IntelメーカーItanium 2 Processorの使用説明書/サービス説明書
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Intel ® It anium ® 2 Processor Intel ® Itanium ® 2 Processor 1.66 GHz with 9 MB L3 Cache Intel ® Itanium ® 2 Processor 1.66 GHz with 6 MB L3 Cache Intel ® Itanium ® 2 Processor 1.6 GHz with 9 MB L3 Cache Intel ® Itanium ® 2 Processor 1.6 GHz with 6 MB L3 Cache Intel ® Itanium ® 2 Processor 1.
2 Datasheet INFORMA TI ON IN THIS DOCUME NT IS PROVIDED IN CONNECTION WI TH INTEL ® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHER WISE, TO ANY INTEL LECTUAL PROPERTY RIGH TS IS GRANTED BY THIS DO CUMENT .
Datasheet 3 Contents 1 Introduction... ................ ................ ............. ................ ................ ................. ................ . ..... 11 1.1 Overview ................ ................ ............. ................ ......
4 Datasheet 6.1.3 SMBus Device Addressing .... ................. ................ ................ ................ 81 6.2 Processor Information ROM ......... ................ ................ ................ .................... ... 82 6.3 Scratch EEPROM .
Datasheet 5 A.1.37 ID[9:0]# (I) ....... ................ ................ ................ ................. ................ ...... 99 A.1.38 IDS# (I) ............ ................ ................ ................ ................. ............ ....
6 Datasheet 5-2 Itanium ® 2 Processor Package Thermocouple Location........ ................... .......... 77 6-1 Logical Schematic of S MBus Circuitry ................... ................ ................ ............. 80 Tables 2-1 Itanium ® 2 Processor System Bus Signal Groups .
Datasheet 7 6-2 Thermal Sensing Device SMBus Addr essing on the Itanium ® 2 Processor . ...... 81 6-3 EEPROM SMBus Addres sing on the Itanium ® 2 Processor ......... ... ... ... ... .... ... ... 82 6-4 Processor Information RO M Format .............
8 Datasheet Revision History Revision No. Description Date -001 Initial release of this document. July 2002 -002 Updated content to include inform ation pertaining to Itanium 2 processor (1.5 GHz, 6 M B), Itanium 2 processor (1. 4 GHz, 4 MB) and Itanium 2 processor (1.
Datasheet 9 Intel ® It anium ® 2 Processor Intel ® Itanium ® 2 Processor 1.66 GHz with 9 MB L3 Cache Intel ® Itanium ® 2 Processor 1.66 GHz with 6 MB L3 Cache Intel ® Itanium ® 2 Processor 1.6 GHz with 9 MB L3 Cache Intel ® Itanium ® 2 Processor 1.
10 Datasheet.
Datasheet 11 1 Introduction 1.1 Overview The Itanium 2 processor employs Explicitly Parallel Instructi on Com pu ting (EPIC) design concepts for a tighter coupling between hardware a nd software.
12 Datasheet Introduction 1.3 Mixing Processors of Different Frequencies and Cache Sizes All Itanium 2 processors on the same system bu s are required to have the same cache size (9 MB , 6 MB, 4 MB, 3 MB or 1.
Datasheet 13 Introduction 1.6 Reference Document s The reader of this specification sh ould also be fami liar with mate ri al and concepts pres ented in the following documents: Note: Contact your Intel representativ e or check http:/ /d eveloper .intel.
14 Datasheet Introduction.
Datasheet 15 2 Electrical Specifications This chapter describes the electrical sp ecifications of the Itanium 2 processo r . 2.1 It anium ® 2 Processor System Bus Most Itanium 2 processor signals use the Itanium processor ’ s assi sted gunning tran scei ver lo gic (AG TL+) signaling technol ogy .
16 Datasheet Electrical Specifications .. All system bus outputs should be treated as open drain signals and require a high level source provided by the V CTERM supply . AG TL+ inputs have differential input buffers which use V REF as a reference level.
