HP (Hewlett-Packard)メーカー646676001の使用説明書/サービス説明書
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HP Pr oL ian t ML3 5 0p Gen8 S er v er Maint enance and S er v i ce Guide Abstract This document is for the person who installs, administers, and tr oubleshoots servers and stor age systems. This document is in tended for experienced IT professionals or end - users with no or prior hardware setup experience.
© Copyright 2012, 2013 He wlett- Packard Development Company, L.P. The information contained herei n is subject to change without notice. The only warranties for HP products and service s are set forth in the expres s warranty statements accompanyin g such products and services.
Contents 3 Con tents Customer self repair ...................................................................................................................... 5 Parts only warranty service ............................................................
Contents 4 System battery ........................................................................................................................................ 70 HP Trusted Platform Module ..........................................................
Customer self repair 5 C u st omer s elf r epair HP products are desig ned with many Customer Se lf Repair (CSR) parts t o minimize repair time and allow for greater flexibi lity in performing def ective parts replace ment.
Customer self repair 6 Obligatoire - P ièces pour lesquelles la ré paration par le client est ob ligatoire. Si vous demand ez à HP de remplacer c es pièces, les c oûts de déplacemen t et main d'œuvre d u service vous ser ont facturés. Facultatif - Piè ces pour lesquell es la réparati on par le client est facultative.
Customer self repair 7 In base alla dispo nib ilità e alla località g eografica, le parti CSR v engono spedite con cons egna entro il giorno lavorat ivo seguente. La conse gna nel giorno stesso o entro quattro ore è o fferta con un sup plemento di costo solo in a lcune zone.
Customer self repair 8 defekte Teil nicht zurückschicken, kann HP Ihnen das Er s atzteil in Rechnung stel len. Im Falle von Custome r Self Repair ko mmt HP für alle Kost en für die Liefer ung und Rücksend ung auf und best immt den Kurier- /Frachtdienst.
Customer self repair 9 enviara el componente defe ctuoso requerido, HP p odrá cobrarle por el de sustit ución. En el caso de todas sustitucion es que lleve a ca bo el cliente, H P se hará cargo de todos l os gastos de env ío y devolución d e componentes y esco gerá la empresa de transpo rte que se utilice par a dich o servicio.
Customer self repair 10 Neem contact op met e en Service Partne r voor meer informatie over het Customer Se lf Repair programma van HP. Informatie o ver Service Partners vindt u op de HP website ( http://www.
Customer self repair 11 No caso desse se rviço, a substituição de pe ças CSR é obrig atória. Se desejar qu e a HP substitua es sas peças, serão cobradas as despesas de transport e e mão - de - obra do serviç o.
Customer self repair 12.
Customer self repair 13.
Customer self repair 14.
Illustrated parts catalog 15 I llus tr ated parts catalog Mechanical components Item Description Spare part number Customer self repair (on page 5 ) 1 Front bezel 667267 - 001 Mandatory 1 2 Second opt.
Illustrated parts catalog 16 Item Description Spare part number Customer self repair (on page 5 ) c) T - 10 screws (4)* — — d) T - 15 screws ( 4)* — — e) Discovery se rvice cable* — — f) S.
Illustrated parts catalog 17 sustitución, pue de o no conlle var costes ad icionales, de pendiendo del t ipo de servicio de garantía correspondiente al producto. 3 No: No — Algunos componentes no están dise ñados para que puedan ser repar ados por el usuario.
Illustrated parts catalog 18 S ystem components Item Description Spare part number Customer self repair (on page 5 ) 13 Power supplies — — a) HP 460W C S Gold (92% e fficiency ) 511777 - 001 Manda.
Illustrated parts catalog 19 Item Description Spare part number Customer self repair (on page 5 ) g) 2.3GHz Intel Xeon E5 - 2630 processor, 6C, 95W* 670528 - 001 Optional 2 h) 2.5 GHz Intel Xeon E5 - 2640 processor, 6C, 95W* 670527 - 001 Optional 2 i) 2.
