Intelメーカー320028-001の使用説明書/サービス説明書
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Order Number: 320028-00 1 Intel® Core™ 2 Duo Mobile Processors on 45-nm process for Embedded Applications Thermal Design Guide June 2008.
Intel® Core™ 2 Duo Mobile Processors on 45-nm process fo r Embedded Applications TDG June 2008 2 Order Number: 320028-001 INFORMA TION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS.
Core™ 2 Duo Mobile Processors—Contents Intel® Core™ 2 Duo Mobile Pr ocessors on 45-nm process- Thermal Design Guide TDG June 2008 3 Order Number: 320028-001 Contents 1.0 Introducti on ......... ........... ........ ........... .......... ......
Intel® Core™ 2 Duo Mobile Proc essors on 45-nm process for Embed ded Applications June 2008 TDG Order Number: 320028-001 4 Figures—Core™ 2 Duo Mobile Processors Figures 1 Thermal Design P rocess ............ ........... .......... ........... .
Core™ 2 Duo Mobile Processors—Tables Intel® Core™ 2 Duo Mobile Pr ocessors on 45-nm process- Thermal Design Guide TDG June 2008 5 Order Number: 320028-001 Revision History Date Revision Description June 2008 1.
Intel® Core™ 2 Duo Mobile Proc essors on 45-nm process for Embed ded Applications June 2008 TDG Order Number: 320028-001 6 Introduction—Core™ 2 Duo Mobile Processors 1.0 Introduction The power dissipation of electronic components has risen along with the increase in complexity of computer systems.
Core™ 2 Duo Mobile Processors—Introduction Intel® Core™ 2 Duo Mobile Pr ocessors on 45-nm process- Thermal Design Guide TDG June 2008 7 Order Number: 320028-001 1.2 Definition of Terms Figure 1. Thermal Design Process Table 1. Definition of Terms (Sheet 1 of 2) Term Definition FCPGA Flip Chip Pin Grid Array .
Intel® Core™ 2 Duo Mobile Proc essors on 45-nm process for Embed ded Applications June 2008 TDG Order Number: 320028-001 8 Introduction—Core™ 2 Duo Mobile Processors 1.
Core™ 2 Duo Mobile Processors—Package Information Intel® Core™ 2 Duo Mobile Pr ocessors on 45-nm process- Thermal Design Guide TDG June 2008 9 Order Number: 320028-001 2.0 Package Information The Intel® Core™2 Duo Processor (XE and SV) is av ailable in 478-pin Micro-FCPGA packages as well as 479-ball Micro-FCBGA packages.
Intel® Core™ 2 Duo Mobile Proc essors on 45-nm process for Embed ded Applications June 2008 TDG Order Number: 320028-001 10 Thermal Specifications—Core™ 2 Duo Mobile Processors 3.0 Thermal Specifications 3.1 Thermal Design Power The Therm al Design P ower (TDP ) specification is listed in Ta b l e 2 .
Core™ 2 Duo Mobile Processors—Mechanical Specifications Intel® Core™ 2 Duo Mobile Pr ocessors on 45-nm process- Thermal Design Guide TDG June 2008 11 Order Number: 320028-001 4.0 Mechanical Specifications 4.1 Package Mechanical Requirements 4.1.
Intel® Core™ 2 Duo Mobile Proc essors on 45-nm process for Embed ded Applications June 2008 TDG Order Number: 320028-001 12 Mechanical Specifications—Core™ 2 Duo Mobile Processors Notes: 1.
Core™ 2 Duo Mobile Processors—Mechanical Specifications Intel® Core™ 2 Duo Mobile Pr ocessors on 45-nm process- Thermal Design Guide TDG June 2008 13 Order Number: 320028-001 Notes: 1.
Intel® Core™ 2 Duo Mobile Proc essors on 45-nm process for Embed ded Applications June 2008 TDG Order Number: 320028-001 14 Mechanical Specifications—Core™ 2 Duo Mobile Processors Notes: 1.