Datasheet 17 Electrical Specifications V CTERM System bus termination voltage. GND System ground. N/C No connection can be made to these pins. TERMA, TERMB The Itanium 2 processor uses two pins to control th e on-die termination function, TERMA and TERMB.
18 Datasheet Electrical Specifications 2.4 Signal S pecifications This section describes the DC specifications of th e system bus signals. The processor signal’ s DC specifications are defined at the Itanium 2 processor pins.
Datasheet 19 Electrical Specifications I L Leakage Current All ±100 µA 5 C AG T L+ AG TL+ Pad Capacitance 900 MHz 3 pF 6 1.0 GHz 3 pF 6 1.3 GHz 1.5 pF 6 1.4 GHz 1.5 pF 6 1.5 GHz 1.5 pF 6 1.6 GHz 1.5 pF 6 1.66 GHz 1.5 pF 6 NOTES: 1. The typical transition point between V IL and V IH assuming 125 mV V REF uncert ainty for ODT.
20 Datasheet Electrical Specifications Ta b l e 2 - 1 0 through Ta b l e 2 - 1 1 list the AC specifications for th e Itanium 2 processor’ s clock and SMBus (timing diagrams beg in with Figure 2-1 ). The Itanium 2 processor uses a differential HSTL clocking scheme with a frequency of 200, 266 or 333 MHz.
Datasheet 21 Electrical Specifications T low BCLKp Low T ime 266 1.69 1.88 2.06 ns Figure 2-1 4 T period BCLKp Period 333 3.0 ns Figure 2-1 T skew System Clock Skew 333 60 ps f BCLK BCLKp Frequency 333 333 333 MHz Figure 2-1 T jitter BCLKp Input Jitter 333 50 ps Figur e 2-1 3 T high BCLKp High T ime 333 1.
22 Datasheet Electrical Specifications 2.4.1 Maximum Ratings Ta b l e 2 - 1 2 contains the Itanium 2 pro cessor stress ratings. Functiona l operation at the absolute maximum and minimum is neither implied nor guaranteed. The processor should not receive a clock while subjected to these conditions.
Datasheet 23 Electrical Specifications 2.5 System Bus Signal Quality S pecifications and Measurement Guidelines Overshoot (or undershoot) is the absolut e value of the maximum vol tage abov e the nominal V CTERM voltage (or below GND), as shown in Ta b l e 2 - 3 .
24 Datasheet Electrical Specifications 2.5.2 Overshoot/Undershoot Pulse Duration Pulse duration describes the total time an overshoot/undersh oot event exceeds the overshoot/undershoot reference voltage (V CTERM /GND). The total time could encom pass several oscillations above the reference voltage.
Datasheet 25 Electrical Specifications Note: AF for the common clock AG TL+ signals is re ferenced to BCLKn, and BCLKp frequency . The wired-OR Signal s (BINIT#, HIT#, HITM#, BNR#, TND#, BERR#) are common clock AG TL+ signals. Note: AF for source synchronous (2x) signals is referenced to STBP#[7:0], and STBN#[7 :0].
26 Datasheet Electrical Specifications 3. If multiple overshoots and/or multiple undershoots occu r , measure the worst-case pulse duration for each magnitude and compare the results against the AF = 1 specifications.
Datasheet 27 Electrical Specifications T able 2-15. Itanium ® 2 Processors (1.5 GHz/4 MB, 1.6 GHz) Source Synchronous AG TL+ Signal Group T ime-Dependent Overshoot/Under shoo t T olerance for 400 MHz System Bus Absolu te Maximum (V) Pulse Duration (ns) Over- shoot Under- shoot AF = 1 1 NOTES: 1.
28 Datasheet Electrical Specifications 2.5.6 Wired-OR Signals System bus signals must meet certain overshoot and und ershoot requirements. The maxi mum absolute overshoot voltage is 1.
Datasheet 29 Electrical Specifications T able 2-19. Itanium ® 2 Processors (1.5 GHz/4 MB, 1.6 GHz) Wired-OR Signal Group (BINIT#, HIT#, HITM#, BNR#, TND#, BERR#) Overshoot/Undershoot T olerance for 400 MHz System Bus Absolu te Maximum (V) Pulse Duration (ns) Over- shoot Under- shoot AF = 1 1 NOTES: 1.
