IntelメーカーBXF80646I74770Kの使用説明書/サービス説明書
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LGA1150 Socket Application Guide September 2013 Order No.: 328999-002.
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Contents Revision History.................................................................................................................. 6 1.0 Introduction.............................................................................................
Figures 1 LGA1150 Pick and Place Cover.................................................................................... 9 2 LGA1150 Socket Land Pattern................................................................................... 10 3 Attachment to Motherboard.
Tables 1 Related Documents ...................................................................................................7 2 Terms and Descriptions.............................................................................................. 7 3 Socket Component Mass.
Revision History Revision Number Description Revision Date 001 • Initial release June 2013 002 • Added Desktop Intel ® Pentium processor family September 2013 LGA1150 Socket—Revision History LGA1150 Socket Application Guide September 2013 6 Order No.
1.0 Introduction This document covers the LGA1150 socket for Desktop systems using the Desktop 4th Generation Intel ® Core ™ processor family, Desktop Intel ® Pentium ® processor family, and for UP Server / Workstation systems using the Intel ® Xeon ® processor E3-1200 v3 product family.
Term Description FSC Fan Speed Control IHS Integrated Heat Spreader: a component of the processor package used to enhance the thermal performance of the package.
2.0 LGA1150 Socket This chapter describes a surface mount, LGA (Land Grid Array) socket intended for the processors. The socket provides I/O, power and ground contacts. The socket contains 1150 contacts arrayed about a cavity in the center of the socket with lead-free solder balls for surface mounting on the motherboard.
Figure 2. LGA1150 Socket Land Pattern Attachment to Motherboard The socket is attached to the motherboard by 1150 solder balls. There are no additional external methods (that is, screw, extra solder, adhesive, and so on) to attach the socket.
Figure 3. Attachment to Motherboard Socket Components The socket has two main components, the socket body and Pick and Place (PnP) cover, and is delivered as a single integral assembly.
• Lead free SAC (SnAgCu) 305 solder alloy with a silver (Ag) content between 3% and 4% and a melting temperature of approximately 217 °C. The alloy is compatible with immersion silver (ImAg) and Organic Solderability Protectant (OSP) motherboard surface finishes and a SAC alloy solder paste.
Figure 4. Pick and Place Cover Package Installation / Removal As indicated in Figure 5 on page 14, access is provided to facilitate manual installation and removal of the package.
Figure 5. Package Installation / Removal Features Socket Standoffs and Package Seating Plane Standoffs on the bottom of the socket base establish the minimum socket height after solder reflow and are specified in Socket Mechanical Drawings . Similarly, a seating plane on the topside of the socket establishes the minimum package height.
Component Insertion Forces Any actuation must meet or exceed SEMI S8-95 Safety Guidelines for Ergonomics/ Human Factors Engineering of Semiconductor Manufacturing Equipment, example Table R2-7 (Maximum Grip Forces). The socket must be designed so that it requires no force to insert the package into the socket.
3.0 Independent Loading Mechanism (ILM) The ILM has two critical functions – deliver the force to seat the processor onto the socket contacts and distribute the resulting compressive load evenly through the socket solder joints. The mechanical design of the ILM is integral to the overall functionality of the LGA1150 socket.
The ILM assembly design ensures that, once assembled to the back plate, the only features touching the board are the shoulder screw and the insulated hinge frame assembly.
• Desktop ILM back plate using marking “115XDBP” versus server ILM back plate using marking “115XSBP”. Note: When reworking a BGA component or the socket that the heatsink, battery, ILM and ILM back plate are removed prior to rework.
Figure 8. Shoulder Screw Assembly of Independent Loading Mechanism (ILM) to a Motherboard The ILM design allows a bottoms up assembly of the components to the board. See Figure 9 on page 20 for step by step assembly sequence. 1. Place the back plate in a fixture.
Figure 9. Independent Loading Mechanism (ILM) Assembly As indicated in Figure 10 on page 20, the shoulder screw, socket protrusion and ILM key features prevent 180 degree rotation of ILM cover assembly with respect to socket. The result is a specific Pin 1 orientation with respect to ILM lever.
Independent Loading Mechanism (ILM) Interchangeability ILM assembly and ILM back plate built from the Intel controlled drawings are intended to be interchangeable. Interchangeability is defined as an ILM from Vendor A will demonstrate acceptable manufacturability and reliability with a socket body from Vendor A, B or C.
• The ILM cover for the LGA115x socket will have a flammability rating of V-2 per UL 60950-1. Note: The ILM Cover pop off feature is not supported if the ILM Covers are interchanged on different vendor’s ILMs.
Figure 12. ILM Cover and PnP Cover Interference As indicated in Figure 12 on page 23, the pick and place cover cannot remain in place and used in conjunction with the ILM Cover. The ILM Cover is designed to interfere and pop off if the pick and place cover is unintentionally left in place.
4.0 LGA1150 Socket and ILM Specifications This chapter describes the following specifications and requirements: • Mechanical Specifications on page 24 • Electrical Requirements on page 25 • Environmental Requirements on page 26 Mechanical Specifications Component Mass Table 3.
Table 5 on page 25 provides load specifications for the LGA1150 socket with the ILM installed. The maximum limits should not be exceeded during heatsink assembly, shipping conditions, or standard use condition. Exceeding these limits during test may result in component failure.
Table 6. Electrical Requirements for LGA1150 Socket Parameter Value Comment Mated loop inductance, Loop <3.6nH The inductance calculated for two contacts, considering one forward conductor and one return conductor. These values must be satisfied at the worst-case height of the socket.
Figure 13. Flow Chart of Knowledge-Based Reliability Evaluation Methodology A detailed description of this methodology can be found at: ftp://download.intel.com/technology/itj/q32000/pdf/reliability.pdf. LGA1150 Socket and ILM Specifications—LGA1150 Socket LGA1150 Socket September 2013 Application Guide Order No.
Appendix A Component Suppliers Note: The part numbers listed below identifies the reference components. End-users are responsible for the verification of the Intel enabled component offerings with the supplier.
Appendix B Mechanical Drawings The following table lists the mechanical drawings included in this appendix. Table 9. Mechanical Drawing List Drawing Description Figure Number / Location Socket / Heats.
Figure 14. Socket/Heatsink / ILM Keep-out Zone Primary Side (Top) LGA1150 Socket—Mechanical Drawings LGA1150 Socket Application Guide September 2013 30 Order No.
Figure 15. Socket / Heatsink / ILM Keep-out Zone Secondary Side (Bottom) Mechanical Drawings—LGA1150 Socket LGA1150 Socket September 2013 Application Guide Order No.
Figure 16. Socket / Processor / ILM Keep-out Zone Primary Side (Top) LGA1150 Socket—Mechanical Drawings LGA1150 Socket Application Guide September 2013 32 Order No.
Figure 17. Socket / Processor / ILM Keep-out Zone Secondary Side (Bottom) Mechanical Drawings—LGA1150 Socket LGA1150 Socket September 2013 Application Guide Order No.
Appendix C Heatsink Back Plate Drawings This heatsink back plate design is intended to adapt as a reference for OEMs that use threaded fasteners on customized thermal solution, to comply with the mechanical and structural requirements for the LGA115x socket.
Figure 18. Heatsink Back Plate Keep-in Zone Heatsink Back Plate Drawings—LGA1150 Socket LGA1150 Socket September 2013 Application Guide Order No.: 328999-002 35.
Figure 19. Heatsink Back Plate LGA1150 Socket—Heatsink Back Plate Drawings LGA1150 Socket Application Guide September 2013 36 Order No.: 328999-002.
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