SonyメーカーMDS-JB920の使用説明書/サービス説明書
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MICROFILM SERVICE MANUAL MINI DISC DECK US Model Canadian Model AEP Model UK Model SPECIFICA TIONS MDS-JB920 Model Name Using Similar Mechanism MDS-JE520 MD Mechanism T ype MDM-5A Optical Pick-up T yp.
– 2 – General P ow er requirements Where purchased Power requirements Continental Europe and UK 220 – 230 V A C, 50/60 Hz U.S.A and Canada 120 V A C, 60 Hz Power consumption 18 W Dimensions (approx.) (w/h/d) incl.projecting parts and controls 430 × 107.
– 3 – Items of Err or Histor y Mode Items and Contents Selecting the T est Mode Display Details of History E00 No error E01 Disc error . PTOC cannot be r ead (DISC ejected) E02 Disc error .
– 4 – SECTION 1 SER VICING NO TES SAFETY CHECK-OUT After correcting the original service problem, perform the follow- ing safety check before releasing the set to the customer: Check the antenna terminals, metal trim, “metallized” knobs, screws, and all other e xposed metal parts for A C leakage.
– 5 – Flexible Cir cuit Board Repairing • Keep the temperature of the soldering iron around 270 ˚C dur - ing repairing. • Do not touch the soldering iron on the same conductor of the circuit board (within 3 times). • Be careful not to apply force on the conductor when soldering or unsoldering.
– 6 – JIG FOR CHECKING BD BO ARD W A VEFORM The special jig (J-2501-149-A) is useful for checking the wa v eform of the BD board. The names of terminals and the checking items to be performed are shown as follows.
– 7 – IOP Data Recording and Displa y When Pickup and Non-v olatile Memory (IC171 of BD boar d) are Replaced The IOP v alue labeled on the pick-up can be recorded in the non-volatile memory . By recording the v alue, it will eliminate the need to look at the v alue on the label of the optical pick-up.
– 8 – Chec ks Prior to Parts Replacement and Adjustments Before performing repairs, perform the following checks to determine the faulty locations up to a certain extent. Details of the procedures are described in “5 Electrical Adjustments”. • 0.
– 9 – [] Retry Cause Display Mode • In this test mode, the causes for retry of the unit during recording can be displayed on the fluorescent indicator tube. During playback, the “track mode” for obtaining track information will be set.
– 10 – Reading the Retry Cause Display 84218421 b7 b6 b5 b4 b3 b2 b1 b0 00000001 00000010 00000100 00001000 00010000 00100000 01000000 10000000 Hexa- decimal Details 01 02 04 08 10 20 40 80 Higher Bits Lower Bits Hexadecimal Bit Binary When 0 Emphasis OFF Monaural This is 2-bit display .
– 11 – SECTION 2 GENERAL LOCA TION OF CONTROLS • Front view 1 ST ANDBY indicator 2 1 / u (Po wer) button 3 TIMER switch 4 MEGA CONTR OL button 5 MEGA CONTR OL indicator 6 MUSIC SYNC button 7 SCR.
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– 14 – CASE (4095269) Note: Follow the disassemb ly procedure in the numerical order given. SECTION 3 DISASSEMBL Y • This set can be disassembled in the order sho wn below .
– 15 – FRONT P ANEL SECIT ON MAIN BO ARD 4 claw 3 five scre ws (BVTP3 × 8) 4 claw 5 front panel section 1 connector (CN790) 2 wire (flat type) (21 core) (MAIN-DISP) (CN800) 1 two connectors (CN80.
– 16 – MECHANISM SECTION (MDM-5A) 3 four step scre ws (BVTTWH M3) 4 Remov e the mechanism deck (MDM-5A) to direction of the arrow . 1 connector (CN401) 2 wire (flat type) (21 core) (MAIN-BD) (CN402) 2 wire (flat type) (23 core) (CN400) SLIDER (CAM) 1 two screws (P2.