30 Datasheet Electrical Specifications 2.6 Power Pod Connector Signals Power delivery for the Itanium 2 processor is from a DC-DC converter called the “power pod”. The power pod consists of a DC-DC converter and a semi-flexib le connector which delivers the voltage to the processor .
Datasheet 31 Electrical Specifications The power pod provides a sel ectable ou tput voltage controlled via multiple bi nary weighted V oltage Identification (VID) inp uts.
32 Datasheet Electrical Specifications 2.7 It anium ® 2 Processor System Bus Clock and Processor Clocking The BCLKn and BCLKp inputs cont rol th e oper atin g fr eque ncy of the Itanium 2 process or system bus interface.
Datasheet 33 Electrical Specifications Listed in T able 2-25 are the system bus rat ios defi ned fo r the Itanium 2 proces sor . The Itanium 2 processor supports bus rati os of 2/ 9, 2/10, 2/13, 2/14, 2 /15 and 2/16. T able 2-25 lists the system bus ratios defined for the Itanium 2 processor .
34 Datasheet Electrical Specifications W arm Reset Sequence : • PWRGOOD remains high throug hout the entire se quence as power is already available and stable to the processor . • The bus ratio configuration pins (A[21:17]#) mu st be asserted the entire ti me RESET# is asserted.
Datasheet 35 Electrical Specifications 2.8 Recommended Connections for Unused Pins Pins that are unused in an application environm ent (as opposed to testing environm en t) should be connected to the states listed in T able 2-26 . Pins that must be used in an applica tion are stated as such and do not have a recommended state for unused connection.
36 Datasheet Electrical Specifications System Management Signals 3.3V GND SMA[2:0] N/C SMSC N/C SMSD N/C SMWP N/C THRMALERT# H 1, 4 L VTTL Power Pod Sign als OUTEN Must be used PPODGD# Must be used CPUPRES# Must be used Reserved Pins N/C N/C NOTES: 1.
Datasheet 37 3 Pinout Specifications This chapter describes the Itanium 2 processor signals and pino ut. Note: The pins labeled “N/C” must rema in unconnected. The Itanium 2 pr ocessor uses a JEDEC standard pin naming convention. In this chapter , pin names ar e the actual names given to each physical pin of the processor .
38 Datasheet Pinout Specificat ions Ta b l e 3 - 1 provides the It an ium 2 processor pin list in alph abetical order . Ta b l e 3 - 2 provides the It an ium 2 processor pin list by pin location. T able 3-1. Pin/Signal Information Sorted by Pin Name (Sheet 1 of 15) Pin Name System Bu s Signal Name Pin Location Input/Out put Notes 3.
Datasheet 39 Pinout Specifications A040# AA40#/AB40# V24 IN/OUT A041# AA41#/AB41# W25 IN/OUT A042# AA42#/AB42# U23 IN/OUT A043# AA43#/AB43# Y24 IN/OUT A044# AA44#/AB44# W21 IN/OUT A045# AA45#/AB45# V2.
40 Datasheet Pinout Specificat ions D010# D10# E07 IN/OUT D01 1# D1 1# H02 IN/OUT D012# D12# H04 IN/OUT D013# D13# J03 I N/OUT D014# D14# G03 IN/OUT D015# D15# G07 IN/OUT D016# D16# K04 IN/OUT D017# D.
Datasheet 41 Pinout Specifications D051# D51# M12 IN/OUT D052# D52# L13 IN/OUT D053# D53# L09 IN/OUT D054# D54# P08 IN/OUT D055# D55# N13 IN/OUT D056# D56# L1 1 IN/OUT D057# D57# P12 IN/OUT D058# D58#.
42 Datasheet Pinout Specificat ions D092# D92# R15 IN/OUT D093# D93# P16 IN/OUT D094# D94# T14 IN/OUT D095# D95# P18 IN/OUT D096# D96# E21 IN/OUT D097# D97# C23 IN/OUT D098# D98# D22 IN/OUT D099# D99#.
