CypressメーカーCY7C1370Dの使用説明書/サービス説明書
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18-Mbit (512K x 36/1M x 18) Pipelined SRAM with NoBL™ Architecture CY7C1370D CY7C1372D Cypress Semiconductor Corpora tion • 198 Champion Cou rt • San Jose , CA 95134-1 709 • 408-943-2 600 Document #: 38-05555 Rev .
CY7C1370D CY7C1372D Document #: 38-05555 Rev . *F Page 2 of 28 Selection Guide 250 MHz 200 MHz 167 MHz Unit Maximum Access T ime 2.6 3.0 3.4 ns Maximum Operating Curren t 350 300 275 mA Maximum CMOS S.
CY7C1370D CY7C1372D Document #: 38-05555 Rev . *F Page 3 of 28 Pin Configurations A A A A A 1 A 0 V SS V DD A A A A A A V DDQ V SS DQb DQb DQb V SS V DDQ DQb DQb V SS NC V DD DQa DQa V DDQ V SS DQa DQ.
CY7C1370D CY7C1372D Document #: 38-05555 Rev . *F Page 4 of 28 Pin Configurations (continued) 234 5 6 7 1 A B C D E F G H J K L M N P R T U DQ a V DDQ NC/576 M NC/1G DQ c DQ d DQ c DQ d AA A A AV DDQ .
CY7C1370D CY7C1372D Document #: 38-05555 Rev . *F Page 5 of 28 Pin Configurations (continued) 234 5 67 1 A B C D E F G H J K L M N P R TDO NC/576M NC/1G DQP c DQ c DQP d NC DQ d A CE 1 BW b CE 3 BW c .
CY7C1370D CY7C1372D Document #: 38-05555 Rev . *F Page 6 of 28 Pin Definitions Pin Name I/O T ype Pin Description A0 A1 A Input- Synchronous Address Inputs used to select one of the addres s locations . Sa mpled at the rising e dge of the CLK. BW a BW b BW c BW d Input- Synchronous Byte Write Select Input s, active LOW .
CY7C1370D CY7C1372D Document #: 38-05555 Rev . *F Page 7 of 28 Introduction Functional Overview The CY7C1370D and C Y7C1372D are synchronous-pipeli ned Burst NoBL SRAMs designed specifically to eliminate wait states during Write/Read transi tions. All synchronous input s pass through input registers co ntrolled by the rising ed ge of the clock.
CY7C1370D CY7C1372D Document #: 38-05555 Rev . *F Page 8 of 28 Asserting the Write Enable input (WE ) with the selected Byte Write Select (BW ) input will selectively write to only the desired bytes. Bytes not selected during a byte write operation will remain unaltered.
CY7C1370D CY7C1372D Document #: 38-05555 Rev . *F Page 9 of 28 Notes: 1. X = “Don't Care”, H = Lo gic HIGH, L = Logic L OW , CE stands fo r ALL Chip Ena bles active.
CY7C1370D CY7C1372D Document #: 38-05555 Rev . *F Page 10 of 28 Partial Write Cycle Description [1, 2, 3, 8] Function (CY7C1370D) WE BW d BW c BW b BW a Read H X X X X Write – No bytes written L H H.
CY7C1370D CY7C1372D Document #: 38-05555 Rev . *F Page 1 1 of 28 IEEE 1 149.1 Serial Boundary Scan (JT AG) The CY7C1370D/CY7C1372D incorpora tes a serial boundary scan test access por t (T AP). This p art is fully compliant with 1 149.1. The T AP operates using JEDEC-standard 3.
CY7C1370D CY7C1372D Document #: 38-05555 Rev . *F Page 12 of 28 When the T AP controller is in the Capture-IR state, the two least significant bits are loaded with a binary “01” pattern to allow for fault isolation of the board -level serial test data path.
CY7C1370D CY7C1372D Document #: 38-05555 Rev . *F Page 13 of 28 in the T AP controller , i t will directly control the state of the output (Q-bus) pins, when t he EXTEST is entered as the current instruction. When HIGH, it will e nable the output buffers to drive the output bus.
CY7C1370D CY7C1372D Document #: 38-05555 Rev . *F Page 14 of 28 3.3V T AP AC T est Conditions Input pulse levels ... ............... .............. .............. .. V SS to 3.3V Input rise and fall times ......... ........ ........... ... ...........
CY7C1370D CY7C1372D Document #: 38-05555 Rev . *F Page 15 of 28 Identification Register Definitions Instruction Field CY7C137 2D CY7C1370D Description Revision Number (31:29) 000 000 Reserved for version number . Cypress Device ID (28:12) [12] 0101 1001000100101 0101 1001000010101 Reserved for future use.
CY7C1370D CY7C1372D Document #: 38-05555 Rev . *F Page 16 of 28 1 19-Ball BGA Boundary Scan Order [13, 14] Bit # Ball ID Bit # Ball ID Bit # Ball ID Bit # Ball ID 1 H4 23 F6 45 G4 67 L1 2T 4 2 4 E 7 4.
CY7C1370D CY7C1372D Document #: 38-05555 Rev . *F Page 17 of 28 165-Ball BGA Boundary Scan Order [13, 15] Bit # Ball ID Bit # Ball ID Bit # Ball ID 1N 6 3 1 D 1 0 6 1G 1 2N 7 3 2 C 1 1 6 2 D 2 3N 1 0 .