Illustrated parts catalog 20 Item Description Spare part number Customer self repair (on page 5 ) 24 Power cable * 667259 - 001 Optional 2 25 SATA cable* 667265 - 001 Mandatory 1 26 SFF drive backpl a.
Illustrated parts catalog 21 2 Optional: Optiona l — Teile, für die das Customer Self Repair - Verfahren optional ist. Diese Teile si nd auch für Customer Self Repair ausgelegt.
Illustrated parts catalog 22.
Removal an d replacement procedures 23 R emo v al and r eplacemen t pr ocedur es Required tools You need the following it ems for some procedur es: • T- 10 Torx screwdriver • T- 15 Torx screwdrive.
Removal an d replacement procedures 24 This symbol on an R J- 45 receptacle indicates a network i nterface connection. WARNING: To reduce the ri sk of electric shock, fire, or dama ge to the equipment, do not plug telephone or telecommunicatio ns connectors into this receptacle.
Removal an d replacemen t procedures 25 • Power down the serv er (on page 25 ). If you must remove a server from a rack or a no n - hot - plug component from a serv er, power d own the server. • Remove the to wer bezel (on page 26 ). • Remove the r ack bezel.
Removal an d replacement procedures 26 R emove the security bezel Unlock the security bezel, press the latch on the security bezel, and then remove the security bez el. R emove the tower bezel This server ha s a removable bezel that must be unlocke d and opened before acc essing the hard driv es.
Removal an d replacement procedures 27 3. Remove all power: a. Disconnect each power co rd from the power sourc e. b. Disconne ct each power cor d from the server. 4. Extend the server from the rack (on pag e 27 ). 5. Remove the a ccess panel (" Access panel " on page 28 ).
Removal an d replacement procedures 28 3. After performing the installation or maintenanc e procedure, slide the server back i nto the rack, and then press the serv er firmly into th e rack to secure it in place.
Removal an d replacement procedures 29 To replace the compon ent, reverse the removal procedure. A ir baffle To remove the component: 1. Do one of the followin g: o For tower models, open and remove th e bezel (" Remov e the tower bezel " on page 26 ).
Removal an d replacement procedures 30 3. Remove all power: a. Disconnect ea ch power cord from the power sour ce. b. Disconne ct each powe r cord from the ser ver. 4. Do one of the followin g: o For tower mo dels, place th e server on a flat, level surface with t he access panel facing up.
Removal an d replacement procedures 31 6. Remove the fan blank. To replace th e component, rev erse the remova l procedure. F an To remove the component: 1. Do one of the followin g: o For tower models, open and remove th e bezel (" Remov e the tower bezel " on page 26 ).
Removal an d replacement pr oc edures 32 6. Remove the fa n. To replace th e component, rev erse the remova l procedure. F an cage IMPORTANT: When installing or replacin g server components, one or more fans might need to be removed.
Removal an d replacement procedures 33 7. Remove the fa n cage. To replace th e component, rev erse the remova l procedure. T ower feet NOTE: This p rocedure applies t o tower server s only. To remove the component: 1. Open and remove the be zel (" Remove the to wer bezel " on page 26 ).
Removal an d replacement procedures 34 4. Place the serv er on the side . 5. Remove the t ower feet. To replace th e component, rev erse the remova l procedure. C omponent bo x blank To remove the component: 1. For tower mod els, open and remove t he bezel (" Remov e the tower bezel " on page 26 ).
Removal an d replacement procedures 35 ii. Disconnect each power cord from the server d. Remove the a ccess panel (" Acce ss panel " on page 28 ). e. Remove the ra ck bezel. 3. Remove the component box blank. To replace th e component, rev erse the remova l procedure.
Removal an d replacement procedures 36 WARNING: To reduce the risk o f injury from el ectric shock, d o not remove more th an one drive carrier at a time. To remove the component: 1. Do one of the followin g: o For tower models, open and remove th e bezel (" Remov e the tower bezel " on page 26 ).
