CypressメーカーCY7C1383DV25の使用説明書/サービス説明書
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18-Mbit (512K x 36/1M x 18) Flow-Through SRAM CY7C1381DV25, CY7C1381FV25 CY7C1383DV25, CY7C1383FV25 Cypress Semiconductor Corpora tion • 198 Champion Cou rt • San Jose , CA 95134-1 709 • 408-943-2 600 Document #: 38-05547 Rev . *E Revised Feburary 14, 2007 Features • Supports 133 MHz bus operations • 512K x 36/1M x 18 co mmon IO • 2.
CY7C1381DV25, CY7C1381FV25 CY7C1383DV25, CY7C1383FV25 Document #: 38-05547 Rev . *E Page 2 of 28 Logic Block Diagram – CY7C1381DV25 /CY7C1381FV25 [3 ] (512K x 36) Logic Block Diagram – CY7C1383DV2.
CY7C1381DV25, CY7C1381FV25 CY7C1383DV25, CY7C1383FV25 Document #: 38-05547 Rev . *E Page 3 of 28 Pin Configurations A A A A A 1 A 0 NC NC V SS V DD A A A A A A A A DQP B DQ B DQ B V DDQ V SSQ DQ B DQ .
CY7C1381DV25, CY7C1381FV25 CY7C1383DV25, CY7C1383FV25 Document #: 38-05547 Rev . *E Page 4 of 28 Pin Configurations (continued) 234 5 6 7 1 A B C D E F G H J K L M N P R T U V DDQ NC/288M NC/144M DQP .
CY7C1381DV25, CY7C1381FV25 CY7C1383DV25, CY7C1383FV25 Document #: 38-05547 Rev . *E Page 5 of 28 Pin Configurations (continued) 165-Ball FBGA Pinout (3 Chip Enable) CY7C1381DV25 (512 K x 36) 234 567 1.
CY7C1381DV25, CY7C1381FV25 CY7C1383DV25, CY7C1383FV25 Document #: 38-05547 Rev . *E Page 6 of 28 Pin Definitions Name IO Description A 0 , A 1 , A Input- Synchronous Address inputs used to select one of the address locations . Sampled at the rising edge of the CLK if ADSP or ADSC is active LOW , and CE 1 , CE 2 , and CE 3 [2] are sampled active.
CY7C1381DV25, CY7C1381FV25 CY7C1383DV25, CY7C1383FV25 Document #: 38-05547 Rev . *E Page 7 of 28 Functional Overview All synchronous inpu ts pass through input registers controlled by the rising edge of the clock. Maximum a ccess delay from the clock rise (t CDV ) is 6.
CY7C1381DV25, CY7C1381FV25 CY7C1383DV25, CY7C1383FV25 Document #: 38-05547 Rev . *E Page 8 of 28 and the IOs must be tri-stated prior to the presentation of data to DQs. As a safety precauti on, the data lines are tri-stated once a write cycle is detected, regardless of the st ate of OE .
CY7C1381DV25, CY7C1381FV25 CY7C1383DV25, CY7C1383FV25 Document #: 38-05547 Rev . *E Page 9 of 28 T ruth T able [4, 5, 6, 7, 8] Cycle Description Address Used CE 1 CE 2 CE 3 ZZ ADSP ADSC ADV WRITE OE C.
CY7C1381DV25, CY7C1381FV25 CY7C1383DV25, CY7C1383FV25 Document #: 38-05547 Rev . *E Page 10 of 28 T ruth T able for Read/Write [4, 9] Function (CY7C1381DV25 /CY7C1381FV25) GW BWE BW D BW C BW B BW A R.
CY7C1381DV25, CY7C1381FV25 CY7C1383DV25, CY7C1383FV25 Document #: 38-05547 Rev . *E Page 1 1 of 28 IEEE 1 149.1 Serial Boundary Scan (JT AG) The CY7C1381DV25/C Y7C1383DV25 incorporate s a serial boundary scan test access port (T AP). This part is fully compliant with 1 14 9.