Datasheet 43 Pinout Specifications DEP01# DEP1# J05 IN/OUT DEP02# DEP2# T06 IN/OUT DEP03# DEP3# T04 IN/OUT DEP04# DEP4# J09 IN/OUT DEP05# DEP5# J1 1 IN/OUT DEP06# DEP6# T08 IN/OUT DEP07# DEP7# T10 IN/.
44 Datasheet Pinout Specificat ions GND GND AB19 IN GND GND AB21 IN GND GND AB23 IN GND GND AB25 IN GND GND AC02 IN GND GND AC24 IN GND GND AD01 IN GND GND AD03 IN GND GND AD05 IN GND GND AD07 IN GND .
Datasheet 45 Pinout Specifications GND GND AG22 IN GND GND AG24 IN GND GND AH01 IN GND GND B03 IN GND GND B05 IN GND GND B07 IN GND GND B09 IN GND GND B10 IN GND GND B1 1 IN GND GND B13 IN GND GND B15.
46 Datasheet Pinout Specificat ions GND GND F01 IN GND GND F03 IN GND GND F05 IN GND GND F07 IN GND GND F09 IN GND GND F1 1 IN GND GND F13 IN GND GND F15 IN GND GND F17 IN GND GND F19 IN GND GND F21 I.
Datasheet 47 Pinout Specifications GND GND K19 IN GND GND K21 IN GND GND K23 IN GND GND K25 IN GND GND L02 IN GND GND M01 IN GND GND M03 IN GND GND M05 IN GND GND M07 IN GND GND M09 IN GND GND M1 1 IN.
48 Datasheet Pinout Specificat ions GND GND T13 IN GND GND T15 IN GND GND T17 IN GND GND T19 IN GND GND T21 IN GND GND T23 IN GND GND T25 IN GND GND U04 IN GND GND U20 IN GND GND U24 IN GND GND V01 IN.
Datasheet 49 Pinout Specifications ID1# IDA1#/IP1 # AB02 IN ID2# IDA2#/DHIT# AC03 IN ID3# IDA3#/IDB3# AA03 IN ID4# IDA4#/IDB4# AD04 IN ID5# IDA5#/IDB5# AB04 IN ID6# IDA6#/IDB6# AE05 IN ID7# IDA7#/IDB7.
50 Datasheet Pinout Specificat ions N/C K02 N/C K12 N/C K14 N/C K24 N/C U05 N/C U1 1 OUTEN OUTEN AF04 IN Power pod signal PMI# PMI# AE25 IN PPODGD# PPODGD# AF20 OUT Power pod signal PWRGOOD PWRGOOD AH.
Datasheet 51 Pinout Specifications STBP2# STBP2# E1 1 IN/OUT STBP3# STBP3# M10 IN/OUT STBP4# STBP4# E17 IN/OUT STBP5# STBP5# M16 IN/OUT STBP6# STBP6# E23 IN/OUT STBP7# STBP7# M22 IN/OUT TCK TCK AG09 I.
52 Datasheet Pinout Specificat ions VCTERM VCTERM G04 IN VCTERM VCTERM G08 IN VCTERM VCTERM G12 IN VCTERM VCTERM G16 IN VCTERM VCTERM G20 IN VCTERM VCTERM G24 IN VCTERM VCTERM J02 IN VCTERM VCTERM J06.
Datasheet 53 Pinout Specifications T able 3-2. Pin/Signal In for mation Sorted by Pin Location (Sheet 1 of 15) Pin Name System Bus Signal Name Pin Location Input/Output Notes GND GND A01 IN VCTERM VCT.
54 Datasheet Pinout Specificat ions N/C B20 GND GND B21 IN SMSD SMSD B22 IN/OUT SMBus signal GND GND B23 IN SMSC SMSC B24 IN SMBus signal GND GND B25 IN VCTERM VCTERM C01 IN GND GND C02 IN N/C C03 VCT.
