Thermal and Mechanical Design Guidelines For reference thermal solution of Intel Cel eron processor 200 sequence on Intel Desktop Board D201GLY2, the junction-to-local ambient the.
Thermal Metrology Thermal and Mechanical Design Guidelines 29 Figure 10 illustrate s the combin ation of the different th ermal chara cterization parameters.
Thermal Metrology 30 Thermal and Mechanical Design Guidelines To determine the required heatsink performance, a heatsink sol ution provider would need to determine Ψ JS performance for the selected TIM and mechanical load configuration. If the heatsink soluti on were designed to work with a TIM material performing at Ψ JS ≤ 0.
Thermal Metrology Thermal and Mechanical Design Guidelines 31 measureme nts will reveal a high ly non-uniform temp erature dist ribution across the inlet fan s ection. For passive heatsinks , thermocouples should be placed approximatel y 3 mm away from the heatsink as shown in Figure 12.
Thermal Metrology 32 Thermal and Mechanical Design Guidelines Figure 12. Locations for Measuring Loca l Ambient Temperature, Passive Heatsink 3M M AW AY FR O M H E AT S I N K SI D E S TOP VIEW POTISTION THERMOCOUPLES (X4) AT L O C AT I O N S AS I N D I C AT E D TO MEASURE T A .
Thermal Metrology Thermal and Mechanical Design Guidelines 33 3.3.1 Sample Preparation In order to accurately measure the processor power consumption, it is requi red to attach sense resistor and replace one of the motherboard resistors.
Thermal Metrology 34 Thermal and Mechanical Design Guidelines Figure 13. Precision Resistor Connected in -series with Processor Circuitry for Power Measurement Figure 14.
Thermal Metrology Thermal and Mechanical Design Guidelines 35 Figure 15. Probing Resistance of the Soldered Walsin Resistor (R =19.6 K Ω ) on Intel ® Desktop Board D201GLY2 to Ensure Proper Attachment Figure 16.
Thermal Metrology 36 Thermal and Mechanical Design Guidelines.
System Thermal/ Mechanical Design Informat ion Thermal and Mechanical Design Guidelines 37 4 System Thermal/Mechanical Design Information 4.1 Overview of the Reference Design This chap ter will docu ment the re quiremen ts for des igning a pas sive heatsin k that meets the maximum usage power consumption that mentioned in Secti on 2.
System Thermal/Mechanic al Design Information 38 Thermal and Mechanical Design Guidelines 4.2 Environmental Reliability Testing 4.2.1 Structural Reliability Testing Structur al reliability t ests con sist of unp ackaged , board- level vibrat ion and sho ck tests of a given th ermal solution in the asse mbled sta te.
System Thermal/ Mechanical Design Informat ion Thermal and Mechanical Design Guidelines 39 Figure 18. Shock Acceleration Curve 0 10 20 30 40 50 60 0 2 4 6 8 10 12 Ti me ( m illi s e c o n d s ) A c c e l e r a t i o n (g ) 4.2.1.2.1 Recommended Test Sequence Each test sequence should start with components (i.
System Thermal/Mechanic al Design Information 40 Thermal and Mechanical Design Guidelines 4.2.2 Power Cycling Thermal performance degradation due to TIM degradation i s evaluated using power cycling testing. The test i s defined by 7500 cycles for the heatsink temperature from room temperature (~23 ºC) to T S-TOP-MAX at usage power consumption.
System Thermal/ Mechanical Design Informat ion Thermal and Mechanical Design Guidelines 41 4.4 Safety Requirements Heatsink and attachment assemblies shall be consistent with the manufacture of units that meet the safety standards: • UL Recog nition-app roved for flammability at th e system le vel.
System Thermal/Mechanic al Design Information 42 Thermal and Mechanical Design Guidelines.
Heatsink Clip Load Metrology Thermal and Mechanical Design Guidelines 43 Appendix A Heatsink Clip Load Metrology A.1 Overview The primary objective of the preload measur ement is to ensure the prel oad designed into the re tention me chanism is able to meet minimum o f 8.
Heatsink Clip Load Metrology 44 Thermal and Mechanical Design Guidelines Table 5. Typical Test Equipment 7. Item 18. Description 9 . Part Number (Model) 20. Load cell 21. Notes: 1, 5 22. Honeywell*-Sensotec* Model 13 subminiature load cells, compression only 23.
Heatsink Clip Load Metrology Thermal and Mechanical Design Guidelines 45 A.3 Test Procedure Examples The following proced ure is for a generic z- clip solut ion using the clip force time0 measurement machine at room temperature: 1. Install anchors onto top plate.
Heatsink Clip Load Metrology 46 Thermal and Mechanical Design Guidelines Figure 20. Anchors Installed and Glued Down the BTX Base Plate – for reference only §.
Intel® Enabled Boxed Processor Thermal Solut ion Information Thermal and Mechanical Design Guidelines 47 Appendix B Intel ® Enabled Boxed Processor Thermal Solution Information This ap pendix inc ludes sup plier inform ation for I ntel enab led vend ors.
Intel® Enabled Boxed Processor Thermal Solut ion Information 48 Thermal and Mechanical Design Guidelines.
Mechanical Drawings Thermal and Mechanical Design Guidelines 49 Appendix C Mechanical Drawings The following table list s the mec hanical dra wings includ ed in this append ix. These drawings refer to the reference thermal mechanical enabl ing components for the processor.
Mechanical Drawings 50 Thermal and Mechanical Design Guidelines Figure 21. Motherboard Keep-out Footprin t Definition and Height Restrictions for Enabling Components.
Mechanical Drawings Thermal and Mechanical Design Guidelines 51 Figure 22. Reference Clip E21952-001.
Mechanical Drawings 52 Thermal and Mechanical Design Guidelines Figure 23. Reference Heatsink D96271-001.
Mechanical Drawings Thermal and Mechanical Design Guidelines 53 Figure 24. Intel ® Boxed Processor Thermal Solution E21953-001 §.
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