CY7C1381DV25, CY7C1381FV25 CY7C1383DV25, CY7C1383FV25 Document #: 38-05547 Rev . *E Page 12 of 28 When the T AP controller is in the Capture -IR state, the two least significant bits are loaded with a binary ‘01’ pattern to allow for fault isolati on of the board level serial test data path.
CY7C1381DV25, CY7C1381FV25 CY7C1383DV25, CY7C1383FV25 Document #: 38-05547 Rev . *E Page 13 of 28 the T AP co ntroller , it will direct ly control the state of the output (Q-bus) pins, when the EXTEST is entered as the current instruction. When HIGH, it will en able the output buffers to drive the output bus.
CY7C1381DV25, CY7C1381FV25 CY7C1383DV25, CY7C1383FV25 Document #: 38-05547 Rev . *E Page 14 of 28 2.5V T AP AC T est Conditions Input pulse levels ........................ .............. ...........V SS to 2.5V Input rise and fall time .............. .
CY7C1381DV25, CY7C1381FV25 CY7C1383DV25, CY7C1383FV25 Document #: 38-05547 Rev . *E Page 15 of 28 Identification Codes Instruction Code Description EXTEST 0 00 Captures IO ring contents. Places th e boundary scan register between TDI and TDO. Forces all SRAM outputs to High-Z state.
CY7C1381DV25, CY7C1381FV25 CY7C1383DV25, CY7C1383FV25 Document #: 38-05547 Rev . *E Page 16 of 28 165-Ball BGA Boundary Scan Order [13, 15] Bit # Ball ID Bit # Ball ID Bit # Ball ID 1 N6 31 D10 61 G1 .
CY7C1381DV25, CY7C1381FV25 CY7C1383DV25, CY7C1383FV25 Document #: 38-05547 Rev . *E Page 17 of 28 Maximum Ratings Exceeding the maximum ratings may impair the useful life of the device. For user guideline s, not tested. S torage T emperature .........
CY7C1381DV25, CY7C1381FV25 CY7C1383DV25, CY7C1383FV25 Document #: 38-05547 Rev . *E Page 18 of 28 Cap acit ance [18] Parameter Description T est Conditio ns 100 TQFP Package 1 19 BGA Package 165 FBGA Package Unit C IN Input Capa citance T A = 25°C, f = 1 MHz, V DD /V DDQ = 2.
CY7C1381DV25, CY7C1381FV25 CY7C1383DV25, CY7C1383FV25 Document #: 38-05547 Rev . *E Page 19 of 28 Switching Characteristics Over the Operating Range [19, 20] Parameter Descriptio n 133 MHz 100 MHz Unit Min. Max. Min. Max. t POWER V DD (T ypical) to the first Access [21] 11 m s Clock t CYC Clock Cycle T ime 7.
CY7C1381DV25, CY7C1381FV25 CY7C1383DV25, CY7C1383FV25 Document #: 38-05547 Rev . *E Page 20 of 28 Ti ming Diagrams Read Cycle Timing [25] t CYC t CL CLK t ADH t ADS ADDRESS t CH t AH t AS A1 t CEH t C.
CY7C1381DV25, CY7C1381FV25 CY7C1383DV25, CY7C1383FV25 Document #: 38-05547 Rev . *E Page 21 of 28 Write Cycle T iming [25, 26] Ti ming Diagrams (continued) t CYC t CL CLK t ADH t ADS ADDRESS t CH t AH.
CY7C1381DV25, CY7C1381FV25 CY7C1383DV25, CY7C1383FV25 Document #: 38-05547 Rev . *E Page 22 of 28 Read/Write Cycle Timing [25, 27, 28] Ti ming Diagrams (continued) t CYC t CL CLK t ADH t ADS ADDRESS t.