Removal an d replacement procedures 37 9. Using the T - 15 screwdriver, loosen T - 15 screws securing t he optical drive cage. 10. Remove the optical dri ve cage. To replace th e component, rev erse the remova l procedure. O ptical drive To remove the component: 1.
Removal an d replacement procedures 38 b. Disconne ct each power cor d from the server. 4. For tower mod els, do the following: a. Place the ser ver on a flat, l evel surface with the access panel f acing up. b. Remove the a ccess panel (" Acce ss panel " on page 28 ).
Removal an d replacement proced ures 39 b. Remove the a ccess panel (" Acce ss panel " on page 28 ). 5. For rack models, do the following: a. Extend the server from the rack (on page 27 ). b. Remove the a ccess panel (" Acce ss panel " on page 28 ).
Removal an d replacement procedures 40 Power supply module CAUTION: To preve nt improper cooling and thermal damage , do not operate the server unles s all bays are popul ated with either a co mponent or a blank.
Removal an d replacement procedures 41 2. Power down the serv er (on page 25 ). 3. Remove all power: a. Disconnect ea ch power cord from the power sour ce. b. Disconne ct each power cor d from the server. 4. Do one of the followin g: o For tower mo dels, place th e server on a flat, lev el surface with the access panel fa cing up.
Removal an d replacement procedures 42 o Four - bay power supp ly configuration 8. Loosen the two thumbsc rews, and remove the powe r supply backplane from t he cage: o Two - bay power supply backpl a.
Removal an d replacement procedures 43 o Four - bay power supply backplane bo ard To replace th e component, reve rse the removal procedur e. E xpansio n board 1. Do one of the followin g: o For tower models, open and remove th e bezel (" Remov e the tower bezel " on page 26 ).
Removal an d replacement procedures 44 7. Open the PCI retainer latch. 8. Remove the expansion bo ard. NOTE: If removing a n expansion board from slots 3, 6 or 8, first release the retai ning lever on the system b oard and then remov e the card from t he system.
Removal an d replacement procedures 45 2. Power down the serv er (on page 25 ). 3. Remove all power: a. Disconnect ea ch power cord from the power sour ce. b. Disconne ct each powe r cord from the ser ver. 4. Do one of the followin g: o For tower mo dels, place th e server on a flat, level surface with t he access panel facing up.
Removal an d replacement procedures 46 9. Disconnect the cables f rom the graphic card. 10. Remove the graphic c ard. To replace th e component, rev erse the remova l procedure. C ache module CAUTION: In systems that u se external data storage, be sure that the se rver is the first unit to be powered down and the last to be powered back up.
Removal an d replacement procedures 47 2. Power down the serv er (on page 25 ). 3. Remove all power: a. Disconnect ea ch power cord from the power sour ce. b. Disconne ct each powe r cord from the ser ver. 4. Do one of the followin g: o For tower mo dels, place th e server on a flat, level surface with t he access panel facing up.
Removal an d replacement procedures 48 CAUTION: To preve nt a server malf unction or damage t o the equipment, do n ot add or remove the battery pack while an array capacity expansio n, RAID level migration, or st ripe size migration is in progress.
Removal an d replacement procedures 49 SFF drive ba ckplane To remove the component: 1. Do one of the followin g: o For tower models, open and remove th e bezel (" Remov e the tower bezel " on page 26 ). o For rack models, if in stalled, remove t he security bezel (on page 26 ).
Removal an d replacement procedures 50 8. Remove the SFF drive cage. 9. Remove all drives f rom the drive cage (" Drive " on page 35 ). 10. Loosen the thumbscrew on the drive backplane and re move it from the cag e. To replace th e component, rev erse the remova l proced ure.