Datasheet 55 Pinout Specifications GND GND D1 1 IN D036# D36# D12 IN/OUT GND GND D13 IN D065# D65# D14 IN/OUT GND GND D15 IN D066# D66# D16 IN/OUT GND GND D17 IN D064# D64# D18 IN/OUT GND GND D19 IN D.
56 Datasheet Pinout Specificat ions GND GND F03 IN STBN0# STBN0# F04 IN/OUT GND GND F05 IN D006# D06# F06 IN/OUT GND GND F07 IN D045# D45# F08 IN/OUT GND GND F09 IN STBN2# STBN2# F10 IN/OUT GND GND F1.
Datasheet 57 Pinout Specifications VCTERM VCTERM G24 IN D107# D107# G25 IN/OUT D01 1# D1 1# H02 IN/OUT GND GND H03 IN D012# D12# H04 IN/OUT GND GND H05 IN D009# D09# H06 IN/OUT GND GND H07 IN D042# D4.
58 Datasheet Pinout Specificat ions GND GND J16 IN DEP09# DEP9# J17 IN/OUT VCTERM VCTERM J18 IN DEP08# DEP8# J19 IN/OUT GND GND J20 IN DEP12# DEP12# J21 IN/OUT VCTERM VCTERM J22 IN DEP13# DEP13# J23 I.
Datasheet 59 Pinout Specifications D053# D53# L09 IN/OUT D056# D56# L1 1 IN/OUT VCTERM VCTERM L12 IN D052# D52# L13 IN/OUT D081# D81# L15 IN/OUT VCTERM VCTERM L16 IN D088# D88# L17 IN/OUT D082# D82# L.
60 Datasheet Pinout Specificat ions STBN1# STBN1# N05 IN/OUT VCTERM VCTERM N06 IN D022# D22# N07 IN/OUT D058# D58# N09 IN/OUT VCTERM VCTERM N10 IN STBN3# STBN3# N1 1 IN/OUT D055# D55# N13 IN/OUT VCTER.
Datasheet 61 Pinout Specifications D120# D120# P24 IN/OUT GND GND P25 IN VCTERM VCTERM R01 IN GND GND R02 IN D025# D25# R03 IN/OUT VCTERM VCTERM R04 IN D029# D29# R05 IN/OUT D031# D31# R07 IN/OUT VCTE.
62 Datasheet Pinout Specificat ions DEP14# DEP14# T 20 IN/OUT GND GND T21 IN DEP15# DEP15# T 22 IN/OUT GND GND T23 IN D123# D123# T24 IN/OUT GND GND T25 IN VCTERM VCTERM U02 IN A005# AA 05#/EXF2# U03 .
Datasheet 63 Pinout Specifications GND GND V15 IN A038# AA38#/AB38# V16 IN/OUT GND GND V17 IN A029# AA29#/xTPRV alue 2# V18 IN/OUT GND GND V19 IN A045# AA45#/AB45# V20 IN/OUT GND GND V21 IN A047# AA47.
64 Datasheet Pinout Specificat ions A035# AA35#/A TTR3# Y18 IN/OUT GND GND Y19 IN A039# AA39#/AB39# Y20 IN/OUT GND GND Y21 IN A049# AA49#/AB49# Y22 IN/OUT GND GND Y23 IN A043# AA43#/AB43# Y24 IN/OUT G.
Datasheet 65 Pinout Specifications GND GND AB19 IN ADS# ADS# AB20 IN/OUT GND GND AB21 IN BERR# BERR# AB22 IN/OUT GND GND AB23 IN BPM5# BPM5# AB24 IN/OUT GND GND AB25 IN GND GND AC02 IN ID2# IDA2#/DHIT.
66 Datasheet Pinout Specificat ions GND GND AD21 IN BPM0# BPM0# AD22 IN/OUT GND GND AD23 IN BPM4# BPM4# AD24 IN/OUT GND GND AD25 IN GND GND AE02 IN TERMB FSBT2 AE03 ID6# IDA6#/IDB6# AE05 IN RS0# RS0# .