– 17 – B ASE UNIT (MBU-5A), BD BO ARD 1 three screws (P2.6 × 6) 2 base unit (MBU-5A) 3 Remove the solder (Five portion). 4 screw (M1.7 × 4) 6 flexible board (CN101) 7 BD board 5 flexible board (CN104) SW BO ARD , LO ADING MO T OR (M103) 5 three screws (BTP2.
– 18 – SECTION 4 TEST MODE 1. PRECA UTIONS FOR USE OF TEST MODE • As loading related operations will be performed regardless of the test mode operations being performed, be sure to check that the disc is stopped before setting and removing it.
– 19 – 5. SELECTING THE TEST MODE There are 31 types of test modes as shown belo w . The groups can be switched by rotating the [AMS] knob . After selecting the group to be used, press the [YES] button.
– 20 – 5-1. Operating the Continuous Pla yback Mode 1. Entering the continuous playback mode (1) Set the disc in the unit. (Whichever recordable discs or discs for playback only are available.) (2) Rotate the [AMS] knob and displa y “CPLA Y MODE” (C30).
– 21 – 6. FUNCTIONS OF O THER BUTT ONS 7. TEST MODE DISPLA YS Each time the [DISPLA Y/CHAR] button is pressed, the display changes in the follo wing order . 1. Mode display Displays “TEMP ADJUST”, “CPLA YMODE”, etc. 2. Error rate display Displays the error rate in the follo wing way .
– 22 – · P REC –SYNC A.SP A CE O VER B A- TRA CK DISC DA TE CLOCK When Off Contents Display When Lit During continuous playback (CL V : ON) Tracking serv o OFF Recording mode ON CL V low speed .
– 23 – SECTION 5 ELECTRICAL ADJUSTMENTS 1. P ARTS REPLA CEMENT AND ADJUSTMENT • Check and adjust the MDM and MBU as follows. The procedure changes according to the part replaced • Abbreviation.
– 24 – 2. PRECA UTIONS FOR CHECKING LASER DIODE EMISSINON T o check the emission of the laser diode during adjustments, nev er view directly from the top as this may lose your eye-sight.
– 25 – 6. CHECK PRIOR T O REP AIRS These checks are performed before replacing parts according to “approximate specifications” to determine the faulty locations. For details, refer to “Checks Prior to Parts Re placement and Adjust- ments” (See page 8).
– 26 – 9. Press the [YES] button display “EFB = MO-P”. Then, the optical pick-up moves to the pit area automatically and servo is imposed. 10. Observe the waveform of the oscilloscope, and check that the specified value is satisfied. Do not rotate the [AMS] knob.
– 27 – 7. INITIAL SETTING OF ADJUSTMENT V ALUE Note: Mode which sets the adjustment results recorded in the non-volatile memory to the initial setting value. However the results of the tempera- ture compensation offset adjustment will not c hange to the initial setting value.
– 28 – 7. Then, rotate the [AMS] knob and display “LDPWR CHECK” (C02). 8. Press the [YES] button once and display “LD 0.9 mW $ ”. Check that the reading of the laser power meter become 0.85 to 0.
– 29 – ± ≠ ± ≠ 8. Rotate the [AMS] knob so that the waveform of the oscilloscope becomes the specified value. (When the [AMS] knob is rotated, the of “EFB- ” changes and the waveform changes.
– 30 – 13. ERROR RA TE CHECK 13-1. CD Error Rate Check Checking Procedur e : 1. Load a check disc (MD) TD YS-1. 2. Rotate the [AMS] knob and display “CPLA Y MODE” (C30). 3. Press the [YES] b utton twice and display “CPLA Y MID”.
– 31 – 16. ADJUSTING POINTS AND CONNECTING POINTS [BD BO ARD] (SIDE A) CN110 NO TE D101 I+3V IOP TE RF VC GND IC171 IC121 IC101 IC192 CN101 Note: It is useful to use the jig.