CY7C1381DV25, CY7C1381FV25 CY7C1383DV25, CY7C1383FV25 Document #: 38-05547 Rev . *E Page 23 of 28 ZZ Mode T iming [29, 30] Ti ming Diagrams (continued) t ZZ I SUPPLY CLK ZZ t ZZREC ALL INPUTS (except ZZ) DON’T CARE I DDZZ t ZZI t RZZI Outputs (Q) High-Z DESELECT or READ Only Notes 29.
CY7C1381DV25, CY7C1381FV25 CY7C1383DV25, CY7C1383FV25 Document #: 38-05547 Rev . *E Page 24 of 28 Ordering Information Not all of the speed, package, and temperature rang es are availabl e. Please contact your local sales representa tive or visit www .
CY7C1381DV25, CY7C1381FV25 CY7C1383DV25, CY7C1383FV25 Document #: 38-05547 Rev . *E Page 25 of 28 Package Diagrams Figure 1. 100-Pin Thin Plastic Quad Flat pack (14 x 20 x 1.4 mm) (51-85050) NOTE: 1. JEDEC STD REF MS-026 2. BODY LENGTH DIMENSION DOES NOT INCLUDE MOLD PROTRUSION/END FLASH MOLD PROTRUSION/END FLASH SHALL NOT EXCEED 0.
CY7C1381DV25, CY7C1381FV25 CY7C1383DV25, CY7C1383FV25 Document #: 38-05547 Rev . *E Page 26 of 28 Figure 2. 1 19-Ball BGA ( 14 x 22 x 2.4 mm) (51-851 15) Package Diagrams (continued) 51-851 15-*B [+] .
CY7C1381DV25, CY7C1381FV25 CY7C1383DV25, CY7C1383FV25 Document #: 38-05547 Rev . *E Page 27 of 28 © Cypress Semicon ductor Corpor ation, 2006- 2007. The inform ation cont ained herein is subject to change wi thout notic e.
CY7C1381DV25, CY7C1381FV25 CY7C1383DV25, CY7C1383FV25 Document #: 38-05547 Rev . *E Page 28 of 28 Document History Page Document Title: CY7C1381DV25/CY7C1383DV25/CY7C13 81FV25/CY7C1 383FV25, 18-Mb it (512K x 36/1M x 18) Flow-Through SRAM Document Number: 38-05547 REV .
デバイスCypress CY7C1383DV25の購入後に（又は購入する前であっても）重要なポイントは、説明書をよく読むことです。その単純な理由はいくつかあります：
Cypress CY7C1383DV25をまだ購入していないなら、この製品の基本情報を理解する良い機会です。まずは上にある説明書の最初のページをご覧ください。そこにはCypress CY7C1383DV25の技術情報の概要が記載されているはずです。デバイスがあなたのニーズを満たすかどうかは、ここで確認しましょう。Cypress CY7C1383DV25の取扱説明書の次のページをよく読むことにより、製品の全機能やその取り扱いに関する情報を知ることができます。Cypress CY7C1383DV25で得られた情報は、きっとあなたの購入の決断を手助けしてくれることでしょう。
Cypress CY7C1383DV25を既にお持ちだが、まだ読んでいない場合は、上記の理由によりそれを行うべきです。そうすることにより機能を適切に使用しているか、又はCypress CY7C1383DV25の不適切な取り扱いによりその寿命を短くする危険を犯していないかどうかを知ることができます。
ですが、ユーザガイドが果たす重要な役割の一つは、Cypress CY7C1383DV25に関する問題の解決を支援することです。そこにはほとんどの場合、トラブルシューティング、すなわちCypress CY7C1383DV25デバイスで最もよく起こりうる故障・不良とそれらの対処法についてのアドバイスを見つけることができるはずです。たとえ問題を解決できなかった場合でも、説明書にはカスタマー・サービスセンター又は最寄りのサービスセンターへの問い合わせ先等、次の対処法についての指示があるはずです。