Datasheet 67 Pinout Specifications GND GND AG02 IN TUNER[2] AG03 GND GND AG04 IN N/C AG05 GND GND AG06 IN TDI T DI AG07 IN JT AG GND GND AG08 IN TCK TCK AG09 IN JT AG GND GND AG10 IN N/C AG1 1 GND GND.
68 Datasheet Pinout Specificat ions.
Datasheet 69 4 Mechanical Specifications This chapter provides the mechanical sp ecifications of the Itanium 2 processor . 4.1 Mechanical Dimensions The Itanium 2 processor package is comprised of an interposer , a processor package substrate, and an integrated heat spreader (IHS), as illustrated i n Figure 4-1 .
70 Datasheet Mechanical Specifications NOTE: Figure 4-2. Itanium ® 2 Pro cessor Package All dimensions are measured in mm. Not to scale. 000655g 90.00 42.50 38.50 48.26 42.50 38.50 Top View 25 x 1.27 Pitch Bottom View 28 x 1.27 Pitch 34.29 30.48 611 x 0.
Datasheet 71 Mechanical Specifications Figure 4- 3. Itanium ® 2 Processor Package Power T ab All dime nsions a re measur ed in mm . Not to sca le. 001 159a Top View Bottom View 46.96 42.21 46.00 2x 9.10 2x 12.91 4x R1.00 C L 2.98 12x 2.92 2x 25.85 C L 12x 38.
72 Datasheet Mechanical Specifications 4.2 Package Marking The following section details the processo r top-side and bottom-side markings for the Itanium 2 processor and is provided as an iden tification aid. The processor top-si de mark for the product is a laser marking on the IHS.
Datasheet 73 Mechanical Specifications NOTE: 2D Matrix Mark only present on Itanium 2 processo r (6 MB), Itanium 2 processor (4 MB) and Itanium 2 processor (1.
74 Datasheet Mechanical Specifications.
Datasheet 75 5 Thermal Specifications This chapter provides a descript ion of the thermal features rela ting to the Itanium 2 processor . 5.1 Thermal Features The Itanium 2 processor has an internal thermal ci rcuit which senses when a certain temperature is reached on the processor core.
76 Datasheet Thermal Specificat ions 5.1.2 Enhanced Thermal Management ETM is a new feature that has b een added to the Itanium 2 proce ssor . ETM uses a thermal sensing device on the die to monitor a thermal entry poi nt, indicating dangerous operation exceeding the thermal specification.
Datasheet 77 Thermal Specifications Figure 5- 2. Itanium ® 2 Processor Package Thermocouple Location All dime nsions a re measur ed in mm . Not to sca le.
78 Datasheet Thermal Specificat ions.
Datasheet 79 6 System Management Feature Specifications The Itanium 2 processor includes a system mana gement bus (SMBus) interface. This chapter describes the features of th e SMBus and SMBus components.
80 Datasheet System Management Featu re Specifications Figure 6-1. Logical Sche matic of SMBu s Circuitry NOTE: 1. Actual implementation may vary. 2. For use in general understanding of the architectur e. 000668b Processor Information ROM A0 A1 A2 SC SD V CC 10K 10K 3.
Datasheet 81 System Management Featu re Specifications 6.1.3 SMBus Device Addressing Of the addresses broadcast across the SMBus, th e memory component s claim those of the form “1010XXYZb”. The “XX” and “Y” bits are used to enable the devices on the processor at adjacent addresses.
82 Datasheet System Management Featu re Specifications 6.2 Processor Information ROM An electrically programmed read-only m e mory (R O M) provides informatio n about the Itanium 2 processor . The checksum bits for each category pr ovide error correction an d serve as a mechanism to check whether data is corrupt ed or not.
Datasheet 83 System Management Featu re Specifications 09h 8 Feature Data Address Byte pointer , 00h if not present 67h 0Ah 8 Other Data Address Byte pointer , 00h if not present 7Ah 0Bh 16 Reserved Reserved for future use 0000h 0Dh 8 Checksum 1 byte checksum Add up by byte and take 2’ s complement.
