IntelメーカーE8500の使用説明書/サービス説明書
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Intel ® E8500 Chip set North Bridge (NB) and eXternal Memory Bridge (XMB) Thermal/Mechanical Design Guide March 2005 Document Number 306749-001.
2 Intel ® E8500 Chipset North Bridge (NB) and eXternal Memory Bridge (XMB) Thermal/Me chanical Design Guide INFORMA TION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHER WISE, TO ANY INTELLECTUAL PROPERTY RI GH TS IS GRANTED BY THIS DOCUMENT .
Intel ® E8500 Chipset North Brid ge (NB) and eXternal Memory 3 Bridge (XMB) Thermal/Mechani cal Desig n Guide Contents 1 Introduction... ................ ................ ................ ................. ................ ................ ..........
4 Intel ® E8500 Chipset North Bridge (NB) and eXternal Memory Bridge (XMB) Thermal/Me chanical Design Guide 8.5 XMB Heatsink Thermal Solution Assembly ....... ......... .............. .............. .............. ............. 38 8.5.1 Heatsink Orientation .
Intel ® E8500 Chipset North Brid ge (NB) and eXternal Memory 5 Bridge (XMB) Thermal/Mechani cal Desig n Guide Tables 3-1 Intel ® E8500 Chipset NB Thermal Specifications ... ...................... .............. .............. .........15 3-2 Intel ® E8500 Chipset XMB Thermal Specificat ions .
6 Intel ® E8500 Chipset North Bridge (NB) and eXternal Memory Bridge (XMB) Thermal/Me chanical Design Guide Revision History NOTE: Not all revisions may be published.
Intel ® E8500 Chipset North Brid ge (NB) and eXternal Memory 7 Bridge (XMB) Thermal/Mechani cal Desig n Guide 1 Introduction As the complexity of computer systems increases, so do the power dissipatio n requirements. Care must be taken to ensure that the additional power is properl y dissipat ed.
Introduction 8 Intel ® E8500 Chipset North Bridge (NB) and eXternal Memory Bridge (XMB) Thermal/Me chanical Design Guide 001239 1.2 Definition of T e rms BGA Ball grid array . A package type, defined by a resin-fiber substrate, onto which a die is mounted, bonded and encapsulated in m old ing com pound.
Intel ® E8500 Chipset North Brid ge (NB) and eXternal Memory 9 Bridge (XMB) Thermal/Mechani cal Desig n Guide Introduction XMB Intel ® E8500 chipset eXternal Memory Bridg e Compo nent. The chipset component that bridges th e IMI and DDR interfaces. 1.
Introduction 10 Intel ® E8500 Chipset North Bridge (NB) and eXternal Memory Bridge (XMB) Thermal/Me chanical Design Guide.
Intel ® 8500 Chipset North Brid ge (NB) and eXternal Memory 11 Bridge (XMB) Thermal/Mechani cal Desig n Guide 2 Packaging T echnology The E8500 chipsets consist of four individual components: the NB, the XMB, the Intel ® 6700PXH 64-bit PCI Hub and the I/O controller hub (ICH5r).
Packaging T e chnology 12 Intel ® 8500 Chipset North Bridge (NB) and eXternal Memory Bridge (XMB) Thermal/Me chanical Design Guide NOTES: 1. All dimensions are in millimeter s. 2. All dimensions and tolerances confor m to ANSI Y14.5M-1994. Figure 2-3.
Intel ® 8500 Chipset North Brid ge (NB) and eXternal Memory 13 Bridge (XMB) Thermal/Mechani cal Desig n Guide Packaging T ech no lo gy Figure 2-4. XMB Package Dimensions (T op View) Figure 2- 5. XMB Package Dimensions ( Side View) XMB Di e Di e Keepout Ar ea Handli ng Exc l us i o n Ar ea 37.
Packaging T e chnology 14 Intel ® 8500 Chipset North Bridge (NB) and eXternal Memory Bridge (XMB) Thermal/Me chanical Design Guide 2.1 Package Mechanical Requirement s The E8500 chipset NB package has an IHS and the XMB package has an exposed bare di e which is capable of sustaining a maximum st atic normal load of 15-lbf.
Intel ® E8500 Chipset North Brid ge (NB) and eXternal Memory 15 Bridge (XMB) Thermal/Mechani cal Desig n Guide 3 Thermal Specifications 3.1 Thermal Design Power (TDP) Analysis indicates that real applicati ons are unlikely to cause the E8500 chipset NB/X MB components to co nsume maximum power dissipation for sustained time periods.
Thermal Specifications 16 Intel ® E8500 Chipset North Bridge (NB) and eXternal Memory Bridge (XMB) Thermal/Me chanical Design Guide NOTE: 1. These specifications are based on si lico n characterization, however, they may be updated as further data becomes available.