Removal an d replacement procedures 51 a. Disconnect ea ch power cord from the power sour ce. b. Disconne ct each powe r cord from the ser ver. 4. For tower mod els, do the following: a. Place the ser ver on a flat, l evel surface with the access panel f acing up.
Removal an d replacement procedures 52 9. Remove all drives f rom the drive cage (" Drive " on page 35 ). 10. Loosen the thumbscrew on the drive backplane and re move it from the cag e. To replace th e component, rev erse the remova l procedure.
Removal an d replacement procedures 53 8. Remove the S ystems Insight Display assem bly. To replace th e component, rev erse the remova l procedure. H eatsink To remove the component: 1. Do one of the followin g: o For tower models, open and remove th e bezel (" Remov e the tower bezel " on page 26 ).
Re moval and replac ement procedures 54 7. Open the heatsink retaining levers. 8. Remove the h eatsink. To replace th e heatsink: 1. Use the alcoh ol swab to remove all th e existing therma l grease from the pro cessor. Allow the alco hol to evaporate before con tinuing.
Removal an d replacement procedures 55 2. Remove the h eatsink prote ctive cover. 3. Install the heatsink, and then close the heatsink retaining levers. 4. Install the air b affle. 5. Install the access panel. 6. Do one of the followin g: o For tower models, return the server to an upright position, and then i nstall the bezel.
Removal an d replacement procedures 56 P rocessor WARNING: To reduce the risk o f personal inj ury from hot surfa ces, allow the d rives and the internal system components to cool before touchi ng them.
Removal an d replacement procedures 57 7. Open the heatsink retaining levers. 8. Remove the h eatsink..
Removal an d replacement procedures 58 9. Open each of the processor locking levers in the order indicated, and then open the processor retaining bracket. 10. Remove the p rocess or from th e processor retaining bra cket. CAUTION: To avoid damage to the processor, do not touch the bottom of the processor, especially the contac t area.
Removal an d replacement procedures 59 To install a proces sor: 1. Install the processor. Verify that the processor is fully seated in the proc essor retaining bracket by visually inspecting t he processor installat ion guides on either side o f the processor.
Removal an d replacement procedures 60 3. Press and hold th e processor retaining bracket in place, and then close each p rocessor locking lev er. Press only in the area indicated on the processor re taining bracket. 4. Use the alcohol swa b to remove all the ex isting thermal grease fr om the heatsink.
Removal an d replacement procedures 61 6. Install the heatsink, and then close the heatsink retaining levers. 7. Install the air b affle. 8. Install the access panel. 9. Do one of the followin g: o For tower models, return the server to an upright position.
Removal an d replacement procedures 62 b. Disconne ct each power cor d from the server. 4. Do one of the followin g: o For tower mo dels, place th e server on a flat, level surfa ce with the access panel facing up. o For rack models, ex tend the server from the rack (on page 27 ).
Removal an d replacement procedures 63 6. Remove the a ir baffle (" Air baffle " on page 29 ). 7. Remove the fa n cage (" Fan cage " on page 32 ). 8. Remove all DIMMs (" DIMMs " on page 61 ). 9. Remove any installe d PCI cards.
Removal an d replacement procedures 64 13. Remove the h eatsink. 14. Open each of the processor locking levers in the order indicated, and then open the processor retaining bracket.
Removal an d replacement procedures 65 15. Remove the p rocessor from the processor retaining brack et. CAUTION: To avoid damage to the processor, do not touch the bottom of the processor, especially the contac t area. CAUTION: To avoid dama ge to the s ystem board: • Do not touch the processor socket contacts.
Removal an d replacement procedures 66 To replace th e system board: 1. Install th e spare system bo ard. 2. Open each of the processor locking levers in the order indicated, and then open the processor retaining bracket.
Removal an d replacement procedures 67 3. Remove the cl ear processor socket cover. Reta in the processor socket cover for future use. 4. Install the processor. Verify that the processor is fully seated in the proc essor retaining bracket by visually inspecting t he processor installat ion guides on either side o f the processor.
