IntelメーカーLGA 771の使用説明書/サービス説明書
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Reference Number: 31 3871-002 LGA771 Socket Mechanical Design Guide November, 2006.
2 LGA 771 Socket Mechanical Design Guide INFORMA TION IN THIS DOCUMENT IS PROVIDED IN CONNE CTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPL IED, BY ESTOPPEL OR O THERWISE, TO ANY INTELLECTUAL PROPER TY RIGHTS IS GRANTED BY THIS DOCUMENT .
LGA 771 Socket Mechanical Design Guide 3 Contents 1 Introduction.......... ............. .......... ........... ............ ........... ........... .......... ............. .......... .. 7 1.1 Document Goals and Scop e ........... ............ ......
4 LGA 771 Socket Mechanical Design Guide Figures 3-1 Cross-sectional view of Package / Socket stackup height 1 ... ........... .......... ........... .... 15 3-2 Definition of R ........... .......... ........... ............ ........... .......... ..
LGA 771 Socket Mechanical Design Guide 5 Revision History § Revision Description Date 001 • Initial release of the document. June 2006 002 • Updated Dual-Core 5000 & 5 100 Series stackup heig.
6 LGA 771 Socket Mechanical Design Guide.
LGA 771 Socket Mechanical Design Guide 7 Introduction 1 Introduction 1.1 Document Goals and Scope 1.1.1 LGA771 Socket Overview This document describes a surface mount, LGA (Land Grid Arr ay) socket intended for the Dual-Core Intel ® Xe on ® Processor 5000 Sequence F amily for Servers and W orkstations.
Introduction 8 LGA 771 Socket Mechanical Design Guide 1.2 Terminology 1.3 Reference Documents Note: Contact your Intel representative for the latest revisions of these documents. § Term Description LGA771 Socket Processor in the 771-land package ma tes with the system board through a surface mount, 771-pin, LG A (land grid arr ay) socket.
LGA 771 Socket Mechanical Design Guide 9 Assembled Component and Packa ge Description 2 Assembled Component and Package Description The LGA771 Socket dimensions and char acterist ics must be compatible with that of the processor package and related assembly components.
Assembled Component and Pa ckage Description 10 LGA 771 Socket Mechanical Design Guide.
LGA 771 Socket Mechanical Design Guide 11 Mechanical Requirements 3 Mechanical Requirements 3.1 Attachment The socket will be tested against the me chanical shock and vibr ation requirements listed in Section 5 under the expected use conditions with a heatsink and retention mechanism attached under the loading conditions outlined in Section 3.
Mechanical Requirements 12 LGA 771 Socket Mechanical Design Guide operating temper ature, while mounted on an FR4-type motherboard material. The creep properties of the material must be such that the mechanical integrity of th e socket is maintained for the use condition outlined in Section 5 .
LGA 771 Socket Mechanical Design Guide 13 Mechanical Requirements 3.2.1.4.2 Lot Traceability Each socket will be mark ed with a lot identification code to allow traceability of all components, date of manufacture (y ear and week), and assembly location.
Mechanical Requirements 14 LGA 771 Socket Mechanical Design Guide The stiffener plate is made of stainless steel SUS 301. The stiffener plate provides the interface to the load lever and the load plat e and creates the primary stiffening element to react to the load gener ated by the load plate.
LGA 771 Socket Mechanical Design Guide 15 Mechanical Requirements 3.5 Package/Socket Stac kup Height Ta b l e 3 - 1 pro vides the stackup height of the processor package and LGA771 socket.
Mechanical Requirements 16 LGA 771 Socket Mechanical Design Guide Notes: 1. These specifications ap ply to un iform compressive loading in a dire ction perpendicular to the IHS top surface. 2. This is the minimum and maximum static force that ca n be applied b y the heatsink and retention sol ution to maintain the heatsink and processor int erface.
LGA 771 Socket Mechanical Design Guide 17 Mechanical Requirements § Figure 3-2. Definition of R.
Mechanical Requirements 18 LGA 771 Socket Mechanical Design Guide.
LGA 771 Socket Mechanical Design Guide 19 Electrical Requirements 4 Electrical Requirements Ta b l e 4 - 1 provides the L GA771 Socket electrical requirements. Socket electrical requirements are measured from the socket -seating plane of the processor to the component side of the PCB to which it is attached.
Electrical Requirements 20 LGA 771 Socket Mechanical Design Guide.
LGA 771 Socket Mechanical Design Guide 21 Environmental Requirements 5 Environmental Requirements Design, including materials, shall be consiste nt with the manufacture of units that meet the following environmental reference points. The reliability targets in this section are based on the expected field use environment for a server product.