Intel ® E8500 Chipset North Brid ge (NB) and eXternal Memory 17 Bridge (XMB) Thermal/Mechani cal Desig n Guide 4 Thermal Simulation Intel provides thermal simulatio n mod e ls of the E850 0 chipset N.
Thermal Simulation 18 Intel ® E8500 Chipset North Bridge (NB) and eXternal Memory Bridge (XMB) Thermal/Me chanical Design Guide.
Intel ® E8500 Chipset North Brid ge (NB) and eXternal Memory 19 Bridge (XMB) Thermal/Mechani cal Desig n Guide 5 Thermal Metrology The system designer must make temperature measurements to accura tely determine the thermal performance of the system. Intel has established gu idelines for proper tech niques to measure the NB/XMB die temperatures.
Thermal Metrolo gy 20 Intel ® E8500 Chipset North Bridge (NB) and eXternal Memory Bridge (XMB) Thermal/Me chanical Design Guide 001240 NOTE: Not to scale. 001321 NOTE: Not to scale. Figure 5-1. Thermal Solution De cision Flowchart Figure 5-2. Zero Degree Angle Att ach Heat sink Modifications Figure 5-3.
Intel ® E8500 Chipset North Brid ge (NB) and eXternal Memory 21 Bridge (XMB) Thermal/Mechani cal Desig n Guide Thermal Metrology 5.2 Power Simulation Sof tware The power simulation software is a util.
Thermal Metrolo gy 22 Intel ® E8500 Chipset North Bridge (NB) and eXternal Memory Bridge (XMB) Thermal/Me chanical Design Guide.
Intel ® E8500 Chipset North Brid ge (NB) and eXternal Memory 23 Bridge (XMB) Thermal/Mechani cal Desig n Guide 6 NB Reference Thermal Solution #1 Intel has developed two different reference thermal s.
NB Reference Thermal Solution #1 24 Intel ® E8500 Chipset North Bridge (NB) and eXternal Memory Bridge (XMB) Thermal/Me chanical Design Guide 6.3 Mechanical Design Envelope While each design may have.
Intel ® E8500 Chipset North Brid ge (NB) and eXternal Memory 25 Bridge (XMB) Thermal/Mechani cal Desig n Guide NB Reference Thermal Solution #1 6.4 Board-Level Component s Keepout Dimensions The location of hole pattern and keepout zones fo r the reference thermal solution are shown in Figure 6-3 .
NB Reference Thermal Solution #1 26 Intel ® E8500 Chipset North Bridge (NB) and eXternal Memory Bridge (XMB) Thermal/Me chanical Design Guide 6.5 First NB Heat sink Thermal Solution Assembly The reference thermal solution for the chipset NB component is a passive extruded heatsink with thermal interface.
Intel ® E8500 Chipset North Brid ge (NB) and eXternal Memory 27 Bridge (XMB) Thermal/Mechani cal Desig n Guide NB Reference Thermal Solution #1 6.5.1 Heat sink Orientation Since this solution is based on a unidirectional heatsin k, mean airflo w direction must be aligned with the direction of the heatsink fins.
NB Reference Thermal Solution #1 28 Intel ® E8500 Chipset North Bridge (NB) and eXternal Memory Bridge (XMB) Thermal/Me chanical Design Guide the thermal resistance of the Chomeric s THERMFLOW T710 TIM is shown in Ta b l e 6 - 1 The heatsink clip provides enough pressu re for the TIM to achieve a thermal conductivity of 0.
Intel ® E8500 Chipset North Brid ge (NB) and eXternal Memory 29 Bridge (XMB) Thermal/Mechani cal Desig n Guide NB Reference Thermal Solution #1 6.6 Reliability Guidelines Each motherboard, heatsink a nd attach combination may vary the mechanical loading of the component.
NB Reference Thermal Solution #1 30 Intel ® E8500 Chipset North Bridge (NB) and eXternal Memory Bridge (XMB) Thermal/Me chanical Design Guide.
Intel ® E8500 Chipset North Brid ge (NB) and eXternal Memory 31 Bridge (XMB) Thermal/Mechani cal Desig n Guide 7 NB Reference Thermal Solution #2 Intel has developed two different reference thermal s.
NB Reference Thermal Solution #2 32 Intel ® E8500 Chipset North Bridge (NB) and eXternal Memory Bridge (XMB) Thermal/Me chanical Design Guide 7.3 Mechanical Design Envelope While each design may have.
Intel ® E8500 Chipset North Brid ge (NB) and eXternal Memory 33 Bridge (XMB) Thermal/Mechani cal Desig n Guide NB Reference Thermal Solution #2 7.4 Board-Level Component s Keepout Dimensions Please refer to Section 6.
NB Reference Thermal Solution #2 34 Intel ® E8500 Chipset North Bridge (NB) and eXternal Memory Bridge (XMB) Thermal/Me chanical Design Guide 7.5.1 Heat sink Orien tation Since this solution is based on a unidirectional heatsink , mean airflow direction must be align ed with the direction of the heatsink fins.