Remo val and replacemen t procedures 68 CAUTION: Do not press down on the pr ocessor. Pressing down on the processor may caus e damage to the processor socket and the system board. Press onl y in the area indicated on the processor retain ing bracket.
Removal an d replacement procedures 69 10. Install the heatsink, and then close the heatsink retaining levers. 11. Install th e processor sock et cover onto th e processor socket o f the failed syst em board. IMPORTANT: Install all components with the s ame configuration that was used on the fail ed system board.
Removal an d replacement procedures 70 Warning: The serial number should ONLY be modified by qualified personnel. This value should always match the serial number located on the chassis. 5. Press the Enter key to clear the warning. 6. Enter the serial number and press the Enter key.
Removal an d replacement procedures 71 7. Remove the battery. IMPORTANT: Replacing the syst em board batter y resets the system RO M to its default configuration.
Troubleshootin g 72 T r ouble shootin g T roubleshooting resources The H P ProLiant Gen8 Tr oubleshooting Guide, V olume I: Trouble shooting pr ovides procedur es for resolving common problems and c o.
Diagnostic tool s 73 D i agno sti c tools H P Insight D iagnostics HP Insight Diagnostic s is a proactive server management tool, available in both offline and online version s, that provides diag nos.
Diagnostic tool s 74 • From within the iLO 4 user interface • From within HP Insight Diagnostics (on page 73 ) For more information, see the Management CD or DVD in the HP Ins ight Foundation suite for ProLiant.
Component ident ification 75 C om ponen t i dentif i cati on F ront panel comp onents • SFF Item Description 1 Media/Dri ve cage bay 2 SAS/SATA drives (8) 3 Serial number/iLO i nformation p ull tab* 4 Optical drive 5 USB connect ors (4) *The serial nu mber/iLO informa tion pull tab is double - sided.
Component ident ification 76 • LFF Item Description 1 Media/Dri ve cage bay 2 SAS/SATA drive (6) 3 Serial number/iLO i nformation p ull tab* 4 Optical drive 5 USB connect ors (4) *The serial nu mber/iLO informa tion pull tab is double - sided.
Component i dentificati on 77 Item Description Status 1 Power On/Standb y button and system power LED Solid green = System on Flashing green (1 Hz/cycle per sec) = Performing power on sequence Solid a.
Component ident ification 78 Item Description Status 3 DIMM LEDs Amb er = DIMM error Off = Normal All other LEDs A mber = Failure Off = Normal IMPORTANT: If more than one DIMM slot LED is illumin ated, further troubleshooting is required. Test each bank of DIM Ms by removing all other DIM Ms.
Component ident ification 79 Systems Insi ght Display LED and color H ealth LED System power LED Status Power cap (gree n) — Flashing green Waiting for pow er Power cap (flashing amber) — Am ber P.
Component ident ification 80 Item Description 16 NIC connector 1 17 USB connect ors (4) 18 Video connect or 19 PCIe slot 5 (Processor 2) 20 PCIe slot 6 (Processor 2) 21 PCIe slot 7 (Processor 2) 22 PC.
Component ident ification 81 S ystem board c omponents Item Description 1 Slot 1 PCIe 3 x16 (8, 4, 1) 2 Slot 2 PCIe 3 x8 (4, 1) 3 Slot 3 PCIe 3 x16 (16, 8, 4, 1 ) 4 Slot 4 PCIe 3 x8 (4, 1) 5 Processor.
Component ident ification 82 Item Description 27 Processor socket 1 (populated) S ystem maintena nce switch Position Def ault Function S1 Off Off = iLO 4 securit y is enabled. On = iLO 4 securit y is disable d. S2 Off Off = System configu ration can b e changed.
Component ident ification 83 S AS and SA TA device numbers With optional dr ive cages installed, the ser ver supports up to 24 SFF drives or up to 18 LFF drives. The serv er does not support m ixing SFF and LFF drives. HP recommends that you populate drive bays s tarting with the lowest SA S or SATA devic e number.