– 32 – 6-1. IC PIN FUNCTION DESCRIPTION SECTION 6 DIA GRAMS • BD BOARD IC101 CXA2523AR (RF AMP, FOCUS/TRACKING ERROR AMP) Pin No. Pin Name I/O Function 1I I I-V converted RF signal I input from the optical pick-up block detector 2J I I-V converted RF signal J input from the optical pick-up block detector 3V C O Middle point voltage (+1.
– 33 – • BD BOARD IC121 CXD2654R Pin No. Pin Name I/O Function 1 MNT0 (FOK) O Focus OK signal output to the system controller (IC800) “H” is output when focus is on (“L”: NG) 2 MNT1 (SHO.
– 34 – Pin No. Pin Name I/O Function 45 A09 O Address signal output to the D-RAM (IC124) 46 XRAS O Row address strobe signal output to the D-RAM (IC124) “L” active 47 XWE O Write enable signal.
– 35 – Pin No. Pin Name I/O Function 91 SRDR O Sled servo drive PWM signal (–) output to the BH6511FS (IC152) 92 SFDR O Sled servo drive PWM signal (+) output to the BH6511FS (IC152) 93 SPRD O S.
– 36 – • MAIN BOARD IC100 CXD8607N (A/D CONVERTER) Pin No. Pin Name I/O Function 1 INRP I R-ch analog signal (–) input terminal 2 INRM I R-ch analog signal (+) input terminal 3 REFI I Reference voltage (+3.
– 37 – Pin No. Pin Name I/O Function 40 AVDDL — Power supply terminal (+5V) (for L-ch side D/A converter section, analog system) Not used (open) 41 L1 O L-ch PLM signal 1 output terminal Not use.
– 38 – • MAIN BOARD IC800 M30610MCA-264FP (SYSTEM CONTROLLER) Pin No. Pin Name I/O Function 1 JOG1 I JOG dial pulse input from the rotary encoder (S713 ≠ AMS ± ) 2 JOG0 I JOG dial pulse input.
MDS-JB920 – 39 – – 40 – Pin No. Pin Name I/O Function 59 WR-PWR O Laser power select signal output to the CXD2654R (IC121) and HF module switch circuit “H”: recording mode, “L”: playba.
MDS-JB920 – 41 – – 42 – 6-2. BLOCK DIA GRAM – SER V O Section – F C B D A E I J J I B A C D E F DETECTOR 1 2 J I 4 5 6 7 A B C D 8 9 E F LD PD LASER DIODE ILCC PD OPTICAL PICK-UP (KMS-260A.
MDS-JB920 – 43 – – 44 – 6-3. BLOCK DIA GRAM – MAIN Section – 05 X200 45MHz LED DRIVE Q756 ROTARY ENCODER FL DRIVE Q781, 782 D756 STANDBY D758 MEGA CONTROL LED DRIVE Q758 72 74 A/D CONVERTE.
– 45 – – 46 – • Cir cuit Boards Location AC board SW board BAT board MAIN board VOL board DISP board BD board PSW board HP board Note on Schematic Diagram: • All capacitors are in µF unless otherwise noted. pF: µµF 50 WV or less are not indicated except for electrolytics and tantalums.
– 47 – – 48 – 6-5. PRINTED WIRING BO ARDS – BD Section – • See page 45 for Cir cuit Boards Location. • Semiconductor Location Ref. No. Location D101 A-1 D181 D-3 D183 D-3 IC103 B-1 IC171 D-1 Q102 B-1 Q103 B-1 Q104 B-1 • Semiconductor Location Ref.
MDS-JB920 – 49 – – 50 – 6-6. SCHEMA TIC DIA GRAM – BD Section (1/2) – • See pa ge 53 for Wa veforms. • See pa ge 70 and 71 for IC Block Diagrams.
MDS-JB920 – 51 – – 52 – 6-7. SCHEMA TIC DIA GRAM – BD Section (2/2) – • See page 53 for Wa veforms. • See pa ge 70 and 71 for IC Block Diagrams.