Core™ 2 Duo Mobile Processors—Thermal Solution Requirements Intel® Core™ 2 Duo Mobile Pr ocessors on 45-nm process- Thermal Design Guide TDG June 2008 15 Order Number: 320028-001 5.
Intel® Core™ 2 Duo Mobile Proc essors on 45-nm process for Embed ded Applications June 2008 TDG Order Number: 320028-001 16 Thermal Solution Requirements—Core™ 2 Duo Mobile Processors 5.
Core™ 2 Duo Mobile Processors—Thermal Solution Requirements Intel® Core™ 2 Duo Mobile Pr ocessors on 45-nm process- Thermal Design Guide TDG June 2008 17 Order Number: 320028-001 It is evident .
Intel® Core™ 2 Duo Mobile Proc essors on 45-nm process for Embed ded Applications June 2008 TDG Order Number: 320028-001 18 Reference Thermal Solutions—Core™ 2 Duo Mobile Processors 6.0 Reference Thermal Solutions Intel has developed reference thermal solutions de signed to meet the cooling needs of embedded form factor applications.
Core™ 2 Duo Mobile Processors—Reference Thermal Solutions Intel® Core™ 2 Duo Mobile Pr ocessors on 45-nm process- Thermal Design Guide TDG June 2008 19 Order Number: 320028-001 6.2 Keep Out Zon e Requir ements The keep out zone requirements on the PC B to use this heatsink are detailed in Appendix B, “Mechanical Drawings” .
Intel® Core™ 2 Duo Mobile Proc essors on 45-nm process for Embed ded Applications June 2008 TDG Order Number: 320028-001 20 Reference Thermal Solutions—Core™ 2 Duo Mobile Processors 6.4.1 Keep Out Zone Re qui r emen ts The keep out zone requ irements on the PCB to use this heatsink are detailed in Appendix B, “Mechanical Drawin gs” .
Core™ 2 Duo Mobile Processors—Reference Thermal Solutions Intel® Core™ 2 Duo Mobile Pr ocessors on 45-nm process- Thermal Design Guide TDG June 2008 21 Order Number: 320028-001 6.5 Compact PCI Reference Heatsink The cPCI reference thermal solution is shown in Figure 10 .
Intel® Core™ 2 Duo Mobile Proc essors on 45-nm process for Embed ded Applications June 2008 TDG Order Number: 320028-001 22 Reference Thermal Solutions—Core™ 2 Duo Mobile Processors 6.5.1 Keep Out Zone Re qui r emen ts The keep out zone requ irements on the PCB to use this heatsink are detailed in Appendix B, “Mechanical Drawin gs.
Core™ 2 Duo Mobile Processors—Reference Thermal Solutions Intel® Core™ 2 Duo Mobile Pr ocessors on 45-nm process- Thermal Design Guide TDG June 2008 23 Order Number: 320028-001 Thermal interface materials have thermal impedance (resistance) that will increase as the material degrades ov er time.
Intel® Core™ 2 Duo Mobile Proc essors on 45-nm process for Embed ded Applications June 2008 TDG Order Number: 320028-001 24 Thermal Metrology—Core™ 2 Duo Mobile Processors 7.0 Thermal Metrology The system designer must make temper ature measurements to accur ately determine the performance of the thermal solution.
Core™ 2 Duo Mobile Proce ssors—Thermal Metrology Intel® Core™ 2 Duo Mobile Pr ocessors on 45-nm process- Thermal Design Guide TDG June 2008 25 Order Number: 320028-001 It is worthwhile to determine the local ambient te mperature in the chassis around the processor to understand the effect it may ha ve on the case temperature.
Intel® Core™ 2 Duo Mobile Proc essors on 45-nm process for Embed ded Applications June 2008 TDG Order Number: 320028-001 26 Thermal Metrology—Core™ 2 Duo Mobile Processors Note: Drawing not to scale.
Core™ 2 Duo Mobile Proce ssors—Thermal Metrology Intel® Core™ 2 Duo Mobile Pr ocessors on 45-nm process- Thermal Design Guide TDG June 2008 27 Order Number: 320028-001 Note: Dra wing not to scale.