CY7C1370D CY7C1372D Document #: 38-05555 Rev . *F Page 18 of 28 Maximum Ratings (Above which the useful life may be impaired. For user guide- lines, not tested.) S torage T e mperature ............. .............. ...... –65 °C to +150°C Ambient T emperature with Power Applied .
CY7C1370D CY7C1372D Document #: 38-05555 Rev . *F Page 19 of 28 Note: 18. T ested initially and af ter any design or proc ess chan ge that may affect these p arameters. Cap acit ance [18] Parameter Description T est Conditions 1 00 TQ FP Max. 1 19 BGA Max.
CY7C1370D CY7C1372D Document #: 38-05555 Rev . *F Page 20 of 28 Switching Characteristics Over the Operating Range [23, 24] Parameter Descriptio n –250 –200 –167 Unit Min. Max. Min. Max. Min. Max. t Power [19] V CC (typical) to the first access read or write 1 1 1 ms Clock t CYC Clock Cycle T ime 4.
CY7C1370D CY7C1372D Document #: 38-05555 Rev . *F Page 21 of 28 Switching W aveforms Read/Wri te/Timing [25, 26, 27] Notes: 25. For this waveform ZZ is tied LOW. 26. When C E is LOW, CE 1 is LOW , C E 2 is HIGH and CE 3 is LOW . When CE is HIGH,CE 1 is HIGH or CE 2 is LOW or CE 3 is HIGH.
CY7C1370D CY7C1372D Document #: 38-05555 Rev . *F Page 22 of 28 Notes: 28. The Ignore Clock Edge or St all cycle (Clock 3) illustrated CEN being used to create a p ause. A write is not perfor m ed durin g this cycle. 29. Device must be deselected when entering ZZ mode.
CY7C1370D CY7C1372D Document #: 38-05555 Rev . *F Page 23 of 28 Ordering Information Not all of the spe ed, package and temperature ran ges are available. Please contact your local sales r epresentative or visit www .cypress.com for actual pro duct s offered.
CY7C1370D CY7C1372D Document #: 38-05555 Rev . *F Page 24 of 28 250 CY7C1370D-250AXC 51-8 5050 100-pin Thin Quad Flat Pack (14 x 20 x 1.4 mm) Lead-Free Commercial CY7C1372D-250AXC CY7C1370D-250BGC 51-851 15 1 1 9-ball Ball Grid Array (14 x 22 x 2.4 mm) CY7C1372D-250BGC CY7C1370D-250BGXC 51-851 15 1 1 9-ball Ball Grid Array (14 x 22 x 2.
CY7C1370D CY7C1372D Document #: 38-05555 Rev . *F Page 25 of 28 Package Diagrams NOTE: 1. JEDEC STD REF MS-026 2. BODY LENGTH DIMENSION DOES NOT INCLUDE MOLD PROTRUSION/END FLASH MOLD PROTRUSION/END FLASH SHALL NOT EXCEED 0.0098 in (0.25 mm) PER SIDE 3.
CY7C1370D CY7C1372D Document #: 38-05555 Rev . *F Page 26 of 28 Package Diagrams (continued) 1.27 20.32 2 16 5 4 37 L E A B D C H G F K J U P N M T R 12.00 19.50 30° TYP. 2.40 MAX. A1 CORNER 0.70 REF. U T R P N M L K J H G F E D C A B 21 43 65 7 Ø1.
CY7C1370D CY7C1372D Document #: 38-05555 Rev . *F Page 27 of 28 © Cypress Semi con duct or Cor po rati on , 20 06 . The information con t a in ed he re i n is su bject to change wi t hou t n oti ce.
CY7C1370D CY7C1372D Document #: 38-05555 Rev . *F Page 28 of 28 Document History Page Document Title: CY7C1372D/CY7C1370D 18-Mbit (512 K x 36/1M x 18) Pipelined SRAM with NoBL™ Architecture Document Number: 38-05555 REV .
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Cypress CY7C1370Dをまだ購入していないなら、この製品の基本情報を理解する良い機会です。まずは上にある説明書の最初のページをご覧ください。そこにはCypress CY7C1370Dの技術情報の概要が記載されているはずです。デバイスがあなたのニーズを満たすかどうかは、ここで確認しましょう。Cypress CY7C1370Dの取扱説明書の次のページをよく読むことにより、製品の全機能やその取り扱いに関する情報を知ることができます。Cypress CY7C1370Dで得られた情報は、きっとあなたの購入の決断を手助けしてくれることでしょう。
Cypress CY7C1370Dを既にお持ちだが、まだ読んでいない場合は、上記の理由によりそれを行うべきです。そうすることにより機能を適切に使用しているか、又はCypress CY7C1370Dの不適切な取り扱いによりその寿命を短くする危険を犯していないかどうかを知ることができます。
ですが、ユーザガイドが果たす重要な役割の一つは、Cypress CY7C1370Dに関する問題の解決を支援することです。そこにはほとんどの場合、トラブルシューティング、すなわちCypress CY7C1370Dデバイスで最もよく起こりうる故障・不良とそれらの対処法についてのアドバイスを見つけることができるはずです。たとえ問題を解決できなかった場合でも、説明書にはカスタマー・サービスセンター又は最寄りのサービスセンターへの問い合わせ先等、次の対処法についての指示があるはずです。