Intel ® E8500 Chipset North Brid ge (NB) and eXternal Memory 35 Bridge (XMB) Thermal/Mechani cal Desig n Guide NB Reference Thermal Solution #2 7.6 Reliability Guidelines Please refer to Section 6.
NB Reference Thermal Solution #2 36 Intel ® E8500 Chipset North Bridge (NB) and eXternal Memory Bridge (XMB) Thermal/Me chanical Design Guide.
Intel ® E8500 Chipset North Brid ge (NB) and eXternal Memory 37 Bridge (XMB) Thermal/Mechani cal Desig n Guide 8 XMB Reference Thermal Solution Intel has developed one different reference thermal sol.
XMB Reference Thermal Solution 38 Intel ® E8500 Chipset North Bridge (NB) and eXternal Memory Bridge (XMB) Thermal/Me chanical Design Guide 8.3 Mechanical Design Envelope While each design may have u.
Intel ® E8500 Chipset North Brid ge (NB) and eXternal Memory 39 Bridge (XMB) Thermal/Mechani cal Desig n Guide XMB Reference Thermal Solution Full mechanical drawings of the therm al soluti on assembly and the heatsink are provided in Appendix B . Appendix A contains vendor information fo r each thermal solution component.
XMB Reference Thermal Solution 40 Intel ® E8500 Chipset North Bridge (NB) and eXternal Memory Bridge (XMB) Thermal/Me chanical Design Guide 8.5.2 Extruded Heat sink Profiles The reference XMB thermal solution uses an extruded heatsink for cooling the chipset XMB.
Intel ® E8500 Chipset North Brid ge (NB) and eXternal Memory 41 Bridge (XMB) Thermal/Mechani cal Desig n Guide XMB Reference Thermal Solution 8.6 Reliability Guidelines Please refer to Section 6.
XMB Reference Thermal Solution 42 Intel ® E8500 Chipset North Bridge (NB) and eXternal Memory Bridge (XMB) Thermal/Me chanical Design Guide.
Intel ® E8500 Chipset North Brid ge (NB) and eXternal Memory 43 Bridge (XMB) Thermal/Mechani cal Desig n Guide A Thermal Solution Component Suppliers T able A-1.
Thermal Solution Compone nt Suppliers 44 Intel ® E8500 Chipset North Bridge (NB) and eXternal Memory Bridge (XMB) Thermal/Me chanical Design Guide T able A-2.
Intel ® E8500 Chipset North Brid ge (NB) and eXternal Memory 45 Bridge (XMB) Thermal/Mechani cal Desig n Guide Thermal Solution Component Suppliers Note: The enabled components may not be currently available from al l suppliers. Cont act the supplier directly to verify time of component avail a bil ity .
Thermal Solution Compone nt Suppliers 46 Intel ® E8500 Chipset North Bridge (NB) and eXternal Memory Bridge (XMB) Thermal/Me chanical Design Guide.
Intel ® E8500 Chipset North Brid ge (NB) and eXternal Memory 47 Bridge (XMB) Thermal/Mechani cal Desig n Guide B Mechanical Drawings T able B-1. Mechanical Drawing List Drawing Description Figure Num.
Mechanical Drawings 48 Intel ® 8500 Chipset North Bridge (NB) and eXternal Memory Bridge (XMB) Thermal/Mechanical Design Gu ide Figure B-1. NB Heatsink #1 Assembl y Drawing.
Intel ® 8500 Chipset North Bridge (NB) and eXternal Memory 49 Bridge (XMB) Thermal/Me chanical Design Guide Mechanical Drawings Figure B-2. NB Heat sink #1 Drawing.
Mechanical Drawings 50 Intel ® 8500 Chipset North Bridge (NB) and eXternal Memory Bridge (XMB) Thermal/Mechanical Design Gu ide Figure B-3. NB Heatsink #2 Assembl y Drawing.
Intel ® 8500 Chipset North Bridge (NB) and eXternal Memory 51 Bridge (XMB) Thermal/Me chanical Design Guide Mechanical Drawings Figure B-4. NB Heat sink #2 Drawing.
Mechanical Drawings 52 Intel ® 8500 Chipset North Bridge (NB) and eXternal Memory Bridge (XMB) Thermal/Mechanical Design Gu ide Figure B-5. XMB Heatsink Assembly Drawing.
Intel ® 8500 Chipset North Bridge (NB) and eXternal Memory 53 Bridge (XMB) Thermal/Me chanical Design Guide Mechanical Drawings Figure B-6. XMB Heat sink Drawing.
Mechanical Drawings 54 Intel ® E8500 Chipset North Brid ge (NB) and eXternal Memory Bridge (XMB) Thermal/Mech anical Design Guide §.
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