84 Datasheet System Management Featu re Specifications Package 37h 32 Package Revision Four 8-bit ASCII cha racters Itanium ® 2 Package = INT2b, (1.50 GHz 4MB and above) = INT3b: • 37h = I • 38h .
Datasheet 85 System Management Featu re Specifications 6.3 Scratch EEPROM Also available on the SMBus interface on the pr oces sor is an EEPROM which may be used for other data at the system vendor ’ s discretion (Intel wi ll not be using the scratch EEPROM).
86 Datasheet System Management Featu re Specifications controller continues to transmit data bytes until it terminates the sequen ce with a stop. All data bytes will result in an acknowledge from the Scratch EEPROM. If more than eight bytes are written, the internal address will “roll over” and the previous data will be overwritten.
Datasheet 87 System Management Featu re Specifications THRMALER T# signal (see Section 6 .1.1 for more details). At power up, the appropriate alarm register values need to be pr ogrammed into th e therma l sensing device via the SMBus.
88 Datasheet System Management Featu re Specifications All of the commands are for reading or writing registers in th e thermal sensor except the one-shot command (OSHT). The one-shot command forces the immediate start of a new voltage-to- temperature conversion cycle.
Datasheet 89 System Management Featu re Specifications 6.7.2 Thermal Limit Registers The thermal sensing device h as two thermal limi t registers; th ey define high and low lim its for the processor core thermal diode. The en coding for th ese registers is the same as for the thermal reference registers.
90 Datasheet System Management Featu re Specifications 6.7.5 Conversion Rate Register The contents of the conversion rate register dete rmine the nominal rate at which analog-to-di gital conversions happen when the thermal sen sing device is in auto-convert mode.
Datasheet 91 A Signals Reference This appendix provides an alph ab etical listing of all Itanium 2 processor system bus signals. The tables at the end of this appendix summarize th e signals by direction: output, inp ut, and I/ O.
92 Datasheet Signals Referenc e Any memory access transaction addr essing a memory region that is less than 64 GB (that is, Aa[49:36]# are all zeroes) must set ASZ[1:0]# to 01. Any memory access transaction address ing a memory region that is equal to or great er than 64 GB (that is, Aa[49:36]# are not all zeroes) must set ASZ[1:0]# to 10.
Datasheet 93 Signals Reference For memory or I/O transactions, the byte-enable signals indicate th at vali d dat a is req u ested or being transferred on the corresponding byt e on the 128-bit data bus. BE[0]# indi cates that the least significant byte is valid, and BE[7]# i ndicates that the most significant byte is valid.
94 Datasheet Signals Referenc e A.1.10 BINIT# (I/O) If enabled by configuration, the Bus Initialization (BINIT# ) signal is asserted to signal any bus condition that prevents reli able fu ture operation. If BINIT# observation is enabled during power-on configuration, and BIN IT# is sampled asserted, all bus state machines are reset.
Datasheet 95 Signals Reference During power-on configuration, the priority ag ent must assert the BR [0]# bus signal. Al l symmetric agents sample their BR[3:0 ]# pins on a sserted-to-deasserted tran sition of RESET#. The pin on which the agent samp les an asserted level determines its ag ent ID.
96 Datasheet Signals Referenc e sampling BREQn# asserted by another symmetri c agent, the symmetric owner deasserts BREQ n # as soon as possible to release the bus. A symmetric owner stops issuing new requests that are not part of an existing locked operation on observing BPRI# asserted .
Datasheet 97 Signals Reference A.1.22 DBSY_C2# (O) DBSY# is a copy of the Data Bus Busy sign al. This copy of the Data Bus Busy signal (DBSY_C2#) is an output only . A.1.23 DEFER# (I) The DEFER# signal is asserted by an agent to indi cate that the transaction cannot be guaranteed in- order completion.
98 Datasheet Signals Referenc e The Deferred Reply agent transmits the DID[9:0] # (Ab[25:16]#) signals received during the original transaction on the Aa[25:16]# signals duri ng the Deferred Reply transaction. This process enables the origin al requesting agent to make an identifier match with the o riginal request that i s awaiting completi on.
