Texas InstrumentsメーカーADS61B23EVMの使用説明書/サービス説明書
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ADS61xx and ADS61B23EVM User's Guide Literature Number: SLAU206B September 2007 – Revised April 2008.
2 SLAU206B – September 2007 – Revised April 2008 Submit Documentation Feedback.
Contents 1 Overview ............................................................................................................................. 5 1.1 ADS61xx/ADS61B23 EVM Quick-Start Procedure ........................................................
www.ti.com List of Figures 1 TI ADC SPC Interface Screen ........................................................................................... 10 2 Top Silkscreen ..................................................................................
1 Overview 1.1 ADS61xx/ADS61B23 EVM Quick-Start Procedure User's Guide SLAU206B – September 2007 – Revised April 2008 This user's guide gives a general overview of the evaluation module (EVM) and provides a general description of the features and functions to be considered while using this module.
2 Circuit Description 2.1 Schematic Diagram 2.2 ADC Circuit Function 2.2.1 ADC Operational Mode 2.2.2 EVM Power Connections 2.2.3 ADC Analog Inputs Circuit Description www.ti.com The schematic diagram for the EVM is in Section 6.3 . The following sections describe the function of individual circuits.
2.2.4 ADC Clock Input 2.2.5 ADC Digital Outputs www.ti.com Circuit Description Note that the THS4509 used on this EVM is pinout compatible with the THS4508 , THS4511 , THS4513 , and THS4520 .
2.2.6 Jumper Selections Circuit Description www.ti.com Table 1. Breakout Board Pin Assignments ADS6122/23/B23/24/25 J4 PIN ADS6142/43/44/45 DESCRIPTION DESCRIPTION 1 GND GND 2 CLK CLK 3 GND GND 4 NC N.
www.ti.com Circuit Description Table 2. Jumpers Description Reference Designator Default Selection Optional Selection Parallel mode: SEN pin J1 5–6, Offset binary, CMOS output Multiple choices volta.
3 TI ADC SPI Control Interface 3.1 Installing the ADC SPI Control Software TI ADC SPI Control Interface www.ti.com This section describes the software features accompanying the EVM kit. The TI ADC SPI control software provides full control of the SPI interface, allowing users to write to any of the ADC registers found in the ADC data sheet.
3.2 Setting Up the EVM for ADC SPI Control 3.3 Using the TI ADC SPI Interface Software 3.3.1 SPI Register Writes 3.3.2 SPI Register Write Using a Script File 3.3.2.1 ADS61xx Frequently Used Registers www.ti.com TI ADC SPI Control Interface Users who wish to use the ADC SPI interface must supply 5 VDC to J20, which provides power to the USB circuit.
TI ADC SPI Control Interface www.ti.com Table 4. ADS61xx Frequently Used Registers Default Value Alternate Value ADS61xx Reset 2s Complement Straight Binary CMOS DDR LVDS Powerdown: OFF Powerdown On No Course Gain 3.
4 Connecting to FPGA Platforms 4.1 TSW1100 4.2 TSW1200 www.ti.com Connecting to FPGA Platforms The ADS61xx/ADS61B23 EVM provides several connection options to mate the EVM to various FPGA development platforms and FPGA-based capture boards.
5 ADC Evaluation 5.1 Hardware Selection 5.1.1 Analog Input Signal Generator 5.1.2 Clock Signal Generator ADC Evaluation www.ti.com This section describes how to set up a typical ADC evaluation system that is similar to what TI uses to perform testing for data-sheet generation.
5.2 Coherent Input Frequency Selection www.ti.com ADC Evaluation Typical ADC analysis requires users to collect the resulting time-domain data and perform a Fourier transform to analyze the data in the frequency domain.
6 Physical Description 6.1 PCB Layout Physical Description www.ti.com This section describes the physical characteristics and PCB layout of the EVM. The EVM is constructed on a four-layer, 0.062-inch thick PCB using FR-4 material. The individual layers are shown in Figure 2 through Figure 6 .
www.ti.com Physical Description Figure 3. Component Side SLAU206B – September 2007 – Revised April 2008 17 Submit Documentation Feedback.
Physical Description www.ti.com Figure 4. Ground Plane 1 18 SLAU206B – September 2007 – Revised April 2008 Submit Documentation Feedback.
www.ti.com Physical Description Figure 5. Power Plane 1 SLAU206B – September 2007 – Revised April 2008 19 Submit Documentation Feedback.