Component ident ification 84 D rive LED defini tions Item LED Status Definition 1 Locate Solid blu e The drive is being identified by a h ost application .
Component ident ification 85 Item Description Configuration 1 Fan 1 Redundant (pri mary fan when processor 2 is installed) 2 Fan 2 Primary 3 Fan 3 Primary 4 Fan 4 Primary FBWC module LEDs (P 222, P420, P420i, P421, P822) The FBWC module has three single - color LEDs (one a mber and two gree n).
Component ident ification 86 1 - Amber 2 - Green 3 - G reen Interpre tation Off Flashing 0.5 Hz Flashing 0.5 H z The cache micr ocontroller is e xecuting from within its boot loader and receiving new flash code from the host controller. Off Flashing 1 Hz Flashing 1 Hz The cache module i s powering up, and th e capacitor pack is char ging.
Compone nt ident ification 87 Item Connector Description 2 J9 Drive backplan e bay 1/optic al drive power co nnector 3 J5 Drive backplan e bay 2 power co nnector 4 J6 Drive backplan e bay 3 power co n.
Cabling 88 C abling S erver data cabling Item Description 1 Optical drive conn ector 2 Drive cage 1, S AS connect or 2 3 Drive cage 1, SAS conne ctor 1 4 SATA connector 5 SAS connector 6 SAS connector.
Cabling 89 M edia device data cabling Item Description 1 Optical drive conn ector 2 Optical drive conn ector 3 Optical drive conn ector 4 SATA connector 5 SATA connector 6 SATA connector O ptical driv.
Specifications 90 S pec if icati ons E nvironmental spec ifications Specification Value Temperature range* Operating 10 ° C to 35 ° C (50 ° F to 95 ° F) Nonoperating - 30 ° C to 60 ° C ( - 22 ° F to 14 0 ° F) Relative humidity (noncondensing) Operating, maximum wet bul b temperature of 28°C (82.
Specifications 91 • HP 460 W Gold Power S upply (92% efficiency) • HP 460 W Platinum Plu s Power Supply (94% effi ciency) • HP 750 W Gold Power S upply (92% efficiency) • HP 750 W Platinum Plu.
Specifications 92 H P 750 W Gold Power Supply (92% eff iciency) Specification Value Input requirements — Rated input voltage 100 to 120 VA C, 200 to 240 VAC Rated input frequency 50 Hz to 60 Hz Rated input cu rrent 8.
Specifications 93 Rated input cu rrent 10 A at 100 V AC 6.7 A at 200 VAC Rated input po wer 990 W at 115V AC input 1315 W at 23 0V AC input Btus per hour 3060 at 100V AC input 3380 at 115V AC inpu t 4.
Acronyms and abbreviation s 94 A c r on y ms and abbr e v iati on s AMP Advanced Memory Protec tion CS HE HP Common Slot H igh - Efficiency (power su pply) CSR Customer Self Re pair FBWC flash - backe.
Acronyms and abbreviation s 95 POST Power - On Self Test PSP HP ProLiant Support Pack RBSU ROM - Based Setup Utility RPS redundant power supply SAS serial attached SCSI SATA serial ATA SFF small form .
Documentation feedback 96 Doc ument ati on f eedbac k HP is committed to pro viding documentation that mee ts your needs. To help us improve the documentation, send any erro rs, s uggestions, or comm ents to Documentation Fee dback ( mailto:docsfee dback@hp.
Index 97 A access panel 28 air baffle 29 B battery 70 buttons 75 C cables 88 cabling 88, 89 cache module 46 components 15, 75 conne cto rs 75 crash dump analysis 82 D data cabling 88 device bay blank .
Index 98 power supply specific ations 90, 91, 92 powering down 25 powering up 25 problem diagnosis 72 processo rs 56 R rack bezel 25, 26 rear panel compone nts 79 rear panel LEDs 80 S safety considera.
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