Intel® Core™ 2 Duo Mobile Proc essors on 45-nm process for Embed ded Applications June 2008 TDG Order Number: 320028-001 28 Reliability Guidelines—Core™ 2 Duo Mobile Processors 8.0 Reliability Guidelines Each motherboard, heatsink, and attach combin ation ma y vary the mechanical loading of the component.
Core™ 2 Duo Mobile Processors—Thermal Solution Component Suppliers Intel® Core™ 2 Duo Mobile Pr ocessors on 45-nm process- Thermal Design Guide TDG June 2008 29 Order Number: 320028-001 Appendix A Thermal Solution Compo nent Suppliers These vendors and devices are listed by Intel as a convenience to Intel’ s gener al customer base.
Intel® Core™ 2 Duo Mobile Proc essors on 45-nm process for Embed ded Applications June 2008 TDG Order Number: 320028-001 30 Mechanical Drawings—Core™ 2 Duo Mobile Processors Appendix B Mechanical Drawings Ta b l e 6 lists the mechanical drawings included in this appendix.
Core™ 2 Duo Mobile Processors—Mechanical Drawings Intel® Core™ 2 Duo Mobile Pr ocessors on 45-nm process- Thermal Design Guide TDG June 2008 31 Order Number: 320028-001 Figure 15.
Intel® Core™ 2 Duo Mobile Proc essors on 45-nm process for Embed ded Applications June 2008 TDG Order Number: 320028-001 32 Mechanical Drawings—Core™ 2 Duo Mobile Processors Figure 16.
Core™ 2 Duo Mobile Processors—Mechanical Drawings Intel® Core™ 2 Duo Mobile Pr ocessors on 45-nm process- Thermal Design Guide TDG June 2008 33 Order Number: 320028-001 Figure 17.
Intel® Core™ 2 Duo Mobile Proc essors on 45-nm process for Embed ded Applications June 2008 TDG Order Number: 320028-001 34 Mechanical Drawings—Core™ 2 Duo Mobile Processors Figure 18.
Core™ 2 Duo Mobile Processors—Mechanical Drawings Intel® Core™ 2 Duo Mobile Pr ocessors on 45-nm process- Thermal Design Guide TDG June 2008 35 Order Number: 320028-001 Figure 19.
Intel® Core™ 2 Duo Mobile Proc essors on 45-nm process for Embed ded Applications June 2008 TDG Order Number: 320028-001 36 Mechanical Drawings—Core™ 2 Duo Mobile Processors Figure 20.
Core™ 2 Duo Mobile Processors—Mechanical Drawings Intel® Core™ 2 Duo Mobile Pr ocessors on 45-nm process- Thermal Design Guide TDG June 2008 37 Order Number: 320028-001 Figure 21.
Intel® Core™ 2 Duo Mobile Proc essors on 45-nm process for Embed ded Applications June 2008 TDG Order Number: 320028-001 38 Mechanical Drawings—Core™ 2 Duo Mobile Processors Figure 22.
Core™ 2 Duo Mobile Processors—Mechanical Drawings Intel® Core™ 2 Duo Mobile Pr ocessors on 45-nm process- Thermal Design Guide TDG June 2008 39 Order Number: 320028-001 Figure 23.
Intel® Core™ 2 Duo Mobile Proc essors on 45-nm process for Embed ded Applications June 2008 TDG Order Number: 320028-001 40 Mechanical Drawings—Core™ 2 Duo Mobile Processors Figure 24.
Core™ 2 Duo Mobile Processors—Mechanical Drawings Intel® Core™ 2 Duo Mobile Pr ocessors on 45-nm process- Thermal Design Guide TDG June 2008 41 Order Number: 320028-001 Figure 25.
Intel® Core™ 2 Duo Mobile Proc essors on 45-nm process for Embed ded Applications June 2008 TDG Order Number: 320028-001 42 Mechanical Drawings—Core™ 2 Duo Mobile Processors Figure 26.
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