Physical Description www.ti.com Figure 6. Bottom Side 20 SLAU206B – September 2007 – Revised April 2008 Submit Documentation Feedback.
6.2 Bill of Materials www.ti.com Physical Description Table 5. Bill of Materials Qty Reference Not Part Foot Print Part Number Manufacturer Installed 5 C1, C5, C8, C52, 33 µ F TANT_B B45196H2336M209 Kemet C54 5 C2, C9, C30, C56, 10 µ F 805 ECJ-2FB0J106K Panasonic C57 3 C3, C6, C31 1 µ F 603 ECJ-1VB1A105K Panasonic 43 C4, C7, 0.
Physical Description www.ti.com Table 5. Bill of Materials (continued) Qty Reference Not Part Foot Print Part Number Manufacturer Installed 0 R33 Not 200 Ω 402 ERJ-2RKF2000X Panasonic installed 2 R36, R48 348 Ω 603 ERJ-3EKF3480V Panasonic 0 R37, R45 Not 499 Ω 603 ERJ-3EKF4990V Panasonic installed 2 R39, R43 69.
6.3 EVM Schematics PD VREF1 SIGNAL_IN +5V_AMP -VSS_AMP +5V_AMP AGND AMP+ AMP- AMP+ AMP- VREF SH2 IN_M SH2 IN_P SH2 VREF SH2 Default:Short2-3 Default:Short1-2 Default:Short1-2 R26 0OHM R26 0OHM R44 100 R44 100 C76 18pF C76 18pF T1 TC4-1W T1 TC4-1W 3 2 1 6 5 4 C34 .
ICLKP ICLKM SEN SDA SCLOCK PDWN SEN RESET SCLOCK +3.3VD +3.3V A +3.3VD +3.3VD +3.3VD +3.3VD +3.3VD +3.3VD IN_M SH1 IN_P SH1 D2_D3_P SH4 D0_D1_P SH4 D0_D1_M SH4 D2_D3_M SH4 D4_D5_P SH4 D4_D5_M SH4 D6_D.
ADCCLK- CLKOUT CLKOUT ADCCLK+ CLK- CLK+ +3.3V_AUX +3.3V_AUX +3.3V_AUX CDC_CLKM SH4 CDC_CLKP SH4 ICLKP SH2 ICLKM SH2 Default:Short2-3 Default:Short1-2 Default:Short1-2 Default:Short1-2 R29 49.9 1/10W 1% R29 49.9 1/10W 1% C16 .1uF 16V C16 .
D12_D13_P SH2 D12_D13_M SH2 D10_D1 1_P SH2 D10_D1 1_M SH2 D8_D9_P SH2 D8_D9_M SH2 CLKOUTP SH2 CLKOUTM SH2 D6_D7_P SH2 D6_D7_M SH2 D4_D5_P SH2 D4_D5_M SH2 D2_D3_P SH2 D2_D3_M SH2 D0_D1_P SH2 D0_D1_M SH.
+3.3VD_IN 5V_IN +3.3V A_IN +3.3V A +3.3VD 5V +5V_AMP C3 1uF C3 1uF 1 2 C4 .1uF C4 .1uF 1 2 J13 RED +3.3V A_IN J13 RED +3.3V A_IN C30 10uF 6.3V C30 10uF 6.3V 1 2 L1 68 L1 68 1 2 + C8 33uF + C8 33uF 1 2 + C52 33UF 10V + C52 33UF 10V 1 2 + C1 33uF + C1 33uF 1 2 L2 68 L2 68 1 2 C53 .
GND D6 D9 D1 D3 D7 D5 CLK D13 D0 D2 D8 D10 D12 D1 1 D4 D7 D6 D5 D4 D3 D2 D1 D0 D13 D12 D1 1 D10 D9 D8 CLK J1 CONN_QSH_30X2-D-A J1 CONN_QSH_30X2-D-A 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38.
EVALUATION BOARD/KIT IMPORTANT NOTICE Texas Instruments (TI) provides the enclosed product(s) under the following conditions: This evaluation board/kit is intended for use for ENGINEERING DEVELOPMENT, DEMONSTRATION, OR EVALUATION PURPOSES ONLY and is not considered by TI to be a finished end-product fit for general consumer use.
IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.
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