Environmental Requirements 22 LGA 771 Socket Mechanical Design Guide Note: These reliability requirements are given as examples only based on speculative use condition as sumptions.
LGA 771 Socket Mechanical Design Guide 23 Environmental Requirements 5.1 Solvent Resistance R equirement: No damage to ink markings if applicable. EIA 364-11A. 5.2 Durability Use per EIA-364, test procedure 09. Measure contact resistance when mated in 1st and 30th cycles.
Environmental Requirements 24 LGA 771 Socket Mechanical Design Guide.
LGA 771 Socket Mechanical Design Guide 25 Mechanical Drawings A Mechanical Drawings The following table lists the mechanical drawings included in this section. These drawings refer to the LGA771 socket. Note: Intel reserves the right to mak e changes and modifications to the design as necessary .
Mechanical Drawings 26 LGA 771 Socket Mechanical Design Guide Figure A-1. LGA Socket Asse mbly Drawing (Sheet 1 of 4).
LGA 771 Socket Mechanical Design Guide 27 Mechanical Drawings Figure A-2. LGA Socket Assembly Drawing (Sheet 2 of 4).
Mechanical Drawings 28 LGA 771 Socket Mechanical Design Guide Figure A-3. LGA Socket Asse mbly Drawing (Sheet 3 of 4).
LGA 771 Socket Mechanical Design Guide 29 Mechanical Drawings Figure A-4. LGA Socket Assembly Drawing (Sheet 4 of 4).
Mechanical Drawings 30 LGA 771 Socket Mechanical Design Guide Figure A-5. LGA771 Socket Moth erboard Footprint (Sheet 1 of 7).
LGA 771 Socket Mechanical Design Guide 31 Mechanical Drawings Figure A-6. LG A771 Socket Motherboard Fo otprint (Sheet 2 of 7).
Mechanical Drawings 32 LGA 771 Socket Mechanical Design Guide Figure A-7. LGA771 Socket Moth erboard Footprint (Sheet 3 of 7).
LGA 771 Socket Mechanical Design Guide 33 Mechanical Drawings Figure A-8. LG A771 Socket Motherboard Fo otprint (Sheet 4 of 7.
Mechanical Drawings 34 LGA 771 Socket Mechanical Design Guide Figure A-9. LGA771 Socket Moth erboard Footprint (Sheet 5 of 7).
LGA 771 Socket Mechanical Design Guide 35 Mechanical Drawings Figure A-10. LGA771 Socket Motherboard Footprint (She et 6 of 7).
Mechanical Drawings 36 LGA 771 Socket Mechanical Design Guide Figure A-11. LGA 771 So cket Moth erboard Footprint (Sheet 7 of 7).
LGA 771 Socket Mechanical Design Guide 37 Mechanical Drawings Figure A-12. LGA 771 Socket Footprin t (Sheet 1 of 2).
Mechanical Drawings 38 LGA 771 Socket Mechanical Design Guide § Figure A-13. LGA 771 So cket Footprint (Sheet 2 of 2).
デバイスIntel LGA 771の購入後に（又は購入する前であっても）重要なポイントは、説明書をよく読むことです。その単純な理由はいくつかあります：
Intel LGA 771をまだ購入していないなら、この製品の基本情報を理解する良い機会です。まずは上にある説明書の最初のページをご覧ください。そこにはIntel LGA 771の技術情報の概要が記載されているはずです。デバイスがあなたのニーズを満たすかどうかは、ここで確認しましょう。Intel LGA 771の取扱説明書の次のページをよく読むことにより、製品の全機能やその取り扱いに関する情報を知ることができます。Intel LGA 771で得られた情報は、きっとあなたの購入の決断を手助けしてくれることでしょう。
Intel LGA 771を既にお持ちだが、まだ読んでいない場合は、上記の理由によりそれを行うべきです。そうすることにより機能を適切に使用しているか、又はIntel LGA 771の不適切な取り扱いによりその寿命を短くする危険を犯していないかどうかを知ることができます。
ですが、ユーザガイドが果たす重要な役割の一つは、Intel LGA 771に関する問題の解決を支援することです。そこにはほとんどの場合、トラブルシューティング、すなわちIntel LGA 771デバイスで最もよく起こりうる故障・不良とそれらの対処法についてのアドバイスを見つけることができるはずです。たとえ問題を解決できなかった場合でも、説明書にはカスタマー・サービスセンター又は最寄りのサービスセンターへの問い合わせ先等、次の対処法についての指示があるはずです。