Datasheet 99 Signals Reference A.1.33 FCL# (I/O) The Flush Cache Line (FCL#) signal is driven to the bus on the second clock of the Request Phase on the A[6]# pin. FCL# is asserted to indicate that the memory trans action i s initiated by the global Flush Cache ( FC ) instruction .
100 Datasheet Signals Referenc e A.1.39 IGNNE# (I) IGNNE# is ignored in the Itanium 2 processor system environment. A.1.40 INIT# (I) The Initialization (INIT#) signal triggers an unm aske d interrupt to the processor . INIT# is usually used to break into hanging or idle processor states.
Datasheet 101 Signals Reference A.1.44 LINT[1:0] (I) LINT[1:0] are local interrupt signals. These pins are disabled after RESET# . LINT[0] is typically software configured as INT , an 8259-compatible maskable in terrupt request sig nal. LINT[1] is typically software configured as NMI, a non-m askable interrupt.
102 Datasheet Signals Referenc e All receiving agents observe th e R EQ[5:0]# signals to determ ine the transaction type and participate in the transacti on as necessary , as shown in T able A-10 .
Datasheet 103 Signals Reference A correct parity signal is high if an even number of covered si gnals are low and low if an odd number of covered signals are low .
104 Datasheet Signals Referenc e A.1.59 STBn[7:0]# an d STBp[7:0]# (I/O) STBp[7:0]# and STBn[7:0]# (and DRDY #) are used to transfer data at the 2x transfer rate in lieu of BCLKp.
Datasheet 105 Signals Reference A.1.64 THRMALERT# (O) THRMALER T# is asserted when the measured temperature from the processor thermal diode equals or exceeds the temperature thres hold data programmed in the hi gh-temp (THIGH) or low- temp (TLOW) registers on the sensor .
106 Datasheet Signals Referenc e SBSY_C1# Low BCLKp Data SBSY_C2# Low BCLKp Data TDO High TCK T AP THRMTRIP# Low Asynchronou s Error THRMALERT# Low Asynchronous Error T able A-13.
Datasheet 107 Signals Reference T able A-14. Input/Output Signals (Single Driver) Name Active Level Clock S ignal Group Q ualified A[49:3]# Low BCLKp Request ADS#, ADS#+1 ADS# Low BCLKp Request Always.
108 Datasheet Signals Referenc e.
デバイスIntel Itanium 2 Processorの購入後に(又は購入する前であっても)重要なポイントは、説明書をよく読むことです。その単純な理由はいくつかあります:
Intel Itanium 2 Processorをまだ購入していないなら、この製品の基本情報を理解する良い機会です。まずは上にある説明書の最初のページをご覧ください。そこにはIntel Itanium 2 Processorの技術情報の概要が記載されているはずです。デバイスがあなたのニーズを満たすかどうかは、ここで確認しましょう。Intel Itanium 2 Processorの取扱説明書の次のページをよく読むことにより、製品の全機能やその取り扱いに関する情報を知ることができます。Intel Itanium 2 Processorで得られた情報は、きっとあなたの購入の決断を手助けしてくれることでしょう。
Intel Itanium 2 Processorを既にお持ちだが、まだ読んでいない場合は、上記の理由によりそれを行うべきです。そうすることにより機能を適切に使用しているか、又はIntel Itanium 2 Processorの不適切な取り扱いによりその寿命を短くする危険を犯していないかどうかを知ることができます。
ですが、ユーザガイドが果たす重要な役割の一つは、Intel Itanium 2 Processorに関する問題の解決を支援することです。そこにはほとんどの場合、トラブルシューティング、すなわちIntel Itanium 2 Processorデバイスで最もよく起こりうる故障・不良とそれらの対処法についてのアドバイスを見つけることができるはずです。たとえ問題を解決できなかった場合でも、説明書にはカスタマー・サービスセンター又は最寄りのサービスセンターへの問い合わせ先等、次の対処法についての指示があるはずです。