MDS-JB920 – 53 – – 54 – • W aveforms – BD board – 1 IC101 1 , 2 (I, J) (Play mode) 5 IC121 @¶ (LRCK) 2 IC101 4 (A) (Play mode) 3 IC101 8 , 9 (E, F) (Play mode) 4 IC121 !§ (OSI) 6 IC121 @• (XBCK) 7 IC121 @ª (FS256) 8 IC121 (º (FS4) 2 IC200 4 (LRCK) 3 IC200 @• (XOUT) 4 IC200 $£ (256FSO) 0.
MDS-JB920 – 55 – – 56 – 6-8. SCHEMA TIC DIA GRAM – MAIN Section (1/3) – • See pa ge 54 for W a veforms. • See page 72 and 73 f or IC Block Diagrams.
MDS-JB920 – 57 – – 58 – Note: • V oltages and w av eforms are dc with respect to ground in playback mode. no mark : PB ∗ : Impossible to measure The components identified by mark ! or dotted line with mark ! are critical for saf ety . Replace only with part number specified.
MDS-JB920 – 59 – – 60 – 6-10. SCHEMA TIC DIA GRAM – MAIN Section (3/3) – • See pa g e 53 and 54 f or Wa veforms. • See page 72 and 73 f or IC Block Diagrams. Note: • V oltages and w av eforms are dc with respect to ground in playback mode.
MDS-JB920 – 61 – – 62 – 6-11. PRINTED WIRING BO ARD – MAIN Boar d (side A) – • See page 45 for Cir cuit Boards Location..
MDS-JB920 – 63 – – 64 – Ref. No. Location • Semiconductor Location D100 J-4 D101 J-4 D102 I-3 D103 I-3 D400 F-6 D700 E-9 D701 E-9 D703 E-5 D704 E-5 D705 A-3 D706 B-4 D707 C-3 D708 C-3 D709 B.
MDS-JB920 – 65 – – 66 – 6-13. PRINTED WIRING BO ARDS – P ANEL Section – • See pa g e 45 for Circuit Boar ds Location. US, CND US, CND (P age 63) (Page 64) (Page 63) (P age 64) (P age 66).
MDS-JB920 – 67 – – 68 – 6-14. SCHEMA TIC DIA GRAM – P ANEL Section – • See page 54 for Wa veforms. Note: • V oltages and w av eforms are dc with respect to ground in playback mode.
MDS-JB920 – 69 – – 70 – 6-15. SCHEMA TIC DIA GRAM – BD SWITCH Section – 6-16. PRINTED WIRING BO ARD – BD SWITCH Section – • See page 45 for Cir cuit Boards Location.
– 71 – IC121 CXD2654R 100 99 98 97 96 95 94 93 EFMO DVSS TEST3 TEST2 TEST1 FGIN SPFD SPRD 92 SFDR 91 SRDR 90 FS4 89 FRDR 88 FFDR 87 DVDD 86 TFDR 85 TRDR 84 LDDR 83 APCREF 82 DTRF 81 CKRF 80 XLRF 7.
– 72 – – MAIN Boar d – IC100 CXD8607N 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 INRP INRM REFI AVDD AVSS APD NU NU TEST1 LRCK1 BCK1 ADDT V35A VSS1 (LF) MCKI DP.
– 73 – IC200 CXD8767N 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 INVI 128FsO TES.
– 74 – IC300 SN74HC153ANS 16 15 14 13 12 11 10 9 1 2 3 4 5 6 7 8 2G 2C3 2C2 2C1 2C0 2Y VCC 2C3 2C2 2C1 2C0 STROBE 2G OUTPUT 2Y A SELECT DATA INPUTS BB AA BB AA 1G 1C3 1C2 1C1 1C0 1Y STROBE 1G B SE.
– 75 – SECTION 7 EXPLODED VIEWS Les composants identifiés par une marque ! sont critiquens pour la sécurité. Ne les remplacer que par une pièce portant le numéro spécifié. The components identified by mark ! or dotted line with mark ! are critical for safety .
– 76 – Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark (2) FR ONT P ANEL SECTION 51 4-998-590-01 PANEL, FRONT (BLACK) 51 4-998-590-31 PANEL, FRONT (SIL VER) 52 4-942-568-41 EMBLEM (NO.
– 77 – Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark * 201 1-668-111-11 SW BOARD * 202 4-996-217-01 CHASSIS 203 4-996-223-01 INSULA TOR (F) (BLACK) * 204 4-996-218-01 B.
– 78 – Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark * 251 A-4699-893-A BD BOARD, COMPLETE 252 3-372-761-01 SCREW (M1.7), T APPING * 253 4-996-267-01 BASE (BU-D) * 254 .
– 79 – SECTION 8 ELECTRICAL P ARTS LIST NO TE: • Due to standardization, replacements in the parts list may be dif ferent from the parts speci- fied in the diagrams or the components used on the set. • -XX and -X mean standardized parts, so they may hav e some difference from the original one.
– 80 – Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark BD C168 1-163-038-00 CERAMIC CHIP 0.1uF 25V C169 1-125-822-21 T ANT ALUM 10uF 20% 10V C171 1-163-038-00 CERAMIC CHIP 0.1uF 25V C181 1-104-913-11 TANT AL. CHIP 100uF 20% 16V C183 1-163-038-00 CERAMIC CHIP 0.
– 81 – Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark BD DISP HP R173 1-216-121-00 RES,CHIP 1M 5% 1/10W R175 1-216-065-00 RES,CHIP 4.
– 82 – Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark HP MAIN C796 1-162-294-31 CERAMIC 0.001uF 10% 50V C797 1-164-159-11 CERAMIC 0.
– 83 – Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark MAIN C244 1-126-023-11 ELECT 100uF 20% 25V C245 1-126-023-11 ELECT 100uF 20% 25V C246 1-126-023-11 ELECT 100uF 20% 25V C247 1-136-154-00 FILM 0.012uF 5% 50V C248 1-136-154-00 FILM 0.
– 84 – Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark MAIN CN700 1-564-513-11 PLUG, CONNECTOR 10P CN800 1-770-649-11 CONNECTOR, FFC/FPC 21P CN801 1-691-765-11 PLUG (MICR.
– 85 – Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark R108 1-259-476-11 CARBON 100K 5% 1/6W R109 1-259-460-11 CARBON 22K 5% 1/6W R110 1-259-460-11 CARBON 22K 5% 1/6W R11.
– 86 – Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark R714 1-247-891-00 CARBON 330K 5% 1/4W R715 1-249-433-11 CARBON 22K 5% 1/4W R800 1-249-429-11 CARBON 10K 5% 1/4W R80.
– 87 – Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark S603 1-771-264-11 SWITCH, PUSH (CHUCKING IN) S604 1-771-264-11 SWITCH, PUSH (PB POSITION) ************************************************************** * 1-669-997-11 VOL BOARD ********** < CAP ACITOR > C765 1-162-294-31 CERAMIC 0.
– 88 – MDS-JB920 Sony Corporation Home A&V Products Compan y 9-922-869-11 98E0572-1 Printed in Japan © 1998. 5 Published by Quality Assurance Dept.
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Sony MDS-JB920を既にお持ちだが、まだ読んでいない場合は、上記の理由によりそれを行うべきです。そうすることにより機能を適切に使用しているか、又はSony MDS-JB920の不適切な取り扱いによりその寿命を短くする危険を犯していないかどうかを知ることができます。
ですが、ユーザガイドが果たす重要な役割の一つは、Sony MDS-JB920に関する問題の解決を支援することです。そこにはほとんどの場合、トラブルシューティング、すなわちSony MDS-JB920デバイスで最もよく起こりうる故障・不良とそれらの対処法についてのアドバイスを見つけることができるはずです。たとえ問題を解決できなかった場合でも、説明書にはカスタマー・サービスセンター又は最寄りのサービスセンターへの問い合わせ先等、次の対処法についての指示